B22F2007/047

PASTE COMPOSITION AND SEMICONDUCTOR DEVICE
20230238348 · 2023-07-27 · ·

This paste composition includes silver particles (A), a thermosetting resin (B), a curing agent (C), and a solvent (D). A shrinkage rate after curing of the paste composition is 15% or less.

METAL BODIES AND METHOD FOR PRODUCTION THEREOF
20220387986 · 2022-12-08 · ·

The present invention relates to methods for producing coated metal bodies by applying a metal powder composition to a metal body, such that a coated metal body is obtained, the coating of which contains one or more wax components; heating the coated metal body to the melting temperature of at least one of the wax components and subsequent cooling to room temperature, such that a coated metal body is obtained; and thermally treating the coated metal body in order to achieve alloy formation between metal portions of metal body and metal powder composition, wherein the metal body comprises nickel, cobalt, copper and/or iron and the metal powder composition comprises a metal component in powder form, which contains aluminium, silicon or magnesium in elemental or alloyed form. By melting and cooling the wax, the method makes metal bodies having a more uniform alloy coverage accessible. The invention furthermore relates to methods wherein the metal body is subsequently treated with a basic solution. The present invention additionally comprises the metal bodies obtainable by the method according to the invention, which find application as load-bearing and structural components, for example, and in catalyst converter technology.

SINTERING COMPOSITION

A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY

A copper paste for joining contains metal particles and a dispersion medium, in which the copper paste for joining contains copper particles as the metal particles, and the copper paste for joining contains dihydroterpineol as the dispersion medium. A method for manufacturing a joined body is a method for manufacturing a joined body which includes a first member, a second member, and a joining portion that joins the first member and the second member, the method including: a first step of printing the above-described copper paste for joining to at least one joining surface of the first member and the second member to prepare a laminate having a laminate structure in which the first member, the copper paste for joining, and the second member are laminated in this order; and a second step of sintering the copper paste for joining of the laminate.

METAL FOAM ELEMENT CONTAINING COBALT AND METHOD FOR PRODUCING SAME

The present invention relates to a method for producing supported catalysts, comprising: providing a metal foam element A, which consists of metallic cobalt, an alloy of nickel and cobalt, or an arrangement of layers of nickel and cobalt, lying one over the other; applying an aluminum-containing powder MP to metal foam element A in order to obtain metal foam element AX; thermally treating metal foam element AX to achieve alloy formation between metal foam element A and aluminum-containing powder MP, in order to obtain metal foam element B; oxidatively treating metal foam element B, in order to obtain metal foam element C; and applying a catalytically active layer, comprising at least one support oxide and at least one catalytically active component, to at least part of the surface of metal foam element C, in order to obtain a supported catalyst. The present invention further relates to the supported catalysts that can be obtained using the method and to the use of said supported catalysts in chemical transformations.

Process and Apparatus for Continuous Production of Porous Structures
20230051729 · 2023-02-16 ·

A method for producing metal-based micro-porous structures includes continuously feeding a solid green part and a gas flow into a tunnel reactor having an aspect ratio greater than 2, wherein the solid green part has a characteristic diffusion mass transfer dimension less than 1 mm and a gas in the gas flow is substantially free of oxidants, and chemically reacting the gas in the gas flow and the green part under a predetermined temperature profile along a length of the tunnel reactor for a sufficient time to convert the green part into a solid product having pore sizes in a range of 0.3 nm to 5 μm.

PHOTONIC SINTERED NANOINK, PHOTONIC SINTERING METHOD, AND CONDUCTIVE NANOSTRUCTURE

Provided is photo-sintering nano ink. The photo-sintering nano ink includes a photo-sintering precursor including a conductive nano particle and an oxide film surrounding the conductive nano particle, polymer binder resin, and an adhesive.

Process and apparatus for continuous production of porous structures
11486030 · 2022-11-01 · ·

An apparatus and process are presented for continuous production of metal-based micro-porous structures of pore sizes from 0.3 nm to 5.0 μm from a green part of characteristic diffusion mass transfer dimension less than 1 mm through chemical reactions in a continuous flow of gas substantially free of oxygen. The produced micro-porous structures include i) thin porous metal sheets of thickness less than 200 μm and pore sizes in the range of 0.1 to 5.0 μm, ii) porous ceramic coating of thickness less than 40 μm and ceramic particle sizes of 200 nm or less on a porous metal-based support structures of pore sizes in the range of 0.1 to 5 μm.

Composite material
11602922 · 2023-03-14 · ·

The present application can provide a composite material which comprises a metal foam, a polymer component and an electrically conductive filler, has other excellent physical properties such as impact resistance, processability and insulation properties while having excellent thermal conductivity, and is also capable of controlling electrical conductivity characteristics.

SILVER SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING OF ELECTRONIC COMPONENTS
20220324021 · 2022-10-13 ·

A silver sintering preparation in the form of a silver sintering paste comprising 70 to 95 wt.-% of coated silver particles (A) and 5 to 30 wt.-% of organic solvent (B) or in the form of a silver sintering preform comprising 74.5 to 100 wt.-% of coated silver particles (A) and 0 to 0.5 wt.-% of organic solvent (B), wherein the coating of the coated silver particles (A) comprises silver acetylacetonate (silver 2,4-pentanedionate) and/or at least one silver salt of the formula C.sub.nH.sub.2n+1COOAg with n being an integer in the range of 7 to 10, and wherein the at least one silver salt is thermally decomposable at >160° C.