Chucks for supporting semiconductor wafers during certain processing operations are disclosed. The chucks may include a recessed region near the outer perimeter of the wafer that has one or more surfaces that face towards the wafer but are recessed therefrom so as to not contact the wafer around the perimeter of the wafer. The use of such a recessed region prevents direct thermally conductive contact between the chuck and the wafer, thereby allowing the wafer to achieve a more uniform temperature distribution in certain process conditions. This has the further effect of causing certain processing operations to be more uniform with respect to edge-center deposition (or etch) layer thickness.

Chucks for supporting semiconductor wafers during certain processing operations are disclosed. The chucks may include a recessed region near the outer perimeter of the wafer that has one or more surfaces that face towards the wafer but are recessed therefrom so as to not contact the wafer around the perimeter of the wafer. The use of such a recessed region prevents direct thermally conductive contact between the chuck and the wafer, thereby allowing the wafer to achieve a more uniform temperature distribution in certain process conditions. This has the further effect of causing certain processing operations to be more uniform with respect to edge-center deposition (or etch) layer thickness.

A method for machining a workpiece, includes: rotating a rotary tool around a rotation axis, the rotary tool including at least one edge positioned on an outer periphery of the rotary tool around the rotation axis; relatively moving the rotary tool toward the workpiece in a first direction so that the at least one edge cuts the workpiece by a predetermined depth while the rotary tool is rotated around the rotation axis; and relatively moving the rotary tool with respect to the workpiece in a second direction that is substantially perpendicular to the first direction and that is inclined to a third direction substantially perpendicular to the rotation axis and the first direction.

A cutting apparatus includes a cassette table on which a first cassette in which a frame unit, ring-shaped frame and wafer are housed, and a second cassette in which a simple wafer is housed. A first conveying unit having a first frame holding part holds the ring-shaped frame of the frame unit withdrawn from the first cassette and conveys the frame unit to a chuck table. A first wafer holding part holds the simple wafer withdrawn from the second cassette and conveys the simple wafer to the chuck table. A cutting unit cuts the wafer, and a second conveying unit conveys the frame unit from the chuck table to a cleaning unit. A second wafer holding part holds the cut simple wafer and conveys it from the chuck table to the cleaning unit.

A cutting apparatus includes a cassette table on which a first cassette in which a frame unit, ring-shaped frame and wafer are housed, and a second cassette in which a simple wafer is housed. A first conveying unit having a first frame holding part holds the ring-shaped frame of the frame unit withdrawn from the first cassette and conveys the frame unit to a chuck table. A first wafer holding part holds the simple wafer withdrawn from the second cassette and conveys the simple wafer to the chuck table. A cutting unit cuts the wafer, and a second conveying unit conveys the frame unit from the chuck table to a cleaning unit. A second wafer holding part holds the cut simple wafer and conveys it from the chuck table to the cleaning unit.

Certain embodiments of the present disclosure provide an acoustic inlet barrel of an engine. The acoustic inlet barrel may include an inner barrel configured to provide a boundary for directing airflow through the engine. The inner barrel may include an inner face sheet separated from an outer face sheet by an acoustic core. The inner barrel may include a plurality of elongated, non-circular perforations formed through the inner face sheet.

Certain embodiments of the present disclosure provide an acoustic inlet barrel of an engine. The acoustic inlet barrel may include an inner barrel configured to provide a boundary for directing airflow through the engine. The inner barrel may include an inner face sheet separated from an outer face sheet by an acoustic core. The inner barrel may include a plurality of elongated, non-circular perforations formed through the inner face sheet.

The present invention relates to a hybrid material processing method includes steps of: emitting a laser beam toward an intended-to-be-modified area intended on a workpiece by a laser to perform a property modification for the intended-to-be-modified area; applying an optical image positioning assisted equipment to perform a precise positioning for a modified area or a positioning marker on the workpiece, so as to align a machine tool to the modified area; and driving the machine tool to perform a processing for the modified area.

The present invention relates to a hybrid material processing method includes steps of: emitting a laser beam toward an intended-to-be-modified area intended on a workpiece by a laser to perform a property modification for the intended-to-be-modified area; applying an optical image positioning assisted equipment to perform a precise positioning for a modified area or a positioning marker on the workpiece, so as to align a machine tool to the modified area; and driving the machine tool to perform a processing for the modified area.

A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.