Techniques are described for providing a therapeutic pseudo-constant DC current in an implantable stimulator using pulses whose positive and negative phases are not charge balanced. Such charge imbalanced pulses act to charge any capacitance in the current path between selected electrode nodes, such as the DC-blocking capacitors and/or any inherent capacitance such as those present at the electrode/tissue interface. These charged capacitances act during quiet periods between the pulses to induce a pseudo-constant DC current. Beneficially, these DC currents can be small enough to stay within charge density limits and hence not corrode the electrode or cause tissue damage, and further can be controlled to stay within such limits or for other reasons. Graphical user interface (GUI) aspects for generating the charge imbalanced pulses and for determining and/or controlling the pseudo-constant DC current are also provided.

An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

An EMI filtering, coaxial power connector may be formed as an inline component or a port of a device. The connector may have dimensions to accept F-type coaxial connectors. The connector includes a conductive outer shell with a first opening and a second opening. A dielectric member is disposed within the shell. A conductive pin is supported by the dielectric member. A feed-through capacitor has a central opening and a first lead formed within the central opening. The pin is electrically connected to the first lead. A second lead of the capacitor is formed at an outer perimeter of the capacitor and is electrically connected to the shell. A metal plate is mounted within the shell. The plate is disk-shaped with a central hole. An outer perimeter of the plate is in electrical contact with the shell. The pin passes through the central hole without making electrical contact with the plate, and the plate resides between the second opening of the shell and the capacitor.

Disclosed herein is an implantable electronic device. In one embodiment, the device has a modular header-feedthru assembly and a housing. The modular header-feedthru assembly has a conductor assembly, a feedthru coupled to the conductor assembly, and a polymer header that is injected molded about the conductor assembly and at least a portion of the feedthru. The housing is welded to the feedthru.

A feedthrough component includes a feedthrough ferrule including a ferrule body extending from a proximal end to a distal end along a longitudinal axis of the feedthrough ferrule and a ferrule passageway extending through the ferrule body and defined by a plurality of sidewalls. The ferrule passageway includes a proximal passage portion defined by one or more proximal sidewalls of the plurality of sidewalls and extending along the longitudinal axis, a distal passage portion defined by one or more distal sidewalls and extending along the longitudinal axis, and a beveled ledge disposed between the proximal passage portion and the distal passage portion and extending from the one or more distal sidewalls toward the longitudinal axis of the feedthrough ferrule. The beveled ledge includes a beveled surface extending toward the longitudinal axis, where a normal to the beveled surface intersects the longitudinal axis.

Implantable medical devices have modular lead bores that are constructed from individual lead bore modules. A given modular lead bore utilizes the number of individual lead bore modules necessary for the particular implantable medical device. Each lead bore module has a lead bore passageway and a feedthrough passageway. An electrical contact is present within the lead bore passageway of each lead bore module and the electrical contact is aligned to the lead bore passageway of a lead bore module. Hermetic feedthrough assemblies are also present within the lead bore passageway of each lead bore module. A feedthrough pin passes through a hermetic feedthrough assembly within a feedthrough passageway of each lead bore module. Each feedthrough pin is electrically coupled to a corresponding electrical contact and the medical device circuitry.

On example provides a ferrule for an implantable medical device including a first frame body having a first perimeter surface to make a brazed connection to a first medical device component, and a second frame body having a first perimeter surface to make a welded connection to a second medical device component. A spacer flange connects a second perimeter surface of the first frame body to a second perimeter surface of the second frame body, a thickness between a top surface and bottom of the spacer flange being less than a thickness between a top surface and a bottom surface of the first frame body such that the spacer flange is to deflect relative to the first frame body in response to forces being applied to the second frame body so as to reduce transmission of weld strain from the second frame body to the first frame body.

An implantable medical device, battery and method include memory configured to store program instructions. At least one of circuitry or a processor are configured to execute the program instructions in connection with at least one of monitoring a biological signal or administering a therapy. The device includes a battery comprising a cell stack that includes an anode, a cathode, and one or more separator layers electrically insulating the anode from the cathode. The device includes a case having a feedthrough port and a feedthrough assembly disposed in the feedthrough port. The feedthrough assembly includes a ferrule having a lumen. An inner conductor is disposed within the lumen of the ferrule. The inner conductor is formed from a material having a first composition and a first coefficient of thermal expansion (CTE). An insulating core is disposed within the lumen of the ferrule and separates the inner conductor from the ferrule. The insulating core is formed from a material having a second composition and a second CTE. The first CTE of the inner conductor is equal to or greater than the second CTE of the insulating core and the first and second compositions are molecularly bonded with one another to form a hermetic seal between the inner conductor and the insulating core.

Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

A method for manufacturing a ceramic substrate by a 3D-printing process is described. The method comprises operating a 3D-printer to print a green-state ceramic body having a height extending to spaced apart first and second end surfaces and at least one via extending at least part-way along the height of the green-state ceramic body from the first end surface toward the second end surface. Then, the green-state ceramic body is sintered to provide the ceramic substrate with the at least one via. In cross-section, the at least one via has a square-shaped via with rounded corners.