C09J2479/086

ADHESIVE FILM AND FLEXIBLE PRINTED CIRCUIT BOARD
20210163790 · 2021-06-03 · ·

An adhesive film includes: a resin film layer; and an adhesive layer laminated to the resin film layer, in which the adhesive layer includes an adhesive agent, the adhesive layer is in a B stage state, an oxygen transmission rate at 200° C. of the resin film layer, measured in accordance with JIS K7126-1, is 1.50×10.sup.−10 cc.Math.cm/cm.sup.2.Math.sec.Math.cmHg or less, and a 3% thermal weight reduction temperature of the adhesive agent is 320° C. or higher.

MATERIAL FOR PRINTED CIRCUIT BOARD, METAL LAMINATE, METHODS FOR PRODUCING THEM, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD
20210040252 · 2021-02-11 · ·

A material for a printed circuit board, which is a film composed of a fluorinated resin layer, where the fluorinated resin layer contains a composition containing a fluorinated copolymer having at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, has a melt flow rate of at most 15 g/10 min measured at 372 C. under a load of 49N, and has a storage elastic modulus of at least 650 MPa.

Adhesive composition, and coverlay film, flexible copper clad laminate, and adhesive sheet using adhesive composition

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance. The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

FOLDABLE BACKPLATE, METHOD FOR MANUFACTURING FOLDABLE BACKPLATE, AND FOLDABLE DISPLAY DEVICE COMPRISING SAME
20210065591 · 2021-03-04 · ·

Provided are a foldable back plate, a method of manufacturing the same and a foldable display device comprising the same.

Thermal-curable adhesive composition and adhesive sheet
10947417 · 2021-03-16 · ·

The instant disclosure provides a thermal-curable adhesive composition and adhesive sheet. The thermal-curable adhesive composition has a rate of change of adhesion ranging from 80% to 98% and defined by the following equation: V=[(V0V1)/V0]100, wherein V is the rate of change of adhesion of the thermal-curable adhesive composition, V0 is the adhesion of the thermal-curable adhesive composition under room temperature, and V1 is the adhesion of the thermal-curable adhesive composition after being heated to a predetermined temperature then cooled to the room temperature.

DISPLAY DEVICE AND OPTICALLY CLEAR ADHESIVE
20210031491 · 2021-02-04 · ·

The present disclosure discloses an optical clear adhesive and a display device. The display device includes: a flexible display panel having at least one foldable area; and an optical clear adhesive disposed on at least one side of the flexible display panel. The optical clear adhesive includes: a substrate layer, a first adhesive material structure and a second adhesive material structure disposed on two opposite sides of the substrate layer, all of which are transparent materials; a deformation recovery rate of the substrate layer is greater than that of each of the first adhesive material structure and the second adhesive material structure; and in the optical clear adhesive, the first adhesive material structure is closer to an inner folding side of the foldable area of a display panel, and the second adhesive material structure is closer to an outer folding side of the foldable area of the display panel.

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATIONMOLDING, LEAD FRAME PROVIDED WITH TEMPORARY PROTECTIVE FILM, ENCAPSULATED MOLDED BODY PROVIDED WITH TEMPORARY PROTECTIVEFILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
20210020460 · 2021-01-21 ·

Disclosed is a temporary protective film for semiconductor sealing molding comprising: a support film; and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent, and the content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

BATTERY AND METHOD OF MANUFACTURING BATTERY
20210005919 · 2021-01-07 ·

A battery (2) comprising a pressure sensitive adhesive sheet (1) and an electrolyte solution, wherein: the pressure sensitive adhesive sheet is provided at a site in the battery in which there is a possibility of contact with the electrolyte solution; the pressure sensitive adhesive sheet comprises a base material (11) and a pressure sensitive adhesive layer (13) laminated at one side of the base material; and the pressure sensitive adhesive layer (13) is formed of a pressure sensitive adhesive composition comprising: a (meth)acrylic ester polymer having a main chain containing (meth)acrylic alkyl ester monomer units having a carbon number of an alkyl group of 6 or more and 20 or less, and carboxy group-containing monomer units, wherein the (meth)acrylic alkyl ester monomer units having a carbon number of an alkyl group of 6 or more and 20 or less contain 2-ethylhexyl (meth)acrylates and (meth)acrylic alkyl ester monomer units having a carbon number of an alkyl group of 10 or more and 20 or less.

Adhesive layer-equipped laminate, and flexible copper-clad laminate sheet and flexible flat cable using same
10875283 · 2020-12-29 · ·

A laminate having an adhesive layer, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and also providing a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in B stage, and which is excellent in storage stability of the laminate. The laminate having an adhesive layer includes a base film and an adhesive layer formed on at least one of the surfaces of the base film, in which the adhesive layer is formed of an adhesive composition comprising a carboxyl group-containing styrene based elastomer and an epoxy resin, wherein the content of the carboxyl group-containing styrene based elastomer is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing styrene based elastomer; and the adhesive layer is in B-stage.

Stretch releasing adhesive assembly, housing assembly and mobile terminal

The present disclosure provides a stretch releasing adhesive assembly, a housing assembly, and a mobile terminal. The stretch releasing adhesive assembly includes: a stretch releasing adhesive layer, having a pull portion at an end of the stretch releasing adhesive layer; and a first pull layer, the first pull layer and the pull portion being superposed and connected, the first pull layer being provided with at least one tear line in a position corresponding to the pull portion.