A sliding member includes a back-metal layer including an Fe alloy and a sliding layer including a copper alloy including 0.5 to 12 mass % of Sn and the balance of Cu and inevitable impurities. A cross-sectional structure of the sliding layer includes first copper alloy grains in contact with a bonding surface and second copper alloy grains not in contact with the bonding surface. The first and second grains have an average grain size D1 and D2 respectively. D1 is 30 to 80 μm; and D1/D2=0.1 to 0.3. In the cross-sectional structure, the second grains includes third grains that includes internal grains therein that are not in contact with a grain boundary of the third grains. A total area S1 of the third grains and a total area of the second copper alloy grains S2 satisfy: S0/S2=0.25 to 0.80.

A sliding member includes a back-metal layer including an Fe alloy and a sliding layer including a copper alloy including 0.5 to 12 mass % of Sn and the balance of Cu and inevitable impurities. A cross-sectional structure of the sliding layer includes first copper alloy grains in contact with a bonding surface and second copper alloy grains not in contact with the bonding surface. The first and second grains have an average grain size D1 and D2 respectively. D1 is 30 to 80 m; and D1/D2=0.1 to 0.3. In the cross-sectional structure, the second grains includes third grains that includes internal grains therein that are not in contact with a grain boundary of the third grains. A total area S1 of the third grains and a total area of the second copper alloy grains S2 satisfy: S0/S2=0.25 to 0.80.

The purpose of the present invention is to provide: a slide member in which the bonding strength between a Bi-containing copper alloy layer and a substrate is enhanced; and a method for manufacturing the slide member. The slide member according to the present invention has a substrate and a copper alloy layer. The copper alloy layer comprises a copper alloy containing 4.0-25.0 mass % of Bi and has a structure in which Bi phases are scattered in a copper alloy structure. The volume ratio of Bi phases in the region of the copper alloy layer extending 10 m from the bonding interface with the substrate is not more than 2.0%. The slide member is manufactured by casting a molten copper alloy onto the substrate and causing the copper alloy to unidirectionally solidify.

The purpose of the present invention is to provide: a slide member in which the bonding strength between a Bi-containing copper alloy layer and a substrate is enhanced; and a method for manufacturing the slide member. The slide member according to the present invention has a substrate and a copper alloy layer. The copper alloy layer comprises a copper alloy containing 4.0-25.0 mass % of Bi and has a structure in which Bi phases are scattered in a copper alloy structure. The volume ratio of Bi phases in the region of the copper alloy layer extending 10 m from the bonding interface with the substrate is not more than 2.0%. The slide member is manufactured by casting a molten copper alloy onto the substrate and causing the copper alloy to unidirectionally solidify.

Provided is a sliding material including a substrate; and a copper alloy layer bonded to the substrate. The copper alloy includes 2.0 to 15.0% by mass of tin. The copper alloy layer includes a sliding body part including a sliding surface, and a gradient region including a bond surface with the substrate. A tin concentration in the gradient region reduces from the sliding body part toward the bond surface. A method for producing the siding material is also provided. The method includes preparing the substrate having a first surface and a second surface opposite to the first surface; melting the copper alloy; casting the molten copper alloy on the first surface of the substrate; and solidifying the copper alloy unidirectionally by cooling the substrate from the second surface by a coolant.

Provided is a sliding material including a substrate; and a copper alloy layer bonded to the substrate. The copper alloy includes 2.0 to 15.0% by mass of tin. The copper alloy layer includes a sliding body part including a sliding surface, and a gradient region including a bond surface with the substrate. A tin concentration in the gradient region reduces from the sliding body part toward the bond surface. A method for producing the siding material is also provided. The method includes preparing the substrate having a first surface and a second surface opposite to the first surface; melting the copper alloy; casting the molten copper alloy on the first surface of the substrate; and solidifying the copper alloy unidirectionally by cooling the substrate from the second surface by a coolant.