A transducer assembly operable to transmit ultrasonic energy in a desired direction towards a zone adapted to be acoustically coupled to an object or area of interest is disclosed which has a transducer layer, a backing material disposed behind the transducer layer with respect to the desired direction, and a back-matching layer disposed between the transducer layer and the backing material to reflect towards the transducer layer part of the ultrasonic energy directed from the transducer layer to the backing material. The backing layer has an acoustic impedance higher than the acoustic impedance of the back-matching layer. The back-matching material has an impedance less than the impedance of the transducer layer and the transducer layer has a thickness greater than a ¼ of the wavelength of the ultrasound waves the assembly is configured to generate. A process for manufacturing a transducer assembly is also disclosed.

An ultrasound transducer assembly that includes a piezoelectric layer configured to resonate and generate ultrasound signals around a predetermined ultrasound frequency in which the piezoelectric layer has a width to thickness ratio of at least about 0.6. A conductive matching layer is connected to the top surface of the piezoelectric layer to condition the ultrasound transducer for broad frequency bandwidth operation. A conductive backing layer is connected to the bottom surface of the piezoelectric layer. The ultrasound transducer assembly further includes a rigid body over which the conductive backing layer is positioned, the rigid body assembled for encompassing a central longitudinal axis of a catheter body. A signal and ground electrode may form a metallic layer over the top of or below each of the piezoelectric layers. Electrical waveguides may be connected to corresponding signal and ground electrodes of the transducers.

An electronic device includes a substrate layer having a front surface and a back surface opposite the front surface, a plurality of ultrasonic transducers formed on the front surface of the substrate layer, wherein the plurality of ultrasonic transducers generate backward waves during operation, the backward waves propagating through the substrate layer, and a plurality of substrate structures formed within the back surface of the substrate layer, the plurality of substrate structures configured to modify the backward waves during the operation.

A backing member includes: a resin body including a lower surface and an upper surface opposite to each other; a plurality of leads each of which extends in a first direction from the lower surface toward the upper surface, and that are embedded at pitches in the resin body; and a plurality of insulating spacers each of which is provided between adjacent ones of the leads and extends in a second direction intersecting with the first direction, and that contact the leads.

An ultrasonic probe includes: a piezoelectric element that is used for transmitting and receiving ultrasonic waves; a signal electrode that is disposed at a rear surface side of the piezoelectric element; and a backing that is disposed at a rear surface side of the signal electrode, wherein the backing has a thermal resistance of 8 K/W or less, and the backing attenuates an ultrasonic wave with the lowest frequency by 10 dB or more, among frequencies at which transmittance and reception sensitivity of the ultrasonic probe is decreased from the maximum value thereof by 20 dB.

A well tool can be used in a wellbore that can measure characteristics of an object in the wellbore. The well tool includes an ultrasonic transducer for generating an ultrasonic wave in a medium of the wellbore. The ultrasonic transducer includes a front layer, a rear layer, backing material coupled to the rear layer, and piezoelectric material coupled to the front layer and to the backing material. The rear layer can improve signal-to-noise ratio of the transducer in applications such as imaging and caliper applications.

The present disclosure relates to a sonar device (1) for detection of underwater objects. The sonar device comprises a body element (2) having a cavity. A piezo electric element (3) is comprised within the cavity. A resin filling (6) of the cavity protects the piezo electric element (3) from water at underwater operation. The sonar device further comprises a holder (4) adapted to hold the piezo electric element (3). The holder (4) is arranged to centre and hold the piezo electric element (3) within said body element (2). The holder (4) comprises in its structure a plurality of damping structures (5). A method of manufacturing holder and a sonar device is also disclosed.

A PMUT ultrasound transducer includes a number of PMUT transmitting elements in a membrane layer. Behind each PMUT transmitting element is a cavity in the membrane layer. The cavities are partially or completely filled with a damping material to reduce ringing of the PMUT transmitting elements. Suitable damping materials include polymers, e.g., soft epoxies, benzocyclobutene or polyimide that are dispersed into the cavities or a phase changing material such as Parylene that precipitates out of a gas phase as a polymer when cured.

An ultrasonic transducer is disclosed. The transducer includes a wear cap and an active element. The wear cap includes at least one slot arranged so as to define a strip. The strip is arranged to be in vibrational communication with the active element. The ultrasonic transducer may include a rigid block. The active element may be interposed between the wear cap and the rigid block, and the rigid block may be configured to provide a backing mass for the active element. Optionally, the rigid block may include chamfered edges.

Provided is an ultrasonic probe that is capable of easily dissipating heat generated therein using porous carbon allotrope foams. The ultrasonic probe includes: a matching layer; a piezoelectric layer disposed on a bottom surface of the matching layer; and a backing layer disposed on a bottom surface of the piezoelectric layer and formed of porous carbon allotrope foams and backing materials.