Disclosed is a substrate treating apparatus that performs a cleaning treatment on substrates. A treating block includes a plurality of treating units in an upper and lower stages, respectively. The treating block includes a front face cleaning unit and a back face cleaning unit, each being at least one in number, in the upper stage. The treating block includes at least one tower unit including the front face cleaning unit and the back face cleaning unit, each being at least one in number, in the lower stage. Moreover, a transportation block is provided that includes a center robot in each of the upper and lower stages.

The present invention relates to an apparatus for cleaning press rolls for electrodes, comprising two or more cleaning units provided with cleaning members having grains. According to the present invention, the apparatus for cleaning press rolls for electrodes comprises a plurality of, i.e., two or more, cleaning units, wherein the cleaning units respectively comprise cleaning members having grains with different directions, thus allowing a residual cleaning solution and contaminants to be effectively removed. In addition, when press rolls are cleaned using the apparatus for cleaning press rolls according to the present invention, an aqueous cleaning solution and an alcoholic cleaning solution, which have different properties, can be used together, and after cleaning, the cleaning solutions do not remain on the press rolls, and thus subsequently, secondary contamination of electrodes is prevented, and accordingly, when electrodes are manufactured, the occurrence of defects in the electrodes can be reduced.

A sensor lens assembly includes a cylindrical sensor body including a lower surface, a sensor lens surface, and a side surface extending between the lower surface and an outer edge of the sensor lens surface, a sensor enclosed within the cylindrical sensor body and adjacent to the sensor lens surface, and a nozzle configured to deliver a fluid near a center point of the sensor lens surface. The sensor lens surface is concave and rotates relative to the side surface of the cylindrical sensor body such that centrifugal force causes the fluid to form a film on the sensor lens surface that acts as a barrier, cushion, and particle collecting medium on the sensor lens surface.

Disclosed is a substrate treating apparatus for performing a cleaning treatment on substrates. The apparatus includes an indexer block with an indexer robot, a treating block including a front face cleaning unit and a back face cleaning unit as treating units, and a reversing path block including a plurality of shelves on which substrates are placed, and having a reversing function. The indexer robot includes a guide rail, a base, an articulated arm, and a hand. The guide rail is positioned so as not to overlap a mount position of a substrate in the reversing path block.

An apparatus for cleaning a felt in a system for producing a paper web has a device for introducing a cleaning liquid into the felt and at least one following suction device in the direction of movement of the felt and having a vacuum duct, through which the cleaning liquid is suctioned out of the felt. The suction device between the vacuum duct and the felt is formed with suction ducts, through which the cleaning liquid in the felt is suctioned away. At least one of the suction ducts is assigned an inflatable valve element. In the inflated state of the valve element the suction duct is closed and in its ventilated state the suction duct is opened.

The natural oxidation film of polysilicon, which is exposed at a side surface of a recess portion 83 provided in a substrate W, is removed and a thin film 84 of polysilicon is exposed at the side surface of the recess portion 83. Liquid IPA is brought into contact with the thin film 84 of polysilicon after the natural oxidation film of polysilicon is removed. Diluted ammonia water is supplied to the substrate W and the thin film 84 of polysilicon is etched after IPA comes into contact with the thin film 84 of polysilicon.

A self-cleaning automatically-stored electrical mop includes a mop rod assembly, a mop head assembly, and a cleaning base assembly used for storing and cleaning the mop head assembly. The mop head assembly is arranged at the lower end of the mop rod assembly and includes a mop head shell which is provided with a rotatable cleaning roller and a motor used for driving the cleaning roller. The cleaning base assembly includes a shell part. A cleaning groove used for cleaning the cleaning roller is formed in the shell part, and a cleaning assembly used for scrubbing the cleaning roller is arranged in the cleaning groove. The shell part is provided with a sewage discharge system used for discharging sewage.

The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

The disclosed technology includes a cleaning device for cleaning personal care tools, such as toothbrushes and shaving razors. The cleaning device can include a heating element configured to heat cleaning fluid received by the cleaning device and a high pressure nozzle configured to output heated cleaning fluid into the cleaning chamber.

The present disclosure, in some embodiments, relates to an integrated chip processing tool. The integrated chip processing tool includes a first transfer module and a second transfer module. The first transfer module has a first robotic arm disposed within a housing. The first transfer module is configured to receive a single and unitary first die tray configured to hold a plurality of integrated chip (IC) die and to concurrently transfer all of the plurality of IC die held by the single and unitary first die tray to a single and unitary die boat. The second transfer module has an additional robotic arm disposed within the housing and configured to concurrently transfer all of the plurality of IC die from the single and unitary die boat to a single and unitary second die tray.