Patent classifications
B01D1/12
Evaporation apparatus and method
The present invention relates to evaporation apparatus (100) comprising manifolds provided with at least one nozzle (102), a tank unit (103) for a liquid, and a sample holder configured to be inserted into the tank unit. The sample holder is configured to hold at least one sample in a defined position relative the at least one nozzle a control unit (104) an inlet port (105) configured to be connected to a gas supply, a pressure regulator (106) arranged downstream the inlet port (105). A set value of the pressure regulator (106) is controlled by the control unit (104), a control valve (107) arranged downstream the pressure regulator (106), wherein each of the at least one manifold (101a-d) is connected to a corresponding output port of the control valve. The control valve is controlled by the control unit (104), and the control unit is configured to set the set value of the pressure regulator to a value that causes a predetermined gas flow from each of the at least one nozzle.
Evaporation apparatus and method
The present invention relates to evaporation apparatus (100) comprising manifolds provided with at least one nozzle (102), a tank unit (103) for a liquid, and a sample holder configured to be inserted into the tank unit. The sample holder is configured to hold at least one sample in a defined position relative the at least one nozzle a control unit (104) an inlet port (105) configured to be connected to a gas supply, a pressure regulator (106) arranged downstream the inlet port (105). A set value of the pressure regulator (106) is controlled by the control unit (104), a control valve (107) arranged downstream the pressure regulator (106), wherein each of the at least one manifold (101a-d) is connected to a corresponding output port of the control valve. The control valve is controlled by the control unit (104), and the control unit is configured to set the set value of the pressure regulator to a value that causes a predetermined gas flow from each of the at least one nozzle.
Systems and methods for shielded inductive devices
In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
Systems and methods for shielded inductive devices
In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES
In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES
In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
Systems and methods for shielded inductive devices
In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
Systems and methods for shielded inductive devices
In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES
In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES
In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.