A processing liquid nozzle according to an aspect of the present invention comprises an ultrasonic application part (60), a first supply flow path (71), a discharge flow path (72), and a second supply flow path (73). The ultrasonic application part (60) has a vibrator (61) for generating ultrasonic waves, and a vibrating body (62) joined to the vibrator (61). The first supply flow path (71) supplies a first liquid (L1) to a position contacting the vibrating body (62) of the ultrasonic application part (60). The discharge flow path (72) supplies the first liquid (L1), to which ultrasonic waves have been applied by the ultrasonic application part (60), to a discharge port (74). The second supply flow path (73) is connected to the discharge flow path (72) on the downstream side from the ultrasonic application part (60), and supplies a second liquid (L2) to the discharge flow path (72).

A nozzle include a first portion, a second portion joined to the first portion, and a third portion joined to the second portion. The first portion includes a first inner wall surface and a first flow channel including a first inlet and a first outlet. The second portion includes a second inner wall surface and a second flow channel including a second inlet having an inner diameter less than an inner diameter of the first outlet and a second outlet. The third portion includes a third inner wall surface and a third flow channel including a third inlet having an inner diameter greater than the inner diameter of the second outlet and a third outlet. The third flow channel includes a diameter-decreasing section having an inner diameter that gradually decreases and a straight section having an inner diameter less than the inner diameter of the second outlet and constant.

A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, and an ultrasonic cleaning module configured to spray a cleaning solution onto the wafer and apply ultrasonic waves to the cleaning solution to ultrasonically vibrate the cleaning solution.

Provided is a substrate treatment apparatus with improved workability. The substrate treatment apparatus includes: a first bath storing a cleaning solution and having a first opening formed in an upper surface thereof; and a first ultrasonic oscillator installed in the first bath and providing ultrasonic waves toward a surface of the cleaning solution exposed by the first opening to form a water film protruding from the surface of the cleaning solution, wherein a substrate is not immersed in the first bath, and a surface of the substrate is placed adjacent to the first opening and cleaned by the water film.

Providing a substrate cleaning device and a substrate cleaning method having high detergency. Provided is a substrate cleaning device including: a substrate rotating mechanism that rotates a substrate; and a first nozzle and a second nozzle that eject an ultrasonic cleaning solution toward a predetermined surface of the substrate that is rotated, wherein the first nozzle and the second nozzle are held in one casing.

An ultrasonically activated water ejector includes a cylindrical water reservoir section configured to temporarily hold water, an ejection nozzle that ejects the water from a lower part of the water reservoir section, a dome-shaped ultrasonic vibration plate disposed in an upper part of the water reservoir section, facing the ejection nozzle, and having a concave spherical surface on a lower side thereof, and a water supply portion having a supply inlet configured to supply the water along the concave spherical surface into the water reservoir section from an outer periphery toward a center of the ultrasonic vibration plate. The water is supplied from the supply inlet to the water reservoir section in an amount greater than the water to be ejected from the ejection nozzle. The water flows along the concave spherical surface from the outer periphery toward the center, and is held in the water reservoir section.

According to one embodiment, a substrate processing apparatus includes: a removing part (D1) configured to remove liquid droplets present in a recess (30); a drain hole (30a) located at the bottom of the recess (30) of a nozzle head (32), and configured to discharge the liquid droplets as a target to be removed out of the recess (30); and a controller configured to control the discharge state of a gas discharge nozzle (33) such that there is a period in which a gas is discharged from the gas discharge nozzle (33) at a flow rate, at which the gas discharged does not reach a surface to be processed of s substrate W, in a period from the end of the rinsing process using a treatment liquid to the start of the drying process using the gas.

An ultrasonic wave applying liquid is supplied to one principal surface of a substrate while a liquid film of a first liquid being formed on another principal surface of the substrate. The ultrasonic wave applying liquid is obtained by applying ultrasonic waves to a second liquid. Ultrasonic vibration is transmitted to the other principal surface and the liquid film, thereby ultrasonically cleaning the other principal surface. The first liquid has a higher cavitation intensity, which is a stress per unit area acting on the substrate by cavitation caused in the liquid when ultrasonic waves are transmitted to the liquid present on the principal surface of the substrate, than the second liquid.

An electrodischarge apparatus has a nozzle that includes a discharge chamber that has an inlet for receiving a liquid and an outlet. The apparatus has a first electrode extending into the discharge chamber that is electrically connected to one or more high-voltage capacitors. A second electrode is proximate to the first electrode to define a gap between the first and second electrodes. A switch causes the one or more capacitors to discharge across the gap between the electrodes to create a plasma bubble which expands to form a shockwave that escapes from the nozzle ahead of the plasma bubble.

An ultrasonic cleaning apparatus and an ultrasonic cleaning method for an edge face of a substrate help prevent re-contamination caused by splashing or the like of ultrasonic wave propagating water sprayed onto an edge face of an object to be cleaned. An ultrasonic wave transmitting tube provided to continue from the spot shower and configured to transmit and spray the ultrasonic wave propagating water to the substrate is provided, the ultrasonic wave transmitting tube is installed so as not to be positioned on the substrate, the substrate is retained so that the surface of the substrate assumes a horizontal state, and ultrasonic wave propagating water is sprayed to the edge face, which constitutes an outer periphery of the substrate arranged in a space from the ultrasonic wave transmitting tube in a direction of tangent line of the edge face while rotating the substrate by a rotatable rotation retaining portion.