A cleaning system for an additively manufactured component includes a tank storing a cleaning fluid. A fluid circuit is operably coupled with the tank. A pump is coupled with the fluid circuit. A manifold is configured to receive fluid from the fluid circuit through the pump. At least one of a coupler defined by the manifold or a hose is coupled with the manifold. The at least one of the coupler defined by the manifold or the hose is further configured to couple with said additively manufactured component.

A cleaning system for an additively manufactured component includes a tank storing a cleaning fluid. A fluid circuit is operably coupled with the tank. A pump is coupled with the fluid circuit. A manifold is configured to receive fluid from the fluid circuit through the pump. At least one of a coupler defined by the manifold or a hose is coupled with the manifold. The at least one of the coupler defined by the manifold or the hose is further configured to couple with said additively manufactured component.

An apparatus for cleaning a surface, the apparatus including a body defining a chamber, an inlet for liquid flow into the chamber, an outlet for liquid flow from the chamber, a nozzle connected to the outlet for generating an output flow of liquid for cleaning a surface, an acoustic transducer associated with the body to introduce acoustic energy into the liquid within the chamber whereby the acoustic energy is present in the liquid flowing out of the nozzle, and a gas bubble generator for generating gas bubbles within the liquid flowing out of the nozzle.

An apparatus for cleaning a surface, the apparatus including a body defining a chamber, an inlet for liquid flow into the chamber, an outlet for liquid flow from the chamber, a nozzle connected to the outlet for generating an output flow of liquid for cleaning a surface, an acoustic transducer associated with the body to introduce acoustic energy into the liquid within the chamber whereby the acoustic energy is present in the liquid flowing out of the nozzle, and a gas bubble generator for generating gas bubbles within the liquid flowing out of the nozzle.

A method for cleaning semiconductor substrate without damaging patterned structure on the substrate using ultra/mega sonic device comprising applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f.sub.1 and power P.sub.1 to drive said ultra/mega sonic device; before bubble cavitation in said liquid damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f.sub.2 and power P.sub.2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f.sub.1 and power P.sub.1 again; repeating above steps till the substrate being cleaned. Normally, if f.sub.1=f.sub.2, then P.sub.2 is equal to zero or much less than P.sub.1; if P.sub.1=P.sub.2, then f.sub.2 is higher than f.sub.1; if the f.sub.1<f.sub.2, then, P.sub.2 can be either equal or less than P.sub.1.

A method for cleaning semiconductor substrate without damaging patterned structure on the substrate using ultra/mega sonic device comprising applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f.sub.1 and power P.sub.1 to drive said ultra/mega sonic device; before bubble cavitation in said liquid damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f.sub.2 and power P.sub.2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f.sub.1 and power P.sub.1 again; repeating above steps till the substrate being cleaned. Normally, if f.sub.1=f.sub.2, then P.sub.2 is equal to zero or much less than P.sub.1; if P.sub.1=P.sub.2, then f.sub.2 is higher than f.sub.1; if the f.sub.1<f.sub.2, then, P.sub.2 can be either equal or less than P.sub.1.

A bifilar winding system for the manufacture of poloidal field superconducting magnets for nuclear fusion includes two superconducting coil winding production lines which are symmetrically arranged, a dropping fixture, a rotary platform and a winding mold, and an automatic control system. Each of the two winding production lines includes a conductor unwinding device, a straightener, an ultrasonic cleaning machine, a sandblasting and cleaning machine, a bending machine, an inter-turn insulation taping machine. During the winding of a coil, a superconducting conductor is unwound by the conductor unwinding device under the control of the automatic control system, then straightened, ultrasonically cleaned, sandblasted and cleaned, and bent into a desired radius, then wrapped with multiple layers of insulating tape by the inter-turn insulation taping machine, and finally fixed, by the dropping fixture, precisely on the rotary platform at a correct position within a profile of the winding mold.

A bifilar winding system for the manufacture of poloidal field superconducting magnets for nuclear fusion includes two superconducting coil winding production lines which are symmetrically arranged, a dropping fixture, a rotary platform and a winding mold, and an automatic control system. Each of the two winding production lines includes a conductor unwinding device, a straightener, an ultrasonic cleaning machine, a sandblasting and cleaning machine, a bending machine, an inter-turn insulation taping machine. During the winding of a coil, a superconducting conductor is unwound by the conductor unwinding device under the control of the automatic control system, then straightened, ultrasonically cleaned, sandblasted and cleaned, and bent into a desired radius, then wrapped with multiple layers of insulating tape by the inter-turn insulation taping machine, and finally fixed, by the dropping fixture, precisely on the rotary platform at a correct position within a profile of the winding mold.

A treatment liquid supply device and a wet treatment device with which an extremely small quantity of the treatment liquid can be accurately supplied, as a method for supplying a treatment liquid to an extremely small wafer of half inch size, including: a syringe that sucks and discharges the treatment liquid; a treatment liquid bottle that is filled with the treatment liquid; a suction hose that has one end connected to the treatment liquid bottle and the other end connected to the syringe, and sucks the treatment liquid inside the treatment liquid bottle to the syringe; a supply hose that has one end connected to an intermediate section of the suction hose and serves to supply, to the surface of the wafer, the treatment liquid discharged by the syringe; and a three-way solenoid valve that controls opening/closing of each of the suction and supply hoses.

A treatment liquid supply device and a wet treatment device with which an extremely small quantity of the treatment liquid can be accurately supplied, as a method for supplying a treatment liquid to an extremely small wafer of half inch size, including: a syringe that sucks and discharges the treatment liquid; a treatment liquid bottle that is filled with the treatment liquid; a suction hose that has one end connected to the treatment liquid bottle and the other end connected to the syringe, and sucks the treatment liquid inside the treatment liquid bottle to the syringe; a supply hose that has one end connected to an intermediate section of the suction hose and serves to supply, to the surface of the wafer, the treatment liquid discharged by the syringe; and a three-way solenoid valve that controls opening/closing of each of the suction and supply hoses.