Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.

Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.

Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.

Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.

Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.

Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.

The method of the present invention receives a mixture. The method then separates clay and metal within in the mixture. The method then treats pollutants or toxins within in the mixture with magnetic beads. The method then treats the pollutants or toxins using nano-bubbles generated by a 3-in-1 bubble generator. Further, the method screens and classifies the tiny particles within in the mixture based on magnetic separation. Next the method screens and classifies the tiny particles within in the mixture based on gravity separation. The gravity separation includes an anti-leakage net underneath the grinding system. The anti-leakage net avoids loss and collects and resets the leakage into a feeding port connected to the gravitational device. Furthermore, the method screens and classifies the tiny particles within in the mixture based on floatation. Finally, the method collects the target element and rare earth elements (REE).

The method of the present invention receives a mixture. The method then separates clay and metal within in the mixture. The method then treats pollutants or toxins within in the mixture with magnetic beads. The method then treats the pollutants or toxins using nano-bubbles generated by a 3-in-1 bubble generator. Further, the method screens and classifies the tiny particles within in the mixture based on magnetic separation. Next the method screens and classifies the tiny particles within in the mixture based on gravity separation. The gravity separation includes an anti-leakage net underneath the grinding system. The anti-leakage net avoids loss and collects and resets the leakage into a feeding port connected to the gravitational device. Furthermore, the method screens and classifies the tiny particles within in the mixture based on floatation. Finally, the method collects the target element and rare earth elements (REE).

A modified selective recirculation circuit has a loading stage, a stripping stage and a filtering stage for use in processing a feed stream or slurry containing mineral particles. The stripping stage forms a first loop with the loading stage, a second loop with the filtering stage. The loading stage has a loading mixer and a loading washing screen. The stripping stage has a stripping mixer and a stripping washing screen. The loading mixer receives the slurry and causes barren media in the circuit to contact with the slurry so that the mineral particles in the slurry are loaded onto the barren media. The media is directed to the stripping stage where the mineral particles are removed from the media. The barren media is recycled to the loading stage. The stripping solution recovered from the filtering stage is returned to the stripping stage and the mineral particles are discharged as concentrate.

A modified selective recirculation circuit has a loading stage, a stripping stage and a filtering stage for use in processing a feed stream or slurry containing mineral particles. The stripping stage forms a first loop with the loading stage, a second loop with the filtering stage. The loading stage has a loading mixer and a loading washing screen. The stripping stage has a stripping mixer and a stripping washing screen. The loading mixer receives the slurry and causes barren media in the circuit to contact with the slurry so that the mineral particles in the slurry are loaded onto the barren media. The media is directed to the stripping stage where the mineral particles are removed from the media. The barren media is recycled to the loading stage. The stripping solution recovered from the filtering stage is returned to the stripping stage and the mineral particles are discharged as concentrate.