Disclosed are pre-cure RFID-enabled bead labels based on an RFID inlay construction consisting of an aluminum antenna etched on to a high temperature resistant polyimide film that is connected to an integrated memory circuit positioned on the surface of the polyimide film. This RFID inlay being further inserted into an overall label construction having a plurality of layers that include, for example, a plurality of polyester layers and a plurality of high temperature resistant adhesive layers that bond/adhere layers together, the plurality of layers further protecting and insulating the RFID inlay while the label is bonded to the external bead (or sidewall) of a tire. The compositions/devices disclosed herein can be used for electronic identification when applied on rubber-based articles (e.g., tires) prior to being subjected to stress related to the vulcanization process and normal use of this article during the manufacturing process.

The present invention discloses a polyimide film for metal lamination, which is obtained by providing at least one surface of a heat-resistant polyimide layer with a metal bonding layer. This polyimide film has a 5% weight loss temperature of 500° C. or higher in a nitrogen atmosphere, while having a dielectric loss tangent of 0.007 or less at a frequency of 11.4 GHz. It is preferable that the metal bonding layer is formed of a thermally fusible polyimide, or is formed of a heat-resistant polyimide and a silane coupling agent. The present invention also discloses a polyimide metal laminate which is obtained by additionally laminating a metal layer on a surface of the above-described polyimide film for metal lamination, said surface having been provided with the metal bonding layer.

A method for manufacturing a semiconductor device according to the present invention includes at least the following three steps: (A) a step of preparing a first structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and a first semiconductor component (60) adhered to the adhesive resin layer (30) and having a first terminal (65); (B) a step of performing solder reflow processing on the first structure (100) in a state where the first semiconductor component (60) is adhered to the adhesive resin layer (30); and (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50).

The present invention provides a flame-retardant pressure-sensitive adhesive, comprising reaction products of the following reaction compositions based a total weight of the reaction compositions as 100 wt. %: 35-99 wt. % of a (meth)acrylate copolymer containing a functional reactive functional group, the functional reactive functional group comprising one or a plurality of the following groups: carboxyl group, hydroxyl group and epoxy group; the (meth)acrylate copolymer containing the functional reactive functional group being formed by free radical polymerization of one or a plurality of monomers; and 1-65 wt. % of a reactive organophosphorus flame retardant capable of reacting with the functional reactive functional group, the reactive organophosphorus flame retardant being formed by reaction of reaction components comprising the following substances: a compound or oligomer containing n epoxy groups, wherein n>=2, and 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide. The flame-retardant pressure-sensitive adhesive meets the halogen-free flame retardant requirements of the UL94V0 standard, and possesses high peel strength and high-temperature static shear strength.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.

Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

The present invention provides a window film, a manufacturing method thereof, and a display device including the same. The window film comprises: a basic material layer; a window coating layer formed on one surface of the basic material layer; and a back coating layer formed on the other surface of the basic material layer, wherein the window film has a relation of formula 1.

A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.

Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.

The present disclosure relates generally to a double-sided adhesive tape having improved impact strength for a display device. More particularly, the double-sided adhesive tape includes a base layer, a foam adhesive layer formed on one surface of the base layer and made of acrylic foam, and an adhesive layer formed on the other surface of the base layer. The double-sided adhesive tape having improved impact strength for the display device having the above structure in which the foam adhesive layer having excellent impact strength is formed, thereby suppressing occurrence of cracking on a glass surface of the display device due to external impacts and exhibiting an excellent waterproofing effect.

Provided are a foldable back plate film and a method of manufacturing the same.