Patent classifications
B23K26/043
Optical axis adjusting method for laser processing apparatus
An optical axis adjusting method includes a position detecting step of emitting a laser beam from a laser oscillator, applying the laser beam to a processing point, and detecting the position of the laser beam by using a position detecting unit set at the processing point, a storing step of storing the position of the laser beam as detected in the position detecting step as a reference position, and an adjusting step of operating an adjusting mechanism of each optical component holder in the case that the position of the laser beam is deviated from the reference position after performing maintenance of each optical component, thereby adjusting the position of the laser beam so that the position of the laser beam is shifted back to the reference position.
Laser machine for cutting workpiece
A laser machine able to effectively satisfy cutting quality required on one side of a cutting spot of a workpiece. The laser machine comprising a machining head configured to emit a laser beam and an assist gas coaxially and non-coaxially; and a data table in which data of a machining condition for cutting a workpiece using the machining head, and a shift amount, by which a center axis of the assist gas is to be shifted from an optical axis of the laser beam in order to make cutting quality on both sides of a cutting line to be different during cutting the workpiece, are stored in associated with each other.
Marking system for decorating workpieces
A marking system for decorating one or more workpieces includes a plurality of marking stations that can mark product images on blank workpieces to produce product workpieces, at least some of which have different sizes, shapes, materials, or a combination thereof, a control system that can select one of the plurality of marking stations and send product image data to the selected one of the plurality of marking stations, and a robotic manipulator that can transport a blank workpiece to the selected marking station under the control of the robotic manipulator. The selected marking station can mark the product image the blank workpiece based on the product image data which produces a product workpiece. The robotic manipulator can remove the product workpiece from the selected one of the plurality of marking stations.
APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE
The inventive concept provides a mask treating method. The mask treating method includes treating a mask by supplying a liquid to the mask, and irradiating a laser to a region of the mask on which a specific pattern is formed while the liquid remains on the mask; moving an optical module including a laser unit configured to irradiate the laser between a process position for treating the substrate and a standby position deviating from the process position; and adjusting a state of the optical module at an inspection port provided at the standby position to a set condition before the optical module is moved to the process position.
ELECTROMAGNETIC RADIATION SYSTEM
An electromagnetic radiation system for directing an electromagnetic radiation beam (11) at a target (28) having a first arrangement (12) in which the radiation beam (11) is directed along a marking beam path that is within a marking range of the electromagnetic radiation system and a second arrangement (12, 15) in which the radiation beam (27) is directed along a different beam path (27) that is not within the marking range of the electromagnetic radiation system, wherein a positional relationship between the marking beam path (11) and the different beam path (27) satisfies a predetermined condition at the target (28) when the electromagnetic radiation system is at a predetermined distance (29) from the target (28).
Marking system for decorating workpieces
A marking system for decorating one or more workpieces includes a plurality of marking stations that can mark product images on blank workpieces to produce product workpieces, at least some of which have different sizes, shapes, materials, or a combination thereof, a control system that can select one of the plurality of marking stations and send product image data to the selected one of the plurality of marking stations, and a robotic manipulator that can transport a blank workpiece to the selected marking station under the control of the robotic manipulator. The selected marking station can mark the product image the blank workpiece based on the product image data which produces a product workpiece. The robotic manipulator can remove the product workpiece from the selected one of the plurality of marking stations.
Laser welding method
A plurality of values measured are relatively compared to determine an optical axis deviation direction in which an optical axis of a measurement beam S deviates from a laser beam L. In performing laser welding in the optical axis deviation direction, an irradiation position of the measurement beam S is changed so that the irradiation position of the measurement beam S is moved to a rear side of the center of the optical axis of the laser beam L in the welding direction.
Method of confirming optical axis of laser processing apparatus
A method of confirming an optical axis of a laser processing apparatus includes placing an image capturing unit so as to be movable in X-axis directions, removing a second mirror and capturing an image of a laser beam with the image capturing unit for receiving the laser beam reflected by a first mirror, installing the second mirror and capturing an image of the laser beam with the image capturing unit for receiving the laser beam reflected by a third mirror, and determining whether an optical axis of the laser beam reflected by the first mirror and an optical axis of the laser beam reflected by the third mirror exist in one XZ plane or not on the basis of the captured images and a reference line in the captured images.
Laser-beam material machining
A method performed by a laser machine includes: before a laser-beam machining process, recording an influence of a change in a position of at least one movable laser machine component on a lateral position of a focal point of a laser beam in a focal plane or relative to a reference point, storing an association between the position of the movable laser machine component and the lateral position, and then, setting, based on the stored association, the focal point to a preset lateral position in the focal plane or relative to the reference point by setting the position of the movable laser machine component. The movable laser machine component can include at least one of at least one optical element in a beam path of the laser beam, a laser-beam machining head in a work area of a laser machine, or a movable part of the laser-beam machining head.
Laser device and laser processing device using same
A laser device includes a laser oscillator configured to emit a laser beam, and an optical unit configured to receive the laser beam and emit the laser beam outside. The optical unit includes: a partially transmissive mirror configured to reflect a part of the laser beam toward the outside and transmit a remaining part of the laser beam; a diffusion plate configured to diffuse the laser beam which has passed through the partially transmissive mirror and deflect the laser beam in a predetermined direction, at a predetermined diffusion angle; and a photodiode configured to receive the laser beam deflected by the diffusion plate, and output an electric signal. The laser device is configured such that deviation of an optical axis of the laser beam is monitored based on the electric signal of the photodiode.