B05D3/046

Method for manufacturing a semiconductor device including a low-k dielectric material layer

A method for manufacturing a semiconductor device includes forming a first pattern structure having a first opening on a lower structure comprising a semiconductor substrate. The first pattern structure includes a stacked pattern and a first spacer layer covering at least a side surface of the stacked pattern. A first flowable material layer including a SiOCH material is formed on the first spacer layer to fill the first opening and cover an upper portion of the first pattern structure. A first curing process including supplying a gaseous ammonia catalyst into the first flowable material layer is performed on the first flowable material layer to form a first cured material layer that includes water. A second curing process is performed on the first cured material layer to form a first low-k dielectric material layer. The first low-k dielectric material layer is planarized to form a planarized first low-k dielectric material layer.

SUBSTRATE TREATING METHOD AND APPARATUS USED THEREFOR
20230107142 · 2023-04-06 ·

Provided is a substrate treating method for drying a substrate on which a pattern is formed. The method includes: a solidified film forming liquid supplying step, an entire surface coating step, a solidified film forming step, and a sublimation step. The entire surface coating step causes the substrate to rotate at a number of rotations for solidified film formation in accordance with a relationship among a concentration of a sublimable substance, a target solidified film thickness as a desired film thickness of a solidified film, and the number of rotations for solidified film formation as a number of rotations of the substrate for forming the solidified film of the target solidified film thickness when the concentration of the sublimable substance is a predetermined concentration.

Process for producing thin coatings on film

Conventional atomic layer deposition technology is modified to increase its cost-effective viability for use in producing thinly coated flexible packaging film. In one embodiment a thinly coated flexible substrate, e.g., a polyolefin film, is made by a process comprising the steps of: (A) Dissolving a self-limiting precursor in a solvent to form a solution of dissolved self-limiting precursor in the solvent, (B) Applying the solution to a facial surface of a flexible polymer film so that at least a portion of the dissolved self-limiting precursor attaches to the facial surface of the film and the solution is at least partially depleted of self-limiting precursor, and (C) Curing the attached self-limiting precursor by contact with oxygen.

Method for coating a substrate with a lacquer and device for planarising a lacquer layer

The disclosure relates to a method for coating a substrate with a lacquer. First, the lacquer is uniformly applied to the substrate. Then, the solvent proportion of the lacquer applied to the substrate is reduced, and the coated substrate is exposed to a solvent atmosphere. In some embodiments, the lacquer is heated. The invention also relates to a device for planarising a lacquer layer.

METHOD FOR PREPARING POROUS POLYMER FILM HAVING CONTROLLED PORE DEPTH, AND POROUS POLYMER FILM PREPARED THEREBY

The present invention relates to a method for preparing a porous polymer film having a controlled pore depth, and a porous polymer film prepared thereby. A method for preparing a porous polymer film according to the present invention allows the pore depth of a porous film to be controlled simply and at a low cost, and thus allows adjustment of the light reflectance of the prepared film. A large-area film can be prepared by means of a simple method and thus can be applied to various industry fields. Films having different reflectance can be prepared and thus can be applied as low-reflection and high-reflection films for solar cells, and also as a low-reflection or high-reflection thin polymer film in the construction field or material and equipment field.

Can inner surface coating method

A coating method includes a first step for spraying, onto an inner area of an opening part of a cylindrical body having a bottom and arranged horizontally, a first coating material of synthetic resin containing non-volatile components while rotating the cylindrical body around a central axis thereof. After the first step, a second step is performed for spraying, onto an inner area of a barrel part of the cylindrical body, a second coating material of synthetic resin containing a lower proportion of non-volatile components than that of the first coating material while continuing to rotate the cylindrical body. After the second step is performed and before the volatile components of the second coating material vaporizes, a third step is performed in which the rotation of the cylindrical body is stopped, the cylindrical body is placed vertically, and the volatile components of the second coating material are vaporized.

POLYCARBOSILAZANE, AND COMPOSITION COMPRISING THE SAME, AND METHOD FOR PRODUCING SILICON-CONTAINING FILM USING THE SAME

To provide a new silicon-containing polymer making it possible to form a cured film has features that its residual stress is small and crack resistance is high. A polycarbosilazane having particular cyclic structures.

OVEN DRYING APPARATUS AND COATING DEVICE
20230296315 · 2023-09-21 ·

The present application provides an oven drying apparatus and a coating device. The oven drying apparatus comprises an oven drying chamber and a heating assembly. The oven drying chamber is equipped with a first oven drying side having a plurality of first air inlet portions for fluid medium to enter the oven drying chamber. The heating assembly is disposed on the first oven drying side. The first oven drying side is further provided with at least one air return portion provided between two adjacent first air inlet portions, and the air return portion being configured for fluid medium in the oven drying chamber to be discharged from the oven drying chamber. The arrangement of an air return portion between two first air inlet portions can discharge fluid medium between the two first air inlet portions and take away the heat, thus avoiding accumulation of heat between the two first air inlet portions.

METHOD FOR PREPARING AND TOP COATING A POWDER COATED WOOD SUBSTRATE
20210346911 · 2021-11-11 ·

The invention includes a method for preparing and top coating an item made of powder coated MDF (or other substrate containing wood) with the end result of improved visual and tactile smoothness; the invention includes the steps of cutting and machining the part, pre-powder preparation and sanding of the part, powder coating the part, post-powder preparation and sanding, and applying the liquid top coat to the part, resulting in a smoother finish than is currently available in any other powder coated MDF finish while requiring less coats than similar liquid paint finishes.

Method for manufacturing water resistant printed circuit board

A method for manufacturing a water resistant substrate comprises a first step of providing a substrate. The method proceeds with a step of populating at least one component onto the substrate. Next, the method includes a step of cleaning the substrate including the at least one component to form a cleaned substrate. Then, the method proceeds with depositing a multi-layered water resistant coating onto the cleaned substrate.