This invention relates to a silver sintering composition. In particular, the present invention relates to a silver sintering composition containing a copper alloy, which is capable of being stably sintered on various metal substrates such as copper, gold or silver with good adhesion and sintering strength.

The magnetic tape includes a magnetic layer having ferromagnetic powder and a binder on a non-magnetic support, in which the magnetic layer includes a timing-based servo pattern, the ferromagnetic powder is ferromagnetic hexagonal ferrite powder having an activation volume equal to or smaller than 1,600 nm.sup.3, and an edge shape of the timing-based servo pattern specified by a magnetic force microscope observation is a shape in which a difference (l.sub.99.9−l.sub.0.1) between a value l.sub.99.9 of a cumulative frequency function of 99.9% of a position deviation width from an ideal shape in a longitudinal direction of the magnetic tape and a value l.sub.0.1 of the cumulative frequency function of 0.1% thereof is equal to or smaller than 180 nm.

The magnetic tape includes a magnetic layer having ferromagnetic powder and a binder on a non-magnetic support, in which the magnetic layer includes a timing-based servo pattern, the ferromagnetic powder is ferromagnetic hexagonal ferrite powder having an activation volume equal to or smaller than 1,600 nm.sup.3, and an edge shape of the timing-based servo pattern specified by a magnetic force microscope observation is a shape in which a difference (l.sub.99.9−l.sub.0.1) between a value l.sub.99.9 of a cumulative frequency function of 99.9% of a position deviation width from an ideal shape in a longitudinal direction of the magnetic tape and a value l.sub.0.1 of the cumulative frequency function of 0.1% thereof is equal to or smaller than 180 nm.

A method for producing a catalyst or catalyst precursor is described including: applying a slurry of a particulate catalyst compound in a carrier fluid to an additive layer manufactured support structure to form a slurry-impregnated support, and drying and optionally calcining the slurry-impregnated support to form a catalyst or catalyst precursor. The mean particle size (D50) of the particulate catalyst compound in the slurry is in the range 1-50 μm and the support structure has a porosity ≧0.02 ml/g.

A method for producing a catalyst or catalyst precursor is described including: applying a slurry of a particulate catalyst compound in a carrier fluid to an additive layer manufactured support structure to form a slurry-impregnated support, and drying and optionally calcining the slurry-impregnated support to form a catalyst or catalyst precursor. The mean particle size (D50) of the particulate catalyst compound in the slurry is in the range 1-50 μm and the support structure has a porosity ≧0.02 ml/g.

The invention provides a power module substrate with a heat sink, which includes a power module substrate provided with an insulating substrate, a circuit layer provided on one surface of the insulating substrate and a metal layer provided on the other surface of the insulating substrate. The heat sink is bonded to the power module substrate via a bonding layer (30) to a surface on an opposite side to the insulating substrate of the metal layer. Bonding layer is a sintered body of silver particles, a porous body having a relative density in a range of 60% or more and 90% or less, and having a thickness in a range of 10 μm or more and 500 μm or less.

An objective of the present invention is to provide a sinterable bonding material capable of providing a bonded article having a long-term reliability. The present invention relates to a sinterable bonding material comprising a silver filler and resin particles, wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less; and the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200° C. or more. The sintered product of the sinterable bonding material of the present invention is excellent in bonding strength and heat-release characteristics, and has an improved stress relaxation ability.

A method is provided to fabricate a high-power module. A non-touching needle is used to paste a slurry on a heat-dissipation substrate. The slurry comprises nano-silver particles and micron silver particles. The ratio of the two silver particles is 9:1˜1:1. The slurry is pasted on the substrate to be heated up to a temperature kept holding. An integrated chip (IC) is put above the substrate to form a combined piece. A hot presser processes thermocompression to the combined piece to form a thermal-interface-material (TIM) layer with the IC and the substrate. After heat treatment, the TIM contains more than 99 percent of pure silver with only a small amount of organic matter. No volatile organic compounds would be generated after a long term of use. No intermetallic compounds would be generated while the stability under high temperature is obtained. Consequently, embrittlement owing to procedure temperature is dismissed.

Copper particles coated with at least one kind of a nitrogen-containing compound selected from hydrazinoethanol and a hydrazinoethanol salt.

The present invention provides a thick-film paste for printing the front side of a solar cell device having one or more insulating layers. The thick film paste comprises an electrically conductive metal, and a lead-tellurium-lithium-oxide dispersed in an organic medium.