A method of coating a donor surface with a layer of thermoplastic particles, the method comprising: providing a supply of the thermoplastic particles suspended in a fluid, applying the fluid to the donor surface, in a manner to cause the particles suspended in the fluid to form a substantially continuous particle coating on the donor surface, causing fluid flow within an interior plenum of a housing over a portion of the donor surface partially disposed therein, the fluid flow being of sufficient magnitude to entrain particles that are not in direct contact with the donor surface and insufficient to entrain particles that are in direct contact therewith; and extracting from the plenum fluid and particles which are not in not direct contact with the donor surface, so as to leave adhering to the donor surface a particle coating that is substantially only a single particle deep.

Provided is a maintenance method of a heat treatment apparatus including a chamber having a box shape and provided with a heater and a receiving member that supports a cassette having a box shape including a space in which a workpiece is supported. The maintenance method includes: attaching a loading/unloading jig including a roller on an upper portion and capable of moving the roller upward and downward, to the receiving member; transmitting the cassette supported by the receiving member onto the roller by raising the loading/unloading jig; unloading the cassette to an outside of the chamber by moving the cassette on the roller; loading the cassette into the chamber by moving the cassette on the roller; transmitting the cassette to the receiving member by lowering the loading/unloading jig; and detaching the loading/unloading jig from the receiving member.

A method to reduce the work function of a carbon-coated lanthanum hexaboride (LaB6) cathode wherein the exposed tip of the cathode is exposed to moisture between two heat treatments is provided. The work function may be reduced by 0.01 eV or more.

The present disclosure provides an apparatus for removing bubbles in a flexible substrate. The flexible substrate includes a baseplate and a polyimide layer coated on the baseplate. The apparatus includes a chamber including a top wall, a sidewall, and a bottom wall, wherein the top wall, the sidewall, and the bottom wall define an accommodation space; a heating plate disposed in the accommodation space; and a cooling conduit embedded in at least one of the top wall and the sidewall of the chamber.

Methods and processes for applying powder coat faux finishes, and power coat materials associated with such methods and processes are provided. Processes employ one or more partial powder coat layers along with physical texturing techniques to provide a variety of powder coated faux finish effects. Methods may utilize standard powder coating formulations in contrasting combinations to form suitable faux finishes. Faux finishing techniques using powder coating procedures may reproduce effects previously only obtainable with wet techniques, such as, for example, sponging, color washing, rag rolling, marbleizing, faux granite, strié, antiquing, verdigris, wood graining, weathered patina, etc. Kits of materials, including powder coating materials and physical texturing equipment suitable to reproduce such faux finishes are also provided.

The present disclosure provides an apparatus for removing bubbles in a flexible substrate. The flexible substrate includes a baseplate and a polyimide layer coated on the baseplate. The apparatus includes a chamber including a top wall, a sidewall, and a bottom wall, wherein the top wall, the sidewall, and the bottom wall define an accommodation space; a heating plate disposed in the accommodation space; and a cooling conduit embedded in at least one of the top wall and the sidewall of the chamber.

A substrate processing apparatus includes: a rotation support table capable of supporting and rotating a substrate; a chemical liquid nozzle that is arranged above an outer edge portion of the substrate that is supported by the rotation support table, and through which a chemical liquid is applied to the outer edge portion; and a solidified film forming unit that is arranged at least either on an upper side or on a lower side of the outer edge portion of the substrate that is supported by the rotation support table, and on a downstream side, in a direction of rotation of the substrate, of a position where the chemical liquid nozzle is arranged, and solidifies the chemical liquid applied to the outer edge portion, to form a solidified film that forms a part of an annular film.

Methods and apparatus for removing deposits in self-assembled monolayer (SAM) based selective deposition process schemes using cryogenic gas streams are described. Some methods include removing deposits in self-assembled monolayer (SAM) based selective depositions by exposing the substrate to cryogenic aerosols to remove undesired deposition on SAM protected surfaces. Processing chambers for cryogenic gas assisted selective deposition are also described.

A negative electrode active material slurry is applied to one surface of a strip-shaped negative electrode core so as to form multiple lines of the negative electrode active material slurry, the lines extending in an X direction and being spaced from each other in a Y direction. Subsequently, while keeping the negative electrode core aloft, first hot air is blown toward the negative electrode core from at least a lower side in a vertical direction, and then, while keeping the negative electrode core aloft, first cooling air having a lower temperature than the first hot air is blown toward the negative electrode core from at least the lower side in the vertical direction so as to decrease the temperature of the negative electrode core to 40° C. or lower.

Methods and apparatus for removing deposits in self-assembled monolayer (SAM) based selective deposition process schemes using cryogenic gas streams are described. Some methods include removing deposits in self-assembled monolayer (SAM) based selective depositions by exposing the substrate to cryogenic aerosols to remove undesired deposition on SAM protected surfaces. Processing chambers for cryogenic gas assisted selective deposition are also described.