A laser processing system includes: a first light irradiator including: a first light emitter to emit first laser light; and a first light scanner to scan a first region of a workpiece with the first laser light emitted from the first light emitter; a second light irradiator including: a second light emitter to emit second laser light; and a second light scanner to scan a second region different from the first region of the workpiece with the second laser light emitted from the second light emitter. The first light irradiator emits the first laser light to the first region of the workpiece in a first irradiation direction, the second light irradiator emits the second laser light to the second region of the workpiece in a second irradiation direction opposite to the first irradiation direction.

A system for welding a first component to a second component. The system includes a first laser head configured to emit a first laser beam and be movably disposable on a first side of the first component. The system further includes a second laser head configured to emit a second laser beam and be movably disposable on an opposing second side of the first component. The system further includes a controller configured to independently control a first power of the first laser beam and a second power of the second laser beam. The controller is also configured to independently and simultaneously control movement of the first laser head and movement of the second laser head relative to the first component.

A method for joining two components of a meltable material comprises the steps of providing a first component having a first border region and a second component having a second border region, placing the second component relative to the first component so as to form an overlap between the first border region and the second border region under a gap between the first border region and the second border region, continuously heating opposed sections of the first border region and the second border region at the same time through at least one energy source arranged in the gap at least partially, continuously providing a relative motion of the at least one energy source along the first border region and the second border region in the gap, and continuously pressing already heated sections of the first border region and the second border region onto each other.

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

A mask includes a mask sheet including an upper surface and a lower surface facing the upper surface, the mask sheet including an opening passing through the upper surface and the lower surface; and a mask frame that supports the mask sheet, the mask sheet includes a protrusion adjacent to the opening and protruding from the lower surface, and a recess adjacent to the protrusion and recessed from the lower surface toward the upper surface of the mask sheet.

A method for forming a connection between a busbar (1) and a contact section (20) comprising: providing a first conductive section (11) made from aluminum, providing a second conductive section (12) made from aluminum, wherein the second conductive section (12) includes the contact section (20) or is connected to the contact section (20) and wherein the second conductive section (12) is at least partially covered with nickel and/or tin creating a laser welding bond, in particular a laser welding seam (10), between the first conductive section (11) and the second conductive section (12), by laser welding.

A deposition apparatus and a deposition method are described. The deposition apparatus includes an accommodating element, a plurality of lasers and a carrier. The accommodating element is configured to accommodate a material. The lasers are disposed at a periphery of the accommodating element, and are configured to simultaneously emit a plurality of laser beams toward the material to melt the material to form a deposition liquid. The carrier is disposed under the accommodating element and the lasers, and are configured to carry the deposition liquid.

A flexure hinge with two material segments connected to each other via a material tapering to a thin spot which defines a pivot axis between the two material segments. The material segments are provided with recesses such that the strength existing in the thin spot with respect to normal stresses or bending stresses is kept largely constant within a distance from the thin spot.

A flexure hinge with two material segments connected to each other via a material tapering to a thin spot which defines a pivot axis between the two material segments. The material segments are provided with recesses such that the strength existing in the thin spot with respect to normal stresses or bending stresses is kept largely constant within a distance from the thin spot.

A method of forming an optical surface on an end portion of an optical fiber inserting the optical fiber through a ferrule bore of a ferrule so that the end portion extends past an end face on the ferrule. At least one laser beam is emitted from at least one laser and directed to the end face of the ferrule at a location spaced from the ferrule bore. The at least one laser beam is also directed at an angle relative to the end face of the ferrule so as to be incident on the end portion of the optical fiber after reflecting off the end face of the ferrule. The at least one laser is operated to cleave the end portion of the optical fiber, and the end face on the ferrule does not crack due to thermal expansion when the at least one laser is operated.