The present invention relates to ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays, as well as methods of making and/or using ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays. Such ultrafast laser inscribed structures are particularly adapted to condense broad band radiation, thus allowing increased sensing efficiencies to be obtained from imaging and/or sensing apparatuses. Such ultrafast laser inscribed structures can be efficiently produced by the processes provided herein.

A method of laser processing of a metallic material is described, by means of a focused laser beam having a predetermined transverse power distribution on at least one working plane of the metallic material, comprising the steps of: providing a laser beam emitting source; leading the laser beam along a beam transport optical path to a working head arranged in proximity to the material; collimating the laser beam along an optical axis of propagation incident on the material; focusing the collimated laser beam in an area of a working plane of the material; and conducting the focused laser beam along a working path on the metallic material comprising a succession of working areas, wherein the laser beam is shaped: by reflecting the collimated beam by means of a deformable, controlled surface reflecting element having a plurality of independently movable reflection areas, and by controlling the arrangement of the reflection areas to establish a predetermined transverse power distribution of the beam on at least one working plane of the metallic material as a function of the area of the current working plane and/or of the current direction of the working path on the metallic material.

A method of laser processing of a metallic material is described, by means of a focused laser beam having a predetermined transverse power distribution on at least one working plane of the metallic material, comprising the steps of: providing a laser beam emitting source; leading the laser beam along a beam transport optical path to a working head arranged in proximity to the material; collimating the laser beam along an optical axis of propagation incident on the material; focusing the collimated laser beam in an area of a working plane of the material; and conducting the focused laser beam along a working path on the metallic material comprising a succession of working areas, wherein the laser beam is shaped: by reflecting the collimated beam by means of a deformable, controlled surface reflecting element having a plurality of independently movable reflection areas, and by controlling the arrangement of the reflection areas to establish a predetermined transverse power distribution of the beam on at least one working plane of the metallic material as a function of the area of the current working plane and/or of the current direction of the working path on the metallic material.

A method of laser processing of a metallic material is described by means of a focused laser beam having a predetermined transverse power distribution on at least one working plane of the material, comprising the steps of: providing a laser beam emitting source; leading the laser beam along a beam transport optical path to a working head arranged in proximity to the material; collimating the laser beam along an optical axis of propagation incident on the material; focusing the collimated laser beam in an area of a working plane of the material; and conducting the focused laser beam along a working path on the metallic material comprising a succession of working areas, wherein the laser beam is shaped: by reflecting the collimated beam by means of a deformable controlled surface reflecting element having a plurality of independently movable reflection areas, and by controlling the arrangement of the reflection areas to establish a predetermined transverse power distribution of the beam on at least one working plane of the metallic material as a function of the area of the current working plane and/or of the current direction of the working path on the metallic material.

Angled, single laser weld and a method of forming an angled, single laser weld including arranging a first and second faying surfaces of a first and second component adjacently to form an interface between the components; irradiating at least one of the first and second components at the interface with a laser, wherein the first faying surface defines a plane formed at an angle alpha in the range of +/−5 degrees to 60 degrees from an axis A perpendicular to the first front surface and the second faying surface matches the first faying surface; and forming a junction at the interface with an hourglass shaped weld.

A method of laser welding a workpiece stack-up that includes at least two overlapping metal workpieces is disclosed. The method includes advancing a beam spot of a laser beam relative to a top surface of the workpiece stack-up and along a beam travel pattern to form a laser weld joint, which is comprised of resolodified composite metal workpiece material, that fusion welds the metal workpieces together. And, while the beam spot is being advanced along the beam travel pattern, between a first point and a second point, which may or may not encompass the entire beam travel pattern, at least one of the following laser beam parameters is repeatedly varied: (1) the power level of the laser beam; (2) the travel speed of the laser beam; or (3) the focal position of the laser beam relative to the top surface of the workpiece stack-up.

A semiconductor fabrication apparatus includes a source chamber being operable to generate charged particles; and a processing chamber integrated with the source chamber and configured to receive the charged particles from the source chamber. The processing chamber includes a wafer stage being operable to secure and move a wafer, and a laser-charged particles interaction module that further includes a laser source to generate a first laser beam; a beam splitter configured to split the first laser beam into a second laser beam and a third laser beam; and a mirror configured to reflect the third laser beam such that the third laser beam is redirected to intersect with the second laser beam to form a laser interference pattern at a path of the charged particles, and wherein the laser interference pattern modulates the charged particles by in a micron-zone mode for processing the wafer using the modulated charged particles.

A marking system for decorating one or more workpieces includes a plurality of marking stations that can mark product images on blank workpieces to produce product workpieces, at least some of which have different sizes, shapes, materials, or a combination thereof, a control system that can select one of the plurality of marking stations and send product image data to the selected one of the plurality of marking stations, and a robotic manipulator that can transport a blank workpiece to the selected marking station under the control of the robotic manipulator. The selected marking station can mark the product image the blank workpiece based on the product image data which produces a product workpiece. The robotic manipulator can remove the product workpiece from the selected one of the plurality of marking stations.

A method for laser welding two coated workpieces includes positioning an upper workpiece and a lower workpiece on top of each other and passing a first laser beam over the upper and lower workpieces from a side of the upper workpiece so as to at least partially evaporate the respective coating of each of the workpieces on their facing sides along a depletion trace. A second laser beam is passed over the workpieces from the side of the upper workpiece so as to melt a material of the two workpieces within the depletion trace, and thereby weld the workpieces to one another. In the first laser passing, the first laser beam melts the material of the upper workpiece, so that a web of non-melted material of the upper workpiece remaining between the melted material of the upper workpiece and the facing side of the upper workpiece.

The present invention relates to a laser welding method of pipe fittings that mainly provides an automated butt welding process for two pipe fittings to be welded, comprising a laser welding device setup step, a material loading step, a first welding step, a second welding step, a third welding step, and a return to the original position step. The welding zone at the butt joint location of the two pipe fittings to be welded is divided to undergo three procedures through the aforementioned steps, using a laser assembly in conjunction with a reflection assembly, to provide a consistent automated butt welding for two pipe fittings to be welded, in order to reduce the time consumed during the butt welding of pipe fittings and increase the speed of the production process.