The present invention relates to a tension attenuating hypertrophic scar reduction film, and more particularly, the tension attenuating hypertrophic scar reduction film that prevents the opening of the wound by tension by distributing or removing the tension transmitted to the wound by attaching the film of different thickness or asymmetric size to the wound where the tension is applied.

A medicinal product (10) is for the care of an individual having at least one injury such as a burn wound or a skin abrasion, in particular with a large surface area. The product includes at least one functional surface (12, 12, 14) to at least partially cover the injury and/or to fix the medicinal product (10) to the individual. At least one functional surface (12, 12) includes stem parts (18) protruding from the surface. The free end-faces of the stem parts form an adhesion section able to adhere at least partially to the individual and/or to a further functional surface (12), predominantly by Van der Waals forces.

Methods and compositions for securing to and removing adhesive tapes from substrates, e.g., delicate substrates such as skin, are described. The methods include providing an adhesive tape comprising an adhesive layer and a support layer in contact with the adhesive layer. A first adhesion level between the adhesive layer and the support layer is, or can be controlled to be, less than a second adhesion level between the adhesive layer and the substrate. The methods further include applying the adhesive tape to the substrate by contacting the adhesive layer to the substrate while the support layer remains in contact with the adhesive layer; and removing the support layer from the substrate by separating the support layer from the adhesive layer.

Methods and compositions for securing to and removing adhesive tapes from substrates, e.g., delicate substrates such as skin, are described. The methods include providing an adhesive tape comprising an adhesive layer and a support layer in contact with the adhesive layer. A first adhesion level between the adhesive layer and the support layer is, or can be controlled to be, less than a second adhesion level between the adhesive layer and the substrate. The methods further include applying the adhesive tape to the substrate by contacting the adhesive layer to the substrate while the support layer remains in contact with the adhesive layer; and removing the support layer from the substrate by separating the support layer from the adhesive layer.