A washer assembly for cleaning used chemical containers having a sealed chamber with a hingedly attached lid. A spray tube is supported in upright extending fashion upon a pan shaped basin of the sealed chamber. A fresh fluid inlet feeds pressurized fluid flow to the spray tube for spraying an inside of the chemical container placed over the tube, such that the fluid collects upon the basin. A drain is incorporated into the basin for removing contaminated fluid from the chamber.

A washer assembly for cleaning used chemical containers having a sealed chamber with a hingedly attached lid. A spray tube is supported in upright extending fashion upon a pan shaped basin of the sealed chamber. A fresh fluid inlet feeds pressurized fluid flow to the spray tube for spraying an inside of the chemical container placed over the tube, such that the fluid collects upon the basin. A drain is incorporated into the basin for removing contaminated fluid from the chamber.

The invention relates to a centrifuge for cleaning a reaction vessel unit and to a method for cleaning such a centrifuge. The centrifuge has a rotor and a rotor chamber, in which the rotor is arranged and mounted, the rotor features a receiving area for receiving the reaction vessel unit. The rotor chamber is limited by a housing, the housing having an outlet to drain the liquid discharged from the reaction vessels and being provided with an inlet for filling the rotor chamber with a cleaning solution in such a way, when the rotor rotates, the rotor 2 is at least partially immersed in the cleaning solution and distributes it in rotor chamber and/or the inlet is designed in such a way that the cleaning solution is distributed in rotor chamber when it is supplied by the rotating rotor.

A chemical transfer coupler including an inlet, an outlet, a chemical flow chamber fluidly connecting the inlet and the outlet, and a probe. The probe extends through the chemical flow chamber and includes a rinse aperture, a probe end fitting, and a first recessed slot. The probe end fitting includes a first end, a second end, and an outer surface. The first recessed slot extends helically along the outer surface from the first end to the second end. The chemical flow chamber fluidly couples the rinse aperture and the outlet. The first recessed slot is positioned at least partially along a flow path extending between the rinse aperture and the outlet.

A vessel rinsing apparatus including a mounting base, a fluid discharge member including a plurality of nozzles, a valve member operably coupled to the fluid discharge member and configured to control water flow through the nozzles, and an escutcheon supported by the mounting base.

A vessel rinsing apparatus including a mounting base, a fluid discharge member including a plurality of nozzles, a valve member operably coupled to the fluid discharge member and configured to control water flow through the nozzles, and an escutcheon supported by the mounting base.

Provided are methods and systems for cleaning various semiconductor substrate storage articles, in particular, FOUP doors. The FOUP doors and other similar articles often have openings that may get contaminated with cleaning liquids if not covered. The described cleaning system includes contact points for engaging the article and covering these openings. The contact points may be also used for supporting the article and for pressurizing the openings in the article with a gas. The gas may be supplied through one or more contact points. It prevents liquids from getting into the openings if even the openings are not completely sealed. The pressurization may be maintained through the entire wet portion of the cleaning process. The article may be rotated within the cleaning system while cleaning and/or other liquids or gases are dispensed through a set of spraying nozzles. Spraying nozzles may move to enhance cleaning of the article.

Provided are methods and systems for cleaning various semiconductor substrate storage articles, in particular, FOUP doors. The FOUP doors and other similar articles often have openings that may get contaminated with cleaning liquids if not covered. The described cleaning system includes contact points for engaging the article and covering these openings. The contact points may be also used for supporting the article and for pressurizing the openings in the article with a gas. The gas may be supplied through one or more contact points. It prevents liquids from getting into the openings if even the openings are not completely sealed. The pressurization may be maintained through the entire wet portion of the cleaning process. The article may be rotated within the cleaning system while cleaning and/or other liquids or gases are dispensed through a set of spraying nozzles. Spraying nozzles may move to enhance cleaning of the article.

In a method for carrying out a cleaning procedure for a cooking appliance, a first tank of the cooking appliance is filled by a user with water. A first portion of water in the first tank is moved into a buffer store and then moved from the buffer store into a cooking chamber to provide a first treatment agent therein. The first treatment agent remains in the cooking chamber for a first time period. A second portion of water in the first tank is moved into the buffer store and the first treatment agent is moved into the first tank. The second portion of water in the buffer store is into the cooking chamber to provide a second treatment agent in the cooking chamber. The second treatment agent remains in the cooking chamber for a second time period and the second treatment agent is then moved into the first tank.

This invention provides a method and a system for cleaning a container for storing wafers or masks. A contained with lid is washed directly after the container is loaded with lid opened in the cleaning system. Gas exchange rate in the washing station can be increased such that particles or AMC inside the container or attached to the lid can be carried out more easily. Then, contamination-free gas is purged to the container as well as lid in a high temperature environment. A vacuum station can be optionally adapted between the washing station and the contamination-free gas purging station to enhance the cleanliness of the container.