A method for manufacturing a water resistant substrate comprises a first step of providing a substrate. The method proceeds with a step of populating at least one component onto the substrate. Next, the method includes a step of cleaning the substrate including the at least one component to form a cleaned substrate. Then, the method proceeds with depositing a multi-layered water resistant coating onto the cleaned substrate.

The disclosure relates to methods for direct ink jet printing of printed circuits' infrastructure. Specifically, the disclosure relates to methods for direct inkjet printing of heatdissipation elements and sockets for use in printed circuit boards (PCBs), flexible printed circuits (FPCs) and high-density interconnect (HDI) printed circuits.

Methods for producing layered structures that include a conductive polymeric layer and a dielectric polymeric layer. The dielectric polymeric layer can be formed by curing a first volume of a dielectric polymeric material. A second volume of the dielectric polymeric material is doped with conductive particulates to yield a conductive polymeric material, which is then partially cured and solvated to create a conductive polymeric paste. The paste is applied to a surface of the dielectric polymeric layer, dried, and cured to form a conductive polymeric layer on the pre-strained dielectric polymeric layer yielding a layered structure that includes the conductive polymeric layer and the dielectric polymeric layer. A pre-strain is induced in the dielectric polymeric material by contacting a chemical thereto that causes swelling therein.

The invention includes a method for preparing and top coating an item made of powder coated MDF (or other substrate containing wood) with the end result of improved visual and tactile smoothness; the invention includes the steps of cutting and machining the part, pre-powder preparation and sanding of the part, powder coating the part, post-powder preparation and sanding, and applying the liquid top coat to the part, resulting in a smoother finish than is currently available in any other powder coated MDF finish while requiring less coats than similar liquid paint finishes.

Self-healable, omniphobic coatings and related methods are provided. In embodiments, a self-healable, omniphobic coating comprises a matrix of crosslinked, entangled hydrogel polymers, the hydrogel polymers comprising hydroxyl (OH) groups, hydroxyl group precursors, or both, and nanoparticles distributed throughout the matrix; and fluorinated silane molecules covalently bound to the matrix.

A method for manufacturing a semiconductor device includes forming a first pattern structure having a first opening on a lower structure comprising a semiconductor substrate. The first pattern structure includes a stacked pattern and a first spacer layer covering at least a side surface of the stacked pattern. A first flowable material layer including a SiOCH material is formed on the first spacer layer to fill the first opening and cover an upper portion of the first pattern structure. A first curing process including supplying a gaseous ammonia catalyst into the first flowable material layer is performed on the first flowable material layer to form a first cured material layer that includes water. A second curing process is performed on the first cured material layer to form a first low-k dielectric material layer. The first low-k dielectric material layer is planarized to form a planarized first low-k dielectric material layer.

A curing device delivers localized curing energy along a pattern of curable material printed over a substrate. A curing head of the device can emit a column of curing energy along an emission axis and toward a substrate carrying the pattern of curable material, and a movement system provides relative movement between the curing head and the substrate so that the column of curing energy is guided along the pattern. Localized delivery of the curing energy enables printing and curing of printed materials on low temperature substrates such as thermoplastics.

Methods for producing layered structures that include a conductive polymeric layer and a dielectric polymeric layer. The dielectric polymeric layer can be formed by curing a first volume of a dielectric polymeric material. A second volume of the dielectric polymeric material is doped with conductive particulates to yield a conductive polymeric material, which is then partially cured and solvated to create a conductive polymeric paste. The paste is applied to a surface of the dielectric polymeric layer, dried, and cured to form a conductive polymeric layer on the pre-strained dielectric polymeric layer yielding a layered structure that includes the conductive polymeric layer and the dielectric polymeric layer. A pre-strain is induced in the dielectric polymeric material by contacting a chemical thereto that causes swelling therein.

The invention includes a method for preparing and top coating an item made of powder coated MDF (or other substrate containing wood) with the end result of improved visual and tactile smoothness; the invention includes the steps of cutting and machining the part, pre-powder preparation and sanding of the part, powder coating the part, post-powder preparation and sanding, and applying the liquid top coat to the part, resulting in a smoother finish than is currently available in any other powder coated MDF finish while requiring less coats than similar liquid paint finishes.

To provide a new silicon-containing polymer making it possible to form a cured film has features that its residual stress is small and crack resistance is high. A polycarbosilazane having particular cyclic structures.