A method of connecting two CMC substrates that includes providing two substrates; placing one substrate approximate to the other substrate, such that at least a portion of the two substrates overlap and define a brazing area; placing a brazing material approximate the brazing area; defining a primary raster pattern that encompasses the brazing area and a portion of the two substrates outside the brazing area; defining a secondary raster pattern that encompasses the brazing area; allowing a laser to scan the primary raster pattern to preheat the brazing area to a temperature below the brazing material's melting point; allowing the laser to scan the secondary raster pattern to heat the brazing area to a temperature that is above the brazing material's melting point; melting and allowing the brazing material to flow within the brazing area; and cooling the brazing area to form a brazed joint connecting the two substrates.

The present invention discloses a solder paste laser induced forward transfer device and method. The device comprises a laser, a beam shaping module, an optical path adjustment module, a solder paste transfer module and a computer control system, wherein the laser is connected to the beam shaping module, followed by the optical path adjustment module, and the solder paste transfer module is located below the optical path adjustment module. The beam shaping module comprises a beam expanding lens, an aperture, a flat-top beam shaper and a spatial light modulator. The optical path adjustment module comprises a two-dimensional galvanometer and an f-θ lens. The solder paste transfer module consists of a transparent substrate, a solder paste film, a clamp, a Z-axis lifting table, a receiving substrate, and an XYZ precise moving platform. The computer control system consists of a computer and drivers of other devices. The device and method can achieve mask-free, non-contact and high-precision solder paste transfer, thereby greatly shortening the production cycle and reducing the production cost.

The invention relates to a method for fusing a solder material deposit by means of laser energy, in which laser radiation emitted from a first laser source is applied to the solder material deposit in a first application phase by means of a first laser device (11) and laser radiation emitted from a second laser source is applied to the solder material deposit in a second application phase by means of a second laser device (12), said first laser source having a lower laser power than the second laser source, a switch being made from the first application phase to the second application phase by means of a switching device (30) and said switch being triggered by a temperature sensor, by means of which the temperature of the solder material deposit is measured at least during the first application phase.

Joining apparatus for joining joining elements onto workpieces, comprising a joining element holding device, which is configured to radially hold a joining element, and comprising a loading pin arrangement, which is configured to slide a joining element axially into a holding position in the joining element holding device, and/or to axially support the joining element during a joining process, wherein the loading pin arrangement has a loading pin, which is slidable by means of a loading pin actuator arrangement in the direction of the joining element holding device. The loading pin arrangement is here designed to variably establish a loading pin stroke of the loading pin between at least two stages, so that in a first stage the loading pin is displaceable less far in the direction of the joining element holding device than in a second stage.

A method comprising applying braze to a joint location of two work pieces and applying local heating to the joint location of the two work pieces until braze melting temperature is achieved to melt the braze while maintaining temperature of more remote portions of each work piece. The method includes reducing heating of the braze to form a braze joint joining the joint location of the two work pieces.

A method comprising applying braze to a joint location of two work pieces and applying local heating to the joint location of the two work pieces until braze melting temperature is achieved to melt the braze while maintaining temperature of more remote portions of each work piece. The method includes reducing heating of the braze to form a braze joint joining the joint location of the two work pieces.

A method for selectively adhering braze powders to a surface comprises applying a braze powder to a surface, and then directing a laser beam onto the braze powder while the laser beam moves along a predetermined path relative to the surface. The laser beam selectively heats the braze powder along the predetermined path such that the braze powder is sintered and bonded to the surface. Thus, a braze deposit is formed at one or more predetermined locations on the surface. After forming the braze deposit, excess braze powder, that is, the braze powder not selectively heated by the laser, is removed from the surface.

Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.

There is provided a method which includes placing a component on a substrate and extending an alignment member through an opening in the substrate. Once the alignment member is extended through the opening, the component is moved to abut against the alignment member to align the component relative to the substrate. After the component is aligned relative to the substrate, the component is secured to the substrate and the alignment member is retracted through the opening.

A laser soldering system includes a laser source module, a polarization adjusting assembly, a temperature sensor, and a controller. The laser source module is configured to emit a laser beam. The polarization adjusting assembly includes a plurality of polarization elements and at least one stepping motor. The polarization elements are configured to split the laser beam into a Gaussian beam and a ring-shaped beam. The Gaussian beam illuminates the first element, and the ring-shaped beam is illuminates the second element. The stepping motor is configured to adjust a size of the ring-shaped beam. The temperature sensor is configured to monitor temperatures of the first element and a temperature of the second element. The controller is electrically connected to the temperature sensor, the laser source module, and the polarization adjusting assembly.