Patent classifications
A61N1/3758
THERMAL TRANSFER SYSTEM AND METHOD
Disclosed is a system for recharging a selected power source wirelessly, such as through a power transmission. The power source may be positioned within a subject and be charged wirelessly through the subject, such as tissue of the subject. A thermal transfer system is provided to transfer or transport thermal energy from a first position to a second position, such as away from the subject.
Biostimulator Circuit with Flying Cell
A leadless cardiac pacemaker is provided which can include any number of features. In one embodiment, the pacemaker can include a tip electrode, pacing electronics disposed on a p-type substrate in an electronics housing, the pacing electronics being electrically connected to the tip electrode, an energy source disposed in a cell housing, the energy source comprising a negative terminal electrically connected to the cell housing and a positive terminal electrically connected to the pacing electronics, wherein the pacing electronics are configured to drive the tip electrode negative with respect to the cell housing during a stimulation pulse. The pacemaker advantageously allows p-type pacing electronics to drive a tip electrode negative with respect to the can electrode when the can electrode is directly connected to a negative terminal of the cell. Methods of use are also provided.
LOW EQUIVALENT SERIES RESISTANCE RF FILTER FOR AN AIMD
An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.
Stretchable Encapsulation Material with High Dynamic Water Resistivity and Tissue-Matching Elasticity
An encapsulation for an implantable medical device is provided defined by a blend of high molecular weight polyisobutylene and low molecular weight polyisobutylene solution to provide desirable stretchability and elastic properties without sacrificing water resistance properties of the encapsulation. The encapsulation material is flexible thus allowing the medical device to possess tissue matching flexibility and retain long-term normal function free from liquid infiltration.
Implantable wireless acoustic stimulators with high energy conversion efficiencies
A controller-transmitter transmits acoustic energy through the body to an implanted acoustic receiver-stimulator. The receiver-stimulator converts the acoustic energy into electrical energy and delivers the electrical energy to tissue using an electrode assembly. The receiver-stimulator limits the output voltage delivered to the tissue to a predetermined maximum output voltage. In the presence of interfering acoustic energy sources output voltages are thereby limited prior to being delivered to the tissue.
IMD having a core circuitry support structure
A medical device includes a hybrid circuitry assembly and a core circuitry support structure. The core circuitry support structure includes a frame defining a cavity configured to receive at least a portion of the hybrid circuitry assembly. An outer surface of the frame is shaped to correspond to an inside surface of a core assembly housing configured to enclose the hybrid circuitry assembly and the core circuitry support structure.
HEAD PART OF AN IMPLANTABLE DEVICE, METHOD FOR PRODUCING THE HEAD PART AS WELL AS A PLUG ASSEMBLY WHICH CAN BE FITTED INTO THE HEAD PART
The invention is a head part of an implantable device, method of production thereof and a plug which can be fitted into the head part. The head part comprises a housing which has at least one blind hole plug contact socket with a socket opening as well as a socket base axially opposite the socket opening, along which at least one electrically conductive contact ring element and an electrically insulating, elastically deformable sealing ring, which are enclosed by a solidified casting compound, are joined together coaxially axially. Arranged within the head part is at least one second blind hole plug contact socket with a socket opening as a socket base axially opposite the socket opening, along which at least one electrically conductive contact ring element and an electrically insulating, elastically deformable sealing ring is located, which are enclosed by the solidified casting compound, are joined together in a coaxial arrangement and in an axially serial sequence.
HEADER FOR A NEUROSTIMULATOR
An implantable pulse generator (IPG) including a case containing an energy storage device and one or more electrode leads. A header is coupled to the case. The header includes a cassette, an antenna coupled to the cassette and electrically coupled to the case, the case configured as a part of the antenna for receiving and transmitting electromagnetic signals, and an electrode attachment structure configured to couple with the cassette and configured to couple with the one or more electrode leads.
ECA oxide-resistant connection to a hermetic seal ferrule for an active implantable medical device
A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimide, or a thermal-setting electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.
Adapter assemblies for implantable medical electrical systems
Casings for retaining adapter connector modules and implantable electrical devices, and adapter assemblies for retaining implantable medical devices, include first and second opposing plates spaced apart by a gap configured to retain the devices such that sides of the devices are in confronting engagement with the first and second plates when placed the device is held in the gap. The first and second plates may be biased towards one another to assist in retaining the device in the gap. The device and adapter connector module may be arranged such that their thicknesses do not overlap. For example, the device and adapter connector module may be arranged such that a bottom perimeter edge of the adapter connector module abuts or is spaced apart from a top perimeter edge of the device.