B23K1/002

BATTERY PROTECTION CIRCUIT BOARD AND SOLDERING METHOD
20230051542 · 2023-02-16 ·

The present disclosure provides a battery protection circuit board and a preparation method thereof. The battery protection circuit board includes a first battery protection board and a second battery protection board, a hardness of the first battery protection board being greater than a hardness of the second battery protection board. The soldering method includes: preparing a first to-be-soldered region of the first battery protection board and preparing a second to-be-soldered region of the second battery protection board; preparing a first copper paste in the first to-be-soldered region of the first battery protection board and preparing a second copper paste in the second to-be-soldered region of the second battery protection board; and bonding the first to-be-soldered region of the first battery protection board and the second to-be-soldered region of the second battery protection board by the first copper paste and the second copper paste.

BATTERY PROTECTION CIRCUIT BOARD AND SOLDERING METHOD
20230051542 · 2023-02-16 ·

The present disclosure provides a battery protection circuit board and a preparation method thereof. The battery protection circuit board includes a first battery protection board and a second battery protection board, a hardness of the first battery protection board being greater than a hardness of the second battery protection board. The soldering method includes: preparing a first to-be-soldered region of the first battery protection board and preparing a second to-be-soldered region of the second battery protection board; preparing a first copper paste in the first to-be-soldered region of the first battery protection board and preparing a second copper paste in the second to-be-soldered region of the second battery protection board; and bonding the first to-be-soldered region of the first battery protection board and the second to-be-soldered region of the second battery protection board by the first copper paste and the second copper paste.

CONNECTING FUEL INJECTORS AND NOZZLES TO MANIFOLDS

A method includes joining a fuel plurality of injection components to a fuel manifold, wherein for each fuel injection component in the plurality of fuel injection components, a metallic joint is formed joining and sealing the fuel injection component to the manifold. A system includes a fuel manifold. A plurality of fuel injection components are connected in fluid communication with the fuel manifold with metallic joints sealing between each of the plurality of fuel injection components and the fuel manifold to prevent leakage from between the manifold and the plurality of fuel injection components.

Brazing apparatus and method for anode target plate
11701727 · 2023-07-18 · ·

A brazing apparatus and method for brazing an anode target plate of an X-ray generator are disclosed. The brazing apparatus comprises: a vacuum part for providing, during brazing, a vacuum environment at least for a target plate main body formed of an alloy, a brazing material, and a substrate; an induction brazing part for applying an induction current to the target plate main body, the brazing material and the substrate in the vacuum part so as to achieve heating to a temperature higher than the melting point of the brazing material, causing the substrate to be welded to the target plate main body through melting of the brazing material and a resulting reaction; and a directional energy welding part for applying a generated directional energy beam to a position of lower temperature determined on the target plate main body to perform heating.

Brazing apparatus and method for anode target plate
11701727 · 2023-07-18 · ·

A brazing apparatus and method for brazing an anode target plate of an X-ray generator are disclosed. The brazing apparatus comprises: a vacuum part for providing, during brazing, a vacuum environment at least for a target plate main body formed of an alloy, a brazing material, and a substrate; an induction brazing part for applying an induction current to the target plate main body, the brazing material and the substrate in the vacuum part so as to achieve heating to a temperature higher than the melting point of the brazing material, causing the substrate to be welded to the target plate main body through melting of the brazing material and a resulting reaction; and a directional energy welding part for applying a generated directional energy beam to a position of lower temperature determined on the target plate main body to perform heating.

Ni—Cr based alloy brazing material containing trace amount of V

Disclosed is a Ni—Cr-based brazing alloy including, on the basis of mass %: 15%<Cr<30%; 3%<P<12%; 0%≤Si<8%; 0.01%<C<0.06%; 0%≤Ti+Zr<0.1%; 0.01%<V<0.1%; 0%≤Al<0.01%; 0.005%<O<0.025%; 0.001%<N<0.050%; 0%≤Nb<0.1%; and the balance being Ni and incidental impurities. Inequality (1): 0.2≤0.24V %/C %≤1.0 is satisfied if the alloy contains no Nb, and Inequality (2): 0.2≤(0.24V %+0.13Nb %)/C %≤1.0 is satisfied if the alloy contains Nb. Also disclosed is an inexpensive Ni—Cr-based brazing alloy containing a trace amount of V for use in the production of stainless steel heat exchangers and other steel articles. The alloy has a low liquidus temperature and high corrosion resistance, and achieves high brazing strength.

Ni—Cr based alloy brazing material containing trace amount of V

Disclosed is a Ni—Cr-based brazing alloy including, on the basis of mass %: 15%<Cr<30%; 3%<P<12%; 0%≤Si<8%; 0.01%<C<0.06%; 0%≤Ti+Zr<0.1%; 0.01%<V<0.1%; 0%≤Al<0.01%; 0.005%<O<0.025%; 0.001%<N<0.050%; 0%≤Nb<0.1%; and the balance being Ni and incidental impurities. Inequality (1): 0.2≤0.24V %/C %≤1.0 is satisfied if the alloy contains no Nb, and Inequality (2): 0.2≤(0.24V %+0.13Nb %)/C %≤1.0 is satisfied if the alloy contains Nb. Also disclosed is an inexpensive Ni—Cr-based brazing alloy containing a trace amount of V for use in the production of stainless steel heat exchangers and other steel articles. The alloy has a low liquidus temperature and high corrosion resistance, and achieves high brazing strength.

Device and method for soldering contact elements with induction heat
11697167 · 2023-07-11 · ·

A device for inductively soldering at least one ferromagnetic contact element to at least one conductor structure on a nonmetallic plate, includes a system for fastening a plate during the soldering operation, at least one soldering tool having at least one induction loop or induction coil suitable for emitting a magnetic field, a system for mutually positioning the soldering tool and the contact element such that the switched-on magnetic field of the soldering tool reliably heats the ferromagnetic contact element and thus the solder joint, a generator that is suitable for generating an alternating voltage with a frequency of up to 1500 kHz and that can be connected to the induction loop or induction coil.

Device and method for soldering contact elements with induction heat
11697167 · 2023-07-11 · ·

A device for inductively soldering at least one ferromagnetic contact element to at least one conductor structure on a nonmetallic plate, includes a system for fastening a plate during the soldering operation, at least one soldering tool having at least one induction loop or induction coil suitable for emitting a magnetic field, a system for mutually positioning the soldering tool and the contact element such that the switched-on magnetic field of the soldering tool reliably heats the ferromagnetic contact element and thus the solder joint, a generator that is suitable for generating an alternating voltage with a frequency of up to 1500 kHz and that can be connected to the induction loop or induction coil.

Magnetic-field melting solder, and joining method in which same is used

A magnetic-field melting solder that melts by the action of an AC magnetic field is provided. The magnetic-field melting solder includes solder material; and magnetic material composing of ferrite or Ni, a proportion of the magnetic material to the entire magnetic-field melting solder being 0.005% to 5% by weight. A joining method using the magnetic-field melting solder includes providing the magnetic-field melting solder between an electrode on a substrate and an electrode of an electronic component, and joining together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the magnetic-field melting solder.