In a dimple processing method for forming dimples on a curved surface of a workpiece, a cutting tool having a cutting edge on a rod-shaped body is rotated about a central axis of the cutting tool. The workpiece is rotated about a first axis. The cutting tool or the workpiece moves on a virtual plane through which the first axis passes or on a plane parallel to the virtual plane. The cutting tool or the workpiece moves such that the tip end of the cutting tool follows the curved surface of the workpiece. The cutting edge forms one or more dimple on the curved surface each time the cutting tool rotates.