An apparatus may include a vibration member and a vibration apparatus provided at a rear surface of the vibration member to vibrate the vibration member. The vibration apparatus may include at least one or more first vibration portions and a plurality of second vibration portions different from the at least one or more first vibration portions. The at least one or more first vibration portions may be at a periphery of, or may be adjacent to, the plurality of second vibration portions.

A system and method from improving the image quality achievable with an ultrasound transducer by using a composite aperture for receiving ultrasound echoes. By using two receive cycles per vector, twice as many transducers may be used for receiving ultrasound imaging data than there are physical channels available in the ultrasound probe. An ultrasound probe utilizing a composite aperture can achieve high image quality from a system have reduced power, size, cost and complexity.

The invention relates to the field of ultrasonic imaging detection, and more particularly, to an ultrasonic system of a contact type flexible conformal ultrasonic probe and a method for the same. The ultrasonic system comprises: a flexible probe, comprising a flexible detection surface, a plurality of probe units, and a soft film sensing surface; a switch module; a control module, comprising: a transmitting control unit for sequentially controlling the probe units in the probe array to transmit the ultrasonic signal; a receiving control unit for sequentially controlling the probe units in the probe array to receive the ultrasonic signal, and for processing the ultrasonic signal to obtain a ultrasonic image. The present invention has the following beneficial effects: the use of a flexible probe for acquiring an ultrasonic image allows to solve the problem that the operation process and imaging steps are complicated when using a rigid probe.

High-resolution intravascular ultrasound (H-IVUS) operates under a large acoustic bandwidth, provides high resolution while maintaining good depth penetration, and exhibits other favorable characteristics like focused imaging. A H-IVUS transducer assembly can be manufactured at a low cost using conventional methods commonly utilized in the microelectronics industry. The H-IVUS transducer assembly can include a printed circuit having one or more electrical signal conditioners. One or more convertors made of a polymer and configured to convert electrical energy to acoustic energy and acoustic energy to electrical energy can be formed in place away from the printed circuit. After construction, the one or more formed in place convertors are interfaced to the printed circuit with at least a conductive material.

A system and method from improving the image quality achievable with an ultrasound transducer by using a composite aperture for receiving ultrasound echoes. By using two receive cycles per vector, twice as many transducers may be used for receiving ultrasound imaging data than there are physical channels available in the ultrasound probe. An ultrasound probe utilizing a composite aperture can achieve high image quality from a system have reduced power, size, cost and complexity.

The technology concerning improvement of resolution of an acoustic wave sensor having a hemispherical shape or the like is provided. An ultrasonic transducer unit includes an ultrasonic transducer having a plurality of ultrasonic transducer elements, and a probe casing configured to support a plurality of the ultrasonic transducers, and to have a concave portion facing a subject. The plurality of ultrasonic transducer elements is arranged on a same plane facing a center of curvature of the probe casing. The plurality of ultrasonic transducer elements is arranged in a rotationally symmetrical manner about a normal line connecting the center of curvature of the probe casing to a point on a plane of the ultrasonic transducer.

A fingerprint recognition module, a display panel and driving method, and a display device are provided. The fingerprint recognition module includes a first electrode layer including a plurality of first electrodes, and a piezoelectric layer disposed on a side of the first electrode layer. The fingerprint recognition module also includes a second electrode layer disposed on a side of the piezoelectric layer facing away from the first electrode layer. The second electrode layer includes a plurality of second electrodes that are arranged along a first direction, and one second electrode overlaps at least two first electrodes. Moreover, the fingerprint recognition module includes a flexible circuit board bonded and connected to the plurality of second electrodes. In a plane parallel to the first electrode layer, the plurality of second electrodes and the flexible circuit board are arranged along a second direction, and the first direction intersects the second direction.

An assembly is configured to be coupled to a propagating medium. The assembly includes a first conductive layer including a first set of parallel conductors, a second conductive layer including a second set of parallel conductors, and a piezoelectric material layer between the first conductive layer and the second conductive layer. Different piezoelectric transducer nodes are formed at intersections between the first set of parallel conductors and the second set of parallel conductors.

According to various embodiments, a PMUT device may include a wafer, an active layer including a piezoelectric stack, an intermediate layer having a cavity therein where the intermediate layer is disposed between the wafer and the active layer such that the cavity is adjoining the piezoelectric stack. A via may be formed through the active layer and the intermediate layer to the wafer. A metallic layer may be disposed over the active layer and over surfaces of the via. The intermediate layer may include an interposing material surrounding the cavity, and may further include a sacrificial material surrounding the via. The sacrificial material may be different from the interposing material. The metallic layer may include a first member at least substantially overlapping the piezoelectric stack, a second member extending from the first member to the cavity, and a third member extending into the active layer to contact an electrode therein.

An ultrasonic sensor and a display device and may drive a plurality of sensing pixels disposed in the ultrasonic sensor simultaneously to transmit an ultrasonic wave, may make a first electrode disposed in a sensing pixel to be floated at a timing receiving a reflected signal to store the signal, and then may perform a sensing sequentially. Therefore, as an accurate sensing may be possible while reducing a duration and a number of an ultrasonic wave transmitting, a sensitivity and an accuracy of a sensing may be maintained while improving a driving efficiency of the ultrasonic sensor.