A first peel-off layer extending along a side surface of a truncated cone that has a first bottom surface positioned near a face side of a wafer and a second bottom surface positioned within the wafer and smaller in diameter than the first bottom surface, and a second peel-off layer extending along the second bottom surface of the truncated cone are formed in the wafer. Then, external forces are exerted on the wafer thicknesswise of the wafer, thereby dividing the wafer along the first peel-off layer and the second peel-off layer that function as division initiating points.

The present disclosure provides methods and systems for composite-to-metal hybrid bonded structures compromising the laser surface treatment on titanium alloys to promote adhesive bond performance. For example, a computer may be programmed to set a laser path corresponding to a predetermined geometric pattern. A laser may be coupled to the computer and apply a pulsed laser beam to a contact surface of the titanium alloy along the predefined geometric pattern. The laser may generate an open pore oxide layer on the contact surface of the substrate with a thickness of 100 and 500 nm. The open pore oxide layer may have a topography corresponding to the predefined geometric pattern. The topography may contain high degree of open pore structure and promote adhesive bond performance. Adhesive, primer or composite resin matrix may fully infiltrate into the open pore structures. Adhesive and composite laminate may co-cure to form composite-to-titanium hybrid bonded structures.

A pulsed laser printing module for a contact lens, comprises a steel mold, a pulsed laser device and a forming case. The steel mold is configured for transferring pigment. The pulsed laser device is configured for transmitting ultrashort laser pulses having pulse time widths less than 10.sup.−9 seconds. The ultrashort laser pulses etch the surface of the steel mold to remove a coating of the steel mold to form an etched layer. The forming case has a lower member and an upper member. The lower member is a concavity, and an inner surface of the lower member is provided with a lower curved surface. The upper member is provided with a protrusion corresponding to the lower member, and an outer surface of the protrusion is provided with an upper curved surface corresponding to the lower curved surface. The protrusion is capable of being placed in a concavity of the lower member to form a gap between the lower curved surface and the upper curved surface.

Provided herein are manufacturing methods, e.g., comprising: (1a) forming a layer, including: depositing a starting material including a mixture of a metal and a sacrificial material; and applying a laser beam to the deposited starting material to consolidate the deposited starting material and form the layer; (1b) optionally repeating (1a) one or more times; and (1c) at least partially removing the sacrificial material to form a porous metal part.

According to the present disclosure, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, so as to contribute in improving the safety property of the secondary battery. The manufacturing method of the electrode plate herein disclosed includes a precursor preparing step for preparing an electrode precursor 20A including an active material provided area A1 in which an electrode active material layer 24 is provided on a surface of the electrode core 22 and including a core exposed area A2 in which the electrode active material layer 24 is not provided and the electrode core 22 is exposed, and an active material provided area cutting step for cutting the active material provided area A1 by a pulse laser, and a core exposed area cutting step for cutting the core exposed area A2 by the pulse laser. Then, in the case where the pulse width (ns) of the pulse laser is represented by X and the lap rate (%) is represented by Y for the core exposed area cutting step, a condition represented by Y≥−3log X+106 is satisfied. According to the manufacturing method of the electrode plate as described above, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, and thus it is possible to contribute in improving the safety property of the secondary battery.

According to the present disclosure, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, so as to contribute in improving the safety property of the secondary battery. The manufacturing method of the electrode plate herein disclosed includes a precursor preparing step for preparing an electrode precursor 20A including an active material provided area A1 in which an electrode active material layer 24 is provided on a surface of the electrode core 22 and including a core exposed area A2 in which the electrode active material layer 24 is not provided and the electrode core 22 is exposed, and an active material provided area cutting step for cutting the active material provided area A1 by a pulse laser, and a core exposed area cutting step for cutting the core exposed area A2 by the pulse laser. Then, in the case where the pulse width (ns) of the pulse laser is represented by X and the lap rate (%) is represented by Y for the core exposed area cutting step, a condition represented by Y≥−3log X+106 is satisfied. According to the manufacturing method of the electrode plate as described above, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, and thus it is possible to contribute in improving the safety property of the secondary battery.

The present invention discloses a solder paste laser induced forward transfer device and method. The device comprises a laser, a beam shaping module, an optical path adjustment module, a solder paste transfer module and a computer control system, wherein the laser is connected to the beam shaping module, followed by the optical path adjustment module, and the solder paste transfer module is located below the optical path adjustment module. The beam shaping module comprises a beam expanding lens, an aperture, a flat-top beam shaper and a spatial light modulator. The optical path adjustment module comprises a two-dimensional galvanometer and an f-θ lens. The solder paste transfer module consists of a transparent substrate, a solder paste film, a clamp, a Z-axis lifting table, a receiving substrate, and an XYZ precise moving platform. The computer control system consists of a computer and drivers of other devices. The device and method can achieve mask-free, non-contact and high-precision solder paste transfer, thereby greatly shortening the production cycle and reducing the production cost.

A semiconductor mold laser cleaning device of an embodiment includes a laser generator oscillating a pulsed laser beam, an optical fiber transmitting the laser beam, a laser scanning module processing and transmitting the laser beam received through the optical fiber for cleaning the semiconductor mold, the laser scanning module including a laser beam collimator converting the laser beam scattered at one end of the optical fiber into parallel light, a Galvano laser scanner scanning the laser beam, a focal lens focusing the laser beam scanned by the Galvano laser scanner, and a final irradiation mirror redirecting the laser beam passed through the focal lens to deliver the redirected laser beam to the surface of the semiconductor mold, and a conveyance unit conveying the laser scanner module in an X-axis direction and/or a Y-axis direction such that the entire surface of the semiconductor mold can be cleaned.

The present invention relates to ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays, as well as methods of making and/or using ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays. Such ultrafast laser inscribed structures are particularly adapted to condense broad band radiation, thus allowing increased sensing efficiencies to be obtained from imaging and/or sensing apparatuses. Such ultrafast laser inscribed structures can be efficiently produced by the processes provided herein.

An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5J to about 10 J, an average power (defined as energy (J) x frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz.