A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle extending through the spin base, and a clamping member covering the spin base. The spindle includes a mounting part and a supporting part disposed on the mounting part. The mounting part includes an inner projection, the supporting part includes a conical projection, and the conical projection is surrounded by the inner projection. The semiconductor wafer cleaning apparatus further includes a first sealing ring disposed between the spin base and the mounting part.

Provided is disclosure for embodiments providing delivery of chemicals for conditioning a brush offline, where the brush is not coupled to a machine that makes use of the brush to clean a surface of an object.

A method of cleaning wafer-cleaning brushes includes passing a wafer having a first polished main side and an opposing unpolished backside between a pair of substantially cylindrical shaped wafer-cleaning brushes are rotated about an axial direction of the brushes while passing the wafer between the pair of wafer-cleaning brushes. A cleaning solution is applied to the brushes while passing the wafer between the pair of wafer-cleaning brushes. While passing between the pair of brushes, the first polished main side of the wafer faces a first direction, the first direction is an opposite direction to which a polished side of a production wafer faces during a subsequent polished wafer cleaning operation. The substantially cylindrical shaped wafer-cleaning brushes include a plurality of protrusions on an external surface of the brushes, and the brushes contact the wafer at least a portion of time the wafer is passing between the pair of brushes.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

A sponge cleaning device has a lid for enclosing and hiding a sponge when not in use. The sponge cleaning device has a bottom shelf that can be raised and lowered into a cleaning solution disposed in a base of the device. When the lid is closed, the bottom shelf lowers toward the base, causing a sponge resting on the bottom shelf to be lowered into the cleaning solution. When the lid is opened, the bottom shelf raised out of the cleaning solution and toward a top shelf. The top shelf can be movably disposed to compress the sponge when the sponge is on the bottom shelf and the lid is opened, thus squeezing out cleaning solution from the sponge. The top shelf can be movably disposed to permit the user to access the sponge and remove it from the bottom shelf for use.

According to one embodiment, there is provided a cleaning apparatus including a substrate cleaner and a member cleaner. The substrate cleaner has a substrate cleaning member placed over a first region to be opposite a substrate and a second region different from the first region. The member cleaner is placed adjacent to the second region.

A mop cleaning system has a mop basin having a floor and a drain, a chamber affixed to the mop basin in a location away from the drain, a water inlet opening within the interior volume of the chamber, and a water source connected to the water inlet. The water inlet is adapted to pass water in an area adjacent to a bottom of the chamber. The water source is adapted to pass water under pressure into the water inlet. The chamber is fixedly mounted to the floor of the mop basin. The chamber has an outlet located at above the water inlet.

A trimming tool cleaning system (100) includes a solvent reservoir (102) containing a solvent such as vegetable oil for the plant resin, a wristband (104), and a trimming tool (106). The tool (106) is used to trim plant material with resin, e.g., trim the sugar leaves and buds of a cannabis plant. The blades (108) of the trimming tool (106) can be wiped on the band (104) so that the blades (108) are lightly coated with the solvent. The solvent in reservoir (102) is used to wet the wristband. The solvent then protects the blades (108) from gumming up and facilitates cleaning of the blades (108).

A substrate cleaning brush for cleaning a wafer includes a brush main body, a brush holding unit, and a main flow path forming body. The brush main body has a liquid permeable structure and includes a lower surface that comes into contact with a substrate. The brush holding unit holds the brush main body while exposing a distal end portion in a vertical direction of the brush main body to the outside. The main flow path forming body includes a main flow path and a plurality of sub flow paths. The main flow path is formed to allow a processing liquid supplied from the outside to pass therethrough. The plurality of sub flow paths branch off from the main flow path, extend outward in a width direction perpendicular to the vertical direction of the brush main body, and are connected to an upper surface of the brush main body.

Described are methods for removing abrasive particles from a polymeric surface, such as from a polymeric surface of a cleaning brush used in a post chemical-mechanical processing cleaning step, as well as related cleaning solutions.