A diffusive air purifier includes an air permeable container containing a chemical sorbent or a sorbent precursor. The sorbent has a chemical composition selected to achieve removal of an air pollutant via a chemical reaction that renders the predetermined air pollutant immobile. A method of manufacturing the diffusive air purifier includes impregnating a porous solid with a solution of sorbent precursor and a binding agent and drying the porous solid. A method of purifying indoor air includes detecting a measured concentration of an airborne chemical in an enclosed location; selecting the diffusive air purifier to adsorb the airborne chemical; and placing the diffusive air purifier in the enclosed location. Air diffuses through the outer container and into the sorbent where the chemical to be removed is retained. Air, free of the target chemical, diffuses out of the container and the process repeats.

Provided is an apparatus for treating waste gas of the electronics industry, and the apparatus includes: a reaction chamber in which an inlet and an outlet are formed and an inner space for purifying waste gas is formed; a first partition plate extending from an inner wall of the reaction chamber facing the inlet in a direction toward the inlet, dividing the inner space into a pre-treatment zone for collecting dust in the waste gas and a remaining purification zone; a second partition plate extending vertically downward from a ceiling of the reaction chamber, dividing the purification zone into a thermal decomposition zone for heating and thermally decomposing waste gas and a post-treatment zone; and a heater installed at the ceiling of the reaction chamber so as to be located in the thermal decomposition zone to thermally decompose a perfluorinated compound by heating waste gas introduced into the thermal decomposition zone; and a dry scrubber unit including one or more catalysts to collect at least one of the dust, a fluorine compound, and nitrous oxide (N2O) in waste gas introduced into the post-treatment zone.

Provided is an apparatus for treating waste gas of the electronics industry, and the apparatus includes: a reaction chamber in which an inlet and an outlet are formed and an inner space for purifying waste gas is formed; a first partition plate extending from an inner wall of the reaction chamber facing the inlet in a direction toward the inlet, dividing the inner space into a pre-treatment zone for collecting dust in the waste gas and a remaining purification zone; a second partition plate extending vertically downward from a ceiling of the reaction chamber, dividing the purification zone into a thermal decomposition zone for heating and thermally decomposing waste gas and a post-treatment zone; and a heater installed at the ceiling of the reaction chamber so as to be located in the thermal decomposition zone to thermally decompose a perfluorinated compound by heating waste gas introduced into the thermal decomposition zone; and a dry scrubber unit including one or more catalysts to collect at least one of the dust, a fluorine compound, and nitrous oxide (N2O) in waste gas introduced into the post-treatment zone.

A method of optimising operating conditions in an abatement apparatus configured to treat an effluent stream from a processing tool and an abatement apparatus are disclosed. The method of optimising operating conditions in an abatement apparatus configured to treat an effluent stream containing PFC from a processing tool comprise: changing an operating parameter which controls an operating condition of the abatement apparatus; determining a change in a PFC concentration present in an exhaust stream of the abatement apparatus; and determining whether to retain the operating parameter based on the change in the PFC concentration. In this way, the concentration of PFC present in the exhaust can be used to determine whether the abatement apparatus is operating under the correct operating conditions or not.

Novel methods for pretreating a rare-gas-containing stream exiting an etch chamber followed by recovering the rare gas from the pre-treated, rare-gas containing stream are disclosed. More particularly, the invention relates to the pretreatment and recovery of a rare gas, such as xenon or krypton, from a nitrogen-based exhaust stream with specific gaseous impurities generated during an etch process that is performed as part of a semiconductor fabrication process.

Cavitand compositions that comprise void spaces are disclosed. The void spaces may be empty, which means that voids are free of guest molecules or atoms, or the void spaces may comprise guest molecules or atoms that are normally in their gas phase at standard temperature and pressure. These cavitands may be useful for industrial applications, such as the separation or storage of gasses. Novel cavitand compounds are also disclosed.

A system and process for the recovery of at least one halogenated hydrocarbon from a gas stream. The recovery includes adsorption by exposing the gas stream to an adsorbent with a lattice structure having pore diameters with an average pore opening of between about 5 and about 50 angstroms. The adsorbent is then regenerated by exposing the adsorbent to a purge gas under conditions which efficiently desorb the at least one adsorbed halogenated hydrocarbon from the adsorbent. The at least one halogenated hydrocarbon (and impurities or reaction products) can be condensed from the purge gas and subjected to fractional distillation to provide a recovered halogenated hydrocarbon.

Novel methods for pretreating a rare-gas-containing stream exiting an etch chamber followed by recovering the rare gas from the pre-treated, rare-gas containing stream are disclosed. More particularly, the invention relates to the pretreatment and recovery of a rare gas, such as xenon or krypton, from a nitrogen-based exhaust stream with specific gaseous impurities generated during an etch process that is performed as part of a semiconductor fabrication process.

A method of delivering or sequestering anesthetic agents by adsorption of such agents by porous partially fluorinated compounds which display high weight adsorption capacities.

A process gas suction structure for preventing a generation of products from a process gas due to a temperature drop is disclosed. The process gas suction structure includes a double tube structure, and a heating device configured to heat the double tube structure. The double tube structure includes a process-gas flow passage portion where the process gas flows, and a partition portion arranged outside of the process-gas flow passage portion.