Disclosed are a method and a system for tin immersion and soldering of a core wire which includes: inserting a core wire row into molten tin vertically; moving the each core wire in the molten tin along a direction perpendicular to the core wire row to remove carbonized matter from each core wire on a moving direction side; pulling the each core wire out of the molten tin; and performing alignment, such that the inner core conductor of the each core wire on the moving direction side contacts with a bonding pad. According to the technical solution of the present disclosure, the carbonized matter on the core wire that aligned facing the bonding pad is removed, such that the temperature transfer effect of the automatic soldering is improved, the yield of the automatic soldering is improved, and the consistency and the yield of the automatic soldering are more stable.

A method of furnace-less brazing of a substrate is provided. The method includes providing a substrate having a brazing region thereon; disposing braze precursor material containing a nickel powder, an aluminum powder, and a platinum group metal powder on the brazing region; and initiating an exothermic reaction of the braze precursor material such that the exothermic reaction produces a braze material that reaches a braze temperature above the liquidus temperature for the braze material. A braze precursor material is also provided.

A method of furnace-less brazing of a substrate is provided. The method includes providing a substrate having a braze region thereon; disposing braze precursor material containing a nickel powder, an aluminum powder, and a platinum group metal powder on the braze region; and initiating an exothermic reaction of the braze precursor material such that the exothermic reaction produces a braze material that reaches a braze temperature above the solidus temperature of the braze material. A braze precursor material is also provided.

An active brazing material for the energy-efficient production of active-brazed connections that consists of layer sequences arranged on top of one another, the layer sequences of which consist of layers arranged on top of on another, the layer sequences of which each comprise at least one layer of brazing material, wherein the layers of brazing material of each layer sequence each contain at least one component of a base active braze and, in conjunction with each other, contain all components of the base active braze, the layer sequences of which each comprise at least one first reaction layer consisting of a first reactant to which at least one second reaction layer is directly adjacent in the active brazing material and consists of a second reactant that exothermally reacts with the first reactant, wherein an enthalpy of formation of the exothermic reaction of the reactants is greater than or equal to 45 kJ/mol—in particular, greater than or equal to 50 kJ/mol.

A method for manufacturing a power module substrate includes a first lamination step of laminating a ceramic substrate and a copper sheet through an active metal material and a filler metal having a melting point of 660° C. or lower on one surface side of the ceramic substrate; a second lamination step of laminating the ceramic substrate and an aluminum sheet through a bonding material on the other surface side of the ceramic substrate; and a heating treatment step of heating the ceramic substrate, the copper sheet, and the aluminum sheet laminated together, and the ceramic substrate and the copper sheet, and the ceramic sheet and the aluminum sheet are bonded at the same time.

A magnetic component with a rare-earth magnet is provided. The rare-earth magnet has a bronze coating that partially or entirely covers the surface of the rare-earth magnet. Further, the tin coating partially or entirely covers the bronze coating. A production process for the magnetic component as well as a soldering method for connecting the magnetic component with a substrate is also provided.

An example method of joining a first substrate with a second substrate includes applying a filler material between respective portions of the first substrate and the second substrate, the filler material including an electrically conducting and/or magnetic material, wherein the filler material and the respective portions define a joint; applying an alternating magnetic field to the joint to heat the electrically conducting material to a reaction temperature; in response to heating the electrically conducting material to the reaction temperature, energizing the joint using energy released from the electrically conducting material; cooling the joint to join the first substrate with the second substrate.

Nanometers thick conformal coatings deposited by atomic-layer deposition (ALD) onto the metal surface of an active braze joint modifies the surface chemistry to eliminate excess braze filler metal flow. Unlike other means used to prevent braze filler metal runout, the thin ALD coating does not hinder next assembly processes, does not require post-braze cleaning, and does not alter the base material mechanical properties.

Electrical insulating properties between adjacent copper plates are improved while a defect of a bonded substrate which is caused by concentration of stress to end portions of the copper plates is prevented. A bonded substrate includes a silicon nitride ceramic substrate, a copper plate, and a bonding layer. The copper plate and the bonding layer are disposed on the silicon nitride ceramic substrate. The bonding layer bonds the copper plate to the silicon nitride ceramic substrate. The bonding layer includes: an interplate portion between the silicon nitride ceramic substrate and the copper plate; and a protruding portion protruding from between the silicon nitride ceramic substrate and the copper plate. Exposure of the silicon nitride ceramic substrate is prevented at a position where the protruding portion is disposed.

Disclosed is a handle clamp for an exothermic mold. The clamp includes a pair of legs, each having a plurality of rods that are shaped to fit into engagement holes on sections of the mold. The rods of each leg engage with one section of the mold. Engagement brackets are rotatably disposed on one or more or the rods. The brackets each have a thumb bolt that can be extended toward a mold section connected with the clamp. When engaged with the mold section, the thumb bolt stabilizes the mold section on the handle. A detent mechanism is provided between the bracket and the leg of the handle. The detent mechanism releasably holds the bracket in one of a selected plurality of rotational positions with respect to the rod. By selecting different rotational positions for the brackets, the handle can be configured to engage with different configurations of mold. The thumb bolts that are biased toward the mold section by a spring. The bolts include a key that can be aligned or misaligned with a key slot on the bracket. By aligning the key with the key with the key slot, the bolt can be moved toward or away from the mold section under the biasing force of the spring. By misaligning the key and key slot, the bolt can be locked into engagement with the mold section or else held in a disengaged position.