A mechanical vibration machining method or the like is suitable for allowing a probe to provide vibration to a horn with high efficiency. A horn portion is supported by a first support portion and a second support portion configured as a double-support structure. A first probe unit and a second probe unit are coupled to both ends of the horn portion. The first probe unit and the second probe unit vibrate the horn portion by means of vibration generated by a first generation unit and a second generation unit. The horn portion provides nodal points at which elongation and contraction alternately occur. For example, in a case in which the contact portion is arranged at the center of the horn portion, the second generation unit is oscillated with a phase that is the opposite of that of the first generation unit.

Various embodiments include an acoustic-energy deposition and repair system that includes at least one Directed Acoustic Energy Deposition (DAED) tool configured to apply acoustic energy to feedstock material in at least one of three vibrational modes; and a drive system to move the DAED tool in at least one of three-coordinate positions. In various examples, the acoustic-energy deposition and repair system further includes at least one in-situ metrology tool mounted proximal to the DAED tool to measure a grain size of deposited material. Other methods, devices, apparatuses, and systems are disclosed.

A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.

A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.

A method of sealing one or more openings provided in a wall of an aerofoil for a gas turbine engine, the aerofoil comprising at least one cavity which is at least partly filled with a vibration damping material, the method comprising steps to provide a metallic material onto the wall of the aerofoil in order to cover the opening and bond the metallic material to the wall of the aerofoil to seal the opening.

A method of sealing one or more openings provided in a wall of an aerofoil for a gas turbine engine, the aerofoil comprising at least one cavity which is at least partly filled with a vibration damping material, the method comprising steps to provide a metallic material onto the wall of the aerofoil in order to cover the opening and bond the metallic material to the wall of the aerofoil to seal the opening.

An ultrasonic machining device (1) for machining a workpiece. At least one component, selected from the group including a generator (11), a converter (12), a booster (13), a sonotrode (14), a HV cable (15), a machine frame (16) and a receiving device for the workpiece (17), is/are assigned an identifier (18). The identifier (18) characterizes at least one individual parameter of the component. The device (1) is assigned an input interface (19) which reads in the identifier (18) or generated data from the identifier. The device (1) is assigned a data processing arrangement (20). By way of the data processing arrangement (20), based on the read-in identifier (18) or the data generated from the identifier (18), at least one parameter of the device (1) is determined in such a way that the device (1) is operated in a target operating state, e.g., a resonant vibrating state.

An ultrasonic machining device (1) for machining a workpiece. At least one component, selected from the group including a generator (11), a converter (12), a booster (13), a sonotrode (14), a HV cable (15), a machine frame (16) and a receiving device for the workpiece (17), is/are assigned an identifier (18). The identifier (18) characterizes at least one individual parameter of the component. The device (1) is assigned an input interface (19) which reads in the identifier (18) or generated data from the identifier. The device (1) is assigned a data processing arrangement (20). By way of the data processing arrangement (20), based on the read-in identifier (18) or the data generated from the identifier (18), at least one parameter of the device (1) is determined in such a way that the device (1) is operated in a target operating state, e.g., a resonant vibrating state.

Systems and methods are presented herein for a method of attaching a strip to a housing. An internal support member is inserted into a collapsible housing, such that it is arranged along a longitudinal axis of an inner surface of the collapsible housing. An outer support member is arranged along an outer surface the collapsible housing opposite the internal support member. A strip is positioned along the outer surface using the outer support member and the internal support member. Then the strip is permanently welded to the outer surface using a welding element. Welding is performed by a welding element located in one (or both) of the internal support member or the outer support member.

Systems and methods are presented herein for a method of attaching a strip to a housing. An internal support member is inserted into a collapsible housing, such that it is arranged along a longitudinal axis of an inner surface of the collapsible housing. An outer support member is arranged along an outer surface the collapsible housing opposite the internal support member. A strip is positioned along the outer surface using the outer support member and the internal support member. Then the strip is permanently welded to the outer surface using a welding element. Welding is performed by a welding element located in one (or both) of the internal support member or the outer support member.