A bifilar winding system for the manufacture of poloidal field superconducting magnets for nuclear fusion includes two superconducting coil winding production lines which are symmetrically arranged, a dropping fixture, a rotary platform and a winding mold, and an automatic control system. Each of the two winding production lines includes a conductor unwinding device, a straightener, an ultrasonic cleaning machine, a sandblasting and cleaning machine, a bending machine, an inter-turn insulation taping machine. During the winding of a coil, a superconducting conductor is unwound by the conductor unwinding device under the control of the automatic control system, then straightened, ultrasonically cleaned, sandblasted and cleaned, and bent into a desired radius, then wrapped with multiple layers of insulating tape by the inter-turn insulation taping machine, and finally fixed, by the dropping fixture, precisely on the rotary platform at a correct position within a profile of the winding mold.

A cleaning device is configured to include a first cleaning tank that holds water to which a small amount of an additive is added as a first cleaning fluid, a second cleaning tank that holds water, a water-based cleaning agent, an alkaline cleaning fluid, or a hydrophilic organic solvent as a second cleaning fluid, a first microscopic air bubble generation device, a first circulating pump, an ultrasonic wave emitting device, and a carrier device. Hydrophobic oil is removed by a cleaning target being exposed to the first cleaning fluid including microscopic air bubbles sprayed from a nozzle in an interior of the first cleaning tank, after which hydrophilic oil is removed by ultrasonic cleaning in the second cleaning tank.

An example method to clean a continuous substrate involves applying a high pressure, low flow spray of a first cleaning fluid at the continuous substrate from one or more nozzles to remove particulate matter from the continuous substrate; transporting the continuous substrate from a first volume having the high pressure, low volume spray, to a second volume having an agitation bath; vacuuming moisture from the continuous substrate during transporting of the continuous substrate from the first volume to the second volume; directing energy at the continuous substrate in the agitation bath using at least one of a megasonic transducer or an ultrasonic transducer; and drying the continuous substrate.

A continuous cleaning installation 1 of a passing strip S includes a tank 2, an aqueous solution 3 inside the tank 2. It also includes at least a roll 4 immerged in the aqueous solution 3, at least an ultrasound emitter 5, a feed for feeding 6 an aqueous solution and emptying 7 the tank. Moreover, it also includes and estimator for estimating 8 the aqueous solution level, a calculator for calculating 9 for each ultrasound emitter 5 its distance to the aqueous solution level and a controller for controlling the power 10 of the at least one ultrasound emitter 5 and at least an impermeable closable opening 11 on at least a lateral side of the tank through which the at least one ultrasound emitter 5 can pass.

A processing liquid nozzle according to an aspect of the present invention comprises an ultrasonic application part (60), a first supply flow path (71), a discharge flow path (72), and a second supply flow path (73). The ultrasonic application part (60) has a vibrator (61) for generating ultrasonic waves, and a vibrating body (62) joined to the vibrator (61). The first supply flow path (71) supplies a first liquid (L1) to a position contacting the vibrating body (62) of the ultrasonic application part (60). The discharge flow path (72) supplies the first liquid (L1), to which ultrasonic waves have been applied by the ultrasonic application part (60), to a discharge port (74). The second supply flow path (73) is connected to the discharge flow path (72) on the downstream side from the ultrasonic application part (60), and supplies a second liquid (L2) to the discharge flow path (72).

An example method to clean a continuous substrate involves applying a high pressure, low flow spray of a first cleaning fluid at the continuous substrate from one or more nozzles to remove particulate matter from the continuous substrate; an agitator, comprising at least one of a megasonic transducer or an ultrasonic transducer, and configured to direct energy at the continuous substrate; and drying the continuous substrate.

A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, and an ultrasonic cleaning module configured to spray a cleaning solution onto the wafer and apply ultrasonic waves to the cleaning solution to ultrasonically vibrate the cleaning solution.

Provided is a substrate treatment apparatus with improved workability. The substrate treatment apparatus includes: a first bath storing a cleaning solution and having a first opening formed in an upper surface thereof; and a first ultrasonic oscillator installed in the first bath and providing ultrasonic waves toward a surface of the cleaning solution exposed by the first opening to form a water film protruding from the surface of the cleaning solution, wherein a substrate is not immersed in the first bath, and a surface of the substrate is placed adjacent to the first opening and cleaned by the water film.

A device for cleaning items comprises an enclosure defining a wash chamber, a rotor positioned within the wash chamber and selectively rotatable about an axle, a motor for selectively rotating the axle, a dispenser, and a drain. The rotor comprises a plurality of holders spaced about the axle and adapted to selectively receive and hold a respective item to be cleaned. The dispenser at least one liquid input and at least one liquid output and is positioned such that the at least one liquid output directs cleaning fluid at one of the items to clean material out of the cavities. The drain is for draining the cleaning fluid out of the chamber. The rotor is selectively rotatable at a predefined rotational speed for a predefined amount of time to expel cleaning fluid from the cavities of each item to be cleaned.

Embodiments of megasonic cleaning chambers are provided herein. In some embodiments, a megasonic cleaning chamber includes: a chamber body defining an interior volume therein; a substrate support to support a substrate disposed in the interior volume; a supply tube comprising a transparent material configured to direct a cleaning fluid to the substrate support; a megasonic power generator coupled to the supply tube to provide megasonic power to the cleaning fluid; a megasonic transducer coupled to the megasonic power generator and the supply tube to create megasonic waves in the cleaning fluid and to form cavities in the cleaning fluid, wherein the megasonic transducer is configured to direct the megasonic waves and cavities toward the substrate support; and one or more sensors configured to generate a signal indicative of a property of the cavities in the cleaning fluid.