A method of manufacturing is provided. The method can include determining a cross-sectional shape of an object to be inspected using a sensor configured with a sensor coil. The method can also include providing a substrate having a profile matching the cross-sectional shape of the object. The method can further include applying a dielectric material to the substrate in a patter matching a shape of the sensor coil. The method can also include forming a first layer of a first material on the dielectric material by sputtering particles of the first material on the dielectric material in the pattern and forming additional layers of the first material atop the first layer by iteratively depositing the additional layers in the pattern via an additive manufacturing technique. A sensor including a sensor coil formed via the method is also provided.

A method of manufacturing is provided. The method can include determining a cross-sectional shape of an object to be inspected using a sensor configured with a sensor coil. The method can also include providing a substrate having a profile matching the cross-sectional shape of the object. The method can further include applying a dielectric material to the substrate in a patter matching a shape of the sensor coil. The method can also include forming a first layer of a first material on the dielectric material by sputtering particles of the first material on the dielectric material in the pattern and forming additional layers of the first material atop the first layer by iteratively depositing the additional layers in the pattern via an additive manufacturing technique. A sensor including a sensor coil formed via the method is also provided.

Methods of forming microwires or nanowires, microwires or nanowires formed using the method, and electronic devices and semiconductor components including the wires. A method of forming a microwire or nanowire includes disposing a plurality of metal particles in a portion of a channel that is a nanochannel or a microchannel. The method includes etching the metal particles with an activation agent to form a flux that penetrates an additional portion of the channel. The flux includes an etching product of the activation agent and the metal particles. The method includes allowing the activation agent to at least partially evaporate to form a wire that is a microwire or a nanowire.

Methods of forming microwires or nanowires, microwires or nanowires formed using the method, and electronic devices and semiconductor components including the wires. A method of forming a microwire or nanowire includes disposing a plurality of metal particles in a portion of a channel that is a nanochannel or a microchannel. The method includes etching the metal particles with an activation agent to form a flux that penetrates an additional portion of the channel. The flux includes an etching product of the activation agent and the metal particles. The method includes allowing the activation agent to at least partially evaporate to form a wire that is a microwire or a nanowire.

A superconducting wire comprises a MgB.sub.2 filament, a base material, a high-thermal expansion metal, and a stabilizing material. The high-thermal expansion metal is a metal (for example, stainless steel) having a higher thermal expansion coefficient at room temperature than the MgB.sub.2 and the base material (for example, iron or niobium). The manufacturing method includes a step of packing a mixed powder in a first metal pipe, a step of performing wire-drawing on the first metal pipe formed of the metal to be the base material, a step of producing a composite wire by accommodating the first metal pipe in a second metal pipe formed of the high-thermal expansion metal and the stabilizing material, a step of performing wire-drawing on the composite wire, and a step of performing heat treatment.

A superconducting wire comprises a MgB.sub.2 filament, a base material, a high-thermal expansion metal, and a stabilizing material. The high-thermal expansion metal is a metal (for example, stainless steel) having a higher thermal expansion coefficient at room temperature than the MgB.sub.2 and the base material (for example, iron or niobium). The manufacturing method includes a step of packing a mixed powder in a first metal pipe, a step of performing wire-drawing on the first metal pipe formed of the metal to be the base material, a step of producing a composite wire by accommodating the first metal pipe in a second metal pipe formed of the high-thermal expansion metal and the stabilizing material, a step of performing wire-drawing on the composite wire, and a step of performing heat treatment.

Systems and methods for the manufacture of a solid wire using additive manufacturing techniques are disclosed. In one embodiment, a fine powdery material is sintered or melted or soldered or metallurgically bonded onto a metal strip substrate in a compacted solid form or a near-net shape (e.g., a near-net solid wire shape) before being turned into a final product through forming or drawing dies.

Systems and methods for the manufacture of a solid wire using additive manufacturing techniques are disclosed. In one embodiment, a fine powdery material is sintered or melted or soldered or metallurgically bonded onto a metal strip substrate in a compacted solid form or a near-net shape (e.g., a near-net solid wire shape) before being turned into a final product through forming or drawing dies.

A porous metal foil and porous metal wire are described. Capacitor anodes made from either or both of the porous metal foil and porous metal wire are further described as well as methods to make same.

A method of making a metal-polymer composite includes dealloying metallic powder to yield porous metal particles, monitoring a temperature of the mixture, controlling the rate of combining, a maximum temperature of the mixture, or both, and combining the porous metal particles with a polymer to yield a composite. Dealloying includes combining the metallic powder with an etchant to yield a mixture. A metal-polymer composite includes porous metal particles having an average particle size of about 0.2 μm to about 500 μm and a thermoplastic or thermoset polymer. The polymer composite comprises at least 10 vol % of the porous metal particles. A powder mixture includes porous metal particles having an average particle size of about 0.2 μm to about 500 μm and a metal powder. The powder mixture includes about 1 wt % to about 99 wt % of the porous metal particles.