An aluminum-alloy-clad plate in which a plurality of aluminum alloy layers are layered and diffusion heat treatment is performed thereon, wherein aluminum alloy layers having a specific composition are layered so as to each have a different content Mg or Zn, the structure of the aluminum alloy clad plate after diffusion heat treatment thereof has a minute crystal grain diameter and a predetermined amount of a specific Mg and Zn inter-diffusion region in which Mg and Zn of layered aluminum alloy layers are diffused with each other, and increased strength and high moldability are obtained at the same time.

The present invention relates to a nickel-based superalloy for diffusion bonding, which includes a surface depletion layer in a state in which an aluminum (Al) or titanium (Ti) content is depleted, the surface depletion layer being formed to a depth of 50 μm or less from a surface for diffusion bonding, and a method for diffusion bonding using the same.

The present invention relates to a nickel-based superalloy for diffusion bonding, which includes a surface depletion layer in a state in which an aluminum (Al) or titanium (Ti) content is depleted, the surface depletion layer being formed to a depth of 50 μm or less from a surface for diffusion bonding, and a method for diffusion bonding using the same.

This method for producing a structure wherein base materials are bonded by atomic diffusion comprises: a step for applying a liquid resin on the base material; a step for smoothing the surface of the liquid resin by surface tension; a step for forming a resin layer by curing; a step for forming a metal thin film on the resin layer; a step for forming a metal thin film on the base material; and a step for bringing the metal thin film of the base material and the metal thin film of the base material into close contact with each other, thereby bonding the metal thin film of the resin layer and the metal thin film of the base material with each other by atomic diffusion.

A method includes applying a bond layer of a first chemical composition to a first surface of a first metal body. The metal body is of a second chemical composition. The method further includes disposing a second metal body of the second chemical composition against the first metal body such that the bond layer is between the first surface of the first metal body and a second surface of the second metal body. The metal bodies are resistant to diffusion bonding. The bond layer facilitates diffusion bonding of the metal bodies. The method further includes heating the first metal body and the second metal body. The method further includes applying pressure to press the second metal body against the first metal body. The method further includes generating a diffusion bond between the metal bodies, responsive to the heating and the applying of pressure for a duration.

A method for selectively adhering braze powders to a surface comprises applying a braze powder to a surface, and then directing a laser beam onto the braze powder while the laser beam moves along a predetermined path relative to the surface. The laser beam selectively heats the braze powder along the predetermined path such that the braze powder is sintered and bonded to the surface. Thus, a braze deposit is formed at one or more predetermined locations on the surface. After forming the braze deposit, excess braze powder, that is, the braze powder not selectively heated by the laser, is removed from the surface.

A wafer processing method for processing a wafer formed on a front surface thereof with a plurality of devices having projection-shaped electrodes, the devices being partitioned by streets, includes a cutting step of holding a back surface of the wafer by a holding surface of a chuck table and cutting head portions of the projection-shaped electrodes by a cutting tool slewed in parallel to the holding surface, to make uniform the electrodes in height and expose metallic surfaces; a thermocompression bonding sheet laying step of laying a thermocompression bonding sheet on the front surface of the wafer; a thermocompression bonding step of heating and pressing the thermocompression bonding sheet to perform thermocompression bonding; and a peeling step of peeling off the thermocompression bonding sheet from the wafer, before dividing the wafer into individual device chips and bonding the electrodes to a circuit board.

A method and an apparatus for the pressure-sintering connection of a first and a second connection provide a frame element lowerable onto a frame surface surrounding the supporting surface, having a sintering ram lowerable lowered from the normal direction onto the second connection partner and exerts pressure thereon, and converting a sintering paste between the connection partners into a sintered metal, and having an auxiliary apparatus for the arrangement of a separating film for the peripheral covering of the frame surface and the connection partners. This arrangement of the separating film produces an inner region bounded by the frame element and bounded by a separating film portion within the frame element and by the supporting surface, and injection opening and an outlet opening allow a second gas to flush through said inner region from the injection opening to the outlet opening and displace a first gas.

A method for joining two components of a meltable material comprises the steps of providing a first component having a first border region and a second component having a second border region, placing the second component relative to the first component so as to form an overlap between the first border region and the second border region under a gap between the first border region and the second border region, continuously heating opposed sections of the first border region and the second border region at the same time through at least one energy source arranged in the gap at least partially, continuously providing a relative motion of the at least one energy source along the first border region and the second border region in the gap, and continuously pressing already heated sections of the first border region and the second border region onto each other.

A method of diffusion bonding metal or metal alloy containing workpieces, comprises (a) coating the bonding surfaces of the metal or metal alloy containing workpieces with a layer of a coating material, (b) abrading the coated bonding surfaces to remove surface oxide, the coating material being in liquid form, (c) removing excess coating material or excess abraded metal or metal alloy containing workpiece material from the coated bonding surfaces, and (d) diffusion bonding the coated bonding surfaces of the metal or metal alloy containing workpieces together. The coating material is operable to form a stable barrier on the bonding surfaces of the metal or metal alloy containing workpieces under ambient conditions, and evaporates from the bonding surfaces under diffusion bonding conditions. There is also a bonded workpiece formed using the method of diffusion bonding metal or metal alloy containing workpieces.