Provided that is a marking machine for applying markings to an ingot having separating layers formed at a depth corresponding to a thickness of a wafer to be produced. The marking machine includes a reading unit configured to read the ingot information formed on the ingot, a control unit having a storage section configured to store the ingot information read by the reading unit, and a marking unit configured to mark, based on the ingot information stored in the storage section, information that includes the ingot information, to the wafer to be produced.

Described are a method and laser plotter for processing a job for cutting, engraving, marking and/or lettering a flat workpiece having at least one housing with a processing chamber formed for positioning a workpiece. The chamber has at least one irradiation source in the form of a laser and a control unit for controlling the sledge, which may be operated via a belt drive and has a focusing unit arranged movably thereon. Between the sledge and a processing surface of the processing chamber, an extraction bar is arranged for extracting the exhaust gases or vapors, respectively, produced by a laser beam during the processing of the workpiece. One or more extraction openings of the extraction bar are arranged or aligned, respectively, parallel to the processing surface for generating a horizontal extraction flow.

Provided is a laser mark printing method and a method of producing a laser-marked silicon wafer that can reduce the machining strain left around dots constituting a laser mark. In a method of printing a laser mark having a plurality of dots on a silicon wafer, the plurality of dots are formed using laser light having a wavelength in the ultraviolet region.

A laser marker has: a controller configured to oscillate a laser beam; and a head configured to scan a machining surface of a machining target with the laser light. The controller is configured to transmit, to the image processing apparatus, a command for instructing the image processing apparatus to perform a predetermined scene, when the controller is set to cause the image processing apparatus to perform the scene. When the command is received, the image processing apparatus is configured to calculate a deviation amount of the machining target relative to a reference position using image data of an image of the machining target captured by the marker head and to notify the deviation amount to the controller. The controller is configured to correct a position to be scanned with the laser beam based on the deviation amount and then cause the marker head to perform the scanning.

A laser marking method of performing marking by irradiating an object made of a resin with laser light, the laser marking method including: a first step of melting of carbonizing a first region of the object; and a second step of engraving a mark by irradiating a second region in the first region with the laser light.

Systems and methods for providing gaps in article or package processing. In some embodiments, the system can include a conveying path along which a first advanced article and a second advanced article can be advanced. The system can further include a first stop location and a second stop location. The first stop location can include movable fingers that are configured to raise to stop the advance of the articles and then lower at specific times to allow the articles to advance with specific distances between the articles. Additionally, the system can include a paddle that also raises and lowers. The paddle lowers to stop an advancing article again, and in doing so, front-end registers the article. Then the paddle can raise to allow the package to advance again along the conveyor.

The invention relates to marks used for marking gemstones, including diamonds or brilliants, and carrying information for various purposes, for example, identification codes. In particular, the marks are invisible to the naked eye, using magnifying glasses and various types of microscopes. The marks are located inside the volume of diamonds or brilliants without affecting their characteristics, resulting in damage to the quality of diamonds or brilliants. An optically permeable mark located inside the diamond or brilliant volume is disclosed. The mark contains predefined encoded information and consists of a given set of optically permeable elements of micron or submicron size, which represent areas of increased concentration of atomic defects in the diamond or brilliant crystal lattice. The atomic defects in the diamond or brilliant crystal lattice are vacancies and interstitials, wherein said information is encoded in at least two areas of increased concentration of said atomic defects.

A method of manufacturing cartridge cases, wherein the method comprises fabricating a plurality of substantially identically sized and shaped unmarked inventory cases suitable for use in manufacturing a plurality of different caliber cartridges and selecting a number of the plurality of the unmarked inventory cases to be used to manufacturing a selected one of the plurality different caliber cartridges. The method further comprises inscribing, via a laser inscription device, the selected number of unmarked inventory cases to identify at least the selected one of the plurality of different caliber cartridges the selected number of unmarked inventory cases are to be used to manufacture.

A method of manufacturing cartridge cases, wherein the method comprises fabricating a plurality of substantially identically sized and shaped unmarked inventory cases suitable for use in manufacturing a plurality of different caliber cartridges and selecting a number of the plurality of the unmarked inventory cases to be used to manufacturing a selected one of the plurality different caliber cartridges. The method further comprises inscribing, via a laser inscription device, the selected number of unmarked inventory cases to identify at least the selected one of the plurality of different caliber cartridges the selected number of unmarked inventory cases are to be used to manufacture.

A laser marking system for marking a predetermined pattern on a workpiece may include a first light source structured to emit first light at a first wavelength; a second light source structured to emit second light at a second wavelength different from the first wavelength and selected to mark a marking surface of the workpiece; beam shaping optics structured to adjust a focal length of the second light; beam steering optics structured to aim the first laser light and the second laser light; a controller configured to control the first light source to emit the first light at the marking surface of the workpiece and control the beam steering optics to aim the second light so as to mark the marking surface of the workpiece and create the first predetermined pattern; and a camera structured to detect first light reflected from the marking surface and record an image.