Patent classifications
B21J15/048
Method for joining at least one component to a second component without preformed hole(s)
A joining method for connecting a first component to a second component without pre-punching. The first component and the second component are positioned relative to one another prior to the connection by an auxiliary joining element, which is joined via a joining device to the components positioned relative to one another. The auxiliary joining element firstly passes through the first component without pre-punching and is then connected to the second component without pre-punching. Before the components are connected by the auxiliary joining element, the first component is thermally pre-treated at the joining area via an electric arc formed between the first component and an electrode of the joining device. A heat-affected zone is formed on the first component in the joining area, and the first component in is weakened or melted in the heat-affected zone.
METHOD FOR JOINING AT LEAST ONE COMPONENT TO A SECOND COMPONENT WITHOUT PREFORMED HOLE(S)
A joining method for connecting a first component to a second component without pre-punching. The first component and the second component are positioned relative to one another prior to the connection by an auxiliary joining element, which is joined via a joining device to the components positioned relative to one another. The auxiliary joining element firstly passes through the first component without pre-punching and is then connected to the second component without pre-punching. Before the components are connected by the auxiliary joining element, the first component is thermally pre-treated at the joining area via an electric arc formed between the first component and an electrode of the joining device. A heat-affected zone is formed on the first component in the joining area, and the first component in is weakened or melted in the heat-affected zone.