A wafer processing method of the present invention includes mounting a wafer part on a chuck table, loading a ring cover unit on the chuck table to restrain the wafer part to the chuck table, spraying, by a spray suction arm module, a processing solution onto the wafer part and suctioning, by the spray suction arm module, foreign materials from the processing solution, unloading the ring cover unit from the chuck table, and spraying, by a spray arm module, a cleaning solution onto the wafer part to clean the wafer part.

A substrate processing apparatus 1 includes a controller 61 configured to perform a first recipe and a second recipe in parallel. Each of the first recipe and the second recipe includes a first transfer processing of transferring a substrate from a transit unit 14 to a liquid processing unit 17, a liquid processing, a second transfer processing of transferring the substrate from the liquid processing unit 17 to a drying unit 18 and a drying processing. The controller 61 determines, while the first recipe on a first substrate in substrates is being performed, when the second recipe on a second substrate in the substrates is started, a start timing of the first transfer processing of the second substrate such that a time period of the second transfer processing of the first substrate does not overlap with a time period of the second transfer processing of the second substrate.

A brushless car wash system includes a variable width. The width of the brushless car wash system is adjusted according to a width of a vehicle being washed. By adjusting the width of the brushless car wash system, wash performance of the brushless car wash system is increased.

A cleaning device is configured to include a first cleaning tank that holds water to which a small amount of an additive is added as a first cleaning fluid, a second cleaning tank that holds water, a water-based cleaning agent, an alkaline cleaning fluid, or a hydrophilic organic solvent as a second cleaning fluid, a first microscopic air bubble generation device, a first circulating pump, an ultrasonic wave emitting device, and a carrier device. Hydrophobic oil is removed by a cleaning target being exposed to the first cleaning fluid including microscopic air bubbles sprayed from a nozzle in an interior of the first cleaning tank, after which hydrophilic oil is removed by ultrasonic cleaning in the second cleaning tank.

A pickling production line comprises a material-holding apparatus, a pickling zone, and a water wash zone; the pickling zone and the water wash zone are independently arranged; the material-holding apparatus is filled with magnesium alloy waste, and self-rotates successively in the pickling zone and the water wash zone for pickling and water washing respectively. In the pickling production line for magnesium alloy waste material, the magnesium alloy waste material is pickled and washed more thoroughly; coatings and impurities on the surface of the magnesium alloy waste material are removed, the efficiency of the cleaning and the consistency of the cleaning are high, and each piece of equipment in the entire production line is connected in a compact manner; the invention has a high degree of automation, low environmental pollution, conserves resources, is highly efficient in production, and is suitable for the bulk pickling and cleaning of magnesium alloy waste material.

A brushless car wash system includes a wash unit that washes upper surfaces of the vehicle. The height of the wash unit is adjusted based on the contour of the upper surfaces of the vehicle. Adjusting the height of the wash unit results in increased wash performance of the brushless car wash system.

A cleaning apparatus for an endless conveyor belt is provided. The cleaning apparatus is operable for a rotary cleaning head to perform a cleaning action on a first section of the endless conveyor belt. In an embodiment of the present invention, the rotary cleaning head comprises a rotating disc assembly. The rotary cleaning assembly is operable for a mobile mount to position the rotary cleaning head into a first cleaning contact position with the endless conveyor belt. To affix the rotary cleaning head assembly to a mount, a connecting portion having a proximal end and a distal end, wherein the proximal end includes a first coupling is provided. Said coupling is capable of making a connection to and disconnecting from the mobile mount, and said distal end capable of making a connection and disconnecting from the rotary cleaning head and adapted for use with the rotary cleaning head.

The present invention relates to a substrate cleaning system and a substrate cleaning method for cleaning a substrate. The substrate cleaning system (50) includes a heater (51), a chemical-liquid diluting module (52), and a cleaning module. A temperature of the diluted-chemical-liquid mixed by the chemical-liquid diluting module (52) is determined to be higher than normal a temperature and lower than a glass transition point of a cleaning member. The cleaning member scrubs the substrate (W) with the diluted chemical liquid having the determined temperature supplied to the substrate (W).

A method for manufacturing a structure on a surface of a workpiece (1) is disclosed, the method having the following steps: applying a liquid base layer (2) onto the surface of the workpiece (1); spraying on at least one droplet (3) into the not yet congealed base layer (2), wherein the at least one droplet (3) at least partially, preferably completely, penetrates into the base layer (2); fixing the base layer (2); and at least partially removing the at least one droplet (3). Further, a second method having the following steps is disclosed: spraying on at least one droplet (3) onto the surface of the workpiece (1); applying a liquid base layer (2) onto the surface of the workpiece (1), wherein the base layer (2) flows around the at least one droplet (3) and preferably at least partially covers the at least one droplet (3); fixing the base layer (2); at least partially removing the at least one droplet (3). Finally, a device for performing the methods is disclosed.

A treatment apparatus including a chuck table, a table base, a servo motor that rotates the table base, and a determination unit that determines the kind of the chuck table mounted to the table base is provided. The determination unit includes a torque recording section in which a torque outputted by the servo motor when rotating the table base is recorded on the basis of the kind of the chuck table, and a determination section that collates the torque outputted by the servo motor with the torque recording section, to thereby determine the kind of the chuck table.