Patent classifications
B23K26/0624
Thin-film devices and fabrication
Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.
METHOD FOR PRODUCING A LIGHT DEFLECTION STRUCTURE, USE OF A SUBSTRATE HAVING SUCH A LIGHT DEFLECTION STRUCTURE, AND LIGHT DEFLECTION UNIT HAVING SUCH A LIGHT DEFLECTION STRUCTURE
A method for producing a light deflection structure includes the steps of: a) producing a first plurality of interaction regions, in which at least one laser beam interacts with the substrate material along a first path with a spatial overlap of the interaction regions, b) producing a second plurality of interaction regions with a spatial overlap of the interaction regions along a second path offset with respect and with a spatial overlap with the first path, c) optionally producing a further plurality of interaction regions with a spatial overlap of the further interaction regions along a further path offset with respect to and with a spatial overlap with the path used immediately before, and d) optionally carrying out step c) multiple times. The method also includes producing type II modifications of the substrate material, and changing at least one process parameter from one beam path to another beam path.
METHOD FOR CORING AND SLICING A CVD DIAMOND PRODUCT AND APPARATUS FOR CARRYING IT OUT
The present disclosure relates to the field of Chemical Vapor Deposition (CVD) diamonds and their processing after fabrication. In particular, the present disclosures provides a method for coring and slicing a CVD diamond product, wherein the CVD diamond product comprises a CVD diamond and graphitized material covering several side-faces of the diamond. The method is carried out by an apparatus that provides a laser beam coupled into a fluid jet. The method comprises, for the coring, cutting the product with the laser beam to remove the graphitized material from the side-faces of the diamond. Further, the method comprises, for the slicing, cutting off one or more slices from the diamond with the laser beam.
Method for producing a layer of solid material
A method for producing a layer of solid material includes: providing a solid body having opposing first and second surfaces, the second surface being part of the layer of solid material; generating defects by means of multiphoton excitation caused by at least one laser beam penetrating into the solid body via the second surface and acting in an inner structure of the solid body to generate a detachment plane, the detachment plane including regions with different concentrations of defects; providing a polymer layer on the solid body; and generating mechanical stress in the solid body such that a crack propagates in the solid body along the detachment plane and the layer of solid material separates from the solid body along the crack.
Timepiece Component, Timepiece, And Method For Manufacturing Timepiece Component
A method for manufacturing a timepiece component includes: forming a first processed surface having a predetermined pattern by irradiating a surface of a receiving plate with a femtosecond laser; and forming a second processed surface having a surface roughness smaller than that of the first processed surface by irradiating at least a part of the first processed surface with a nanosecond laser.
Methods for removing interstitial material from superabrasive materials of cutting elements using energy beams
A method of forming a cutting element for an earth-boring tool may include directing at least one energy beam at a surface of a volume of polycrystalline superabrasive material including interstitial material disposed in regions between inter-bonded grains of polycrystalline superabrasive material. The method includes ablating the interstitial material with the at least one energy beam such that at least a portion of the interstitial material is removed from a first region of the volume of polycrystalline superabrasive material without any substantial degradation of the inter-bonded grains of superabrasive material or of bonds thereof in the first region.
METHOD FOR MACHINING A MATERIAL
A method for machining a material using a pulsed laser includes introducing a sequence of laser pulses into the material for machining the material, and synchronizing a start of each sequence with a fundamental frequency of the laser. The sequence of laser pulses comprises at least two different sequence elements that are offset from one another in space and time. Each sequence element comprises an individual laser pulse, a specific succession of individual laser pulses, or a burst of laser pulses. Specific sequence element properties are impressed on each sequence element. The sequence element properties comprise a position of the laser focus of a respective sequence element. The position of the laser focus of each sequence element of the sequence is adapted for each sequence element.
METHOD FOR SEPARATING A WORKPIECE
A method for separating a workpiece along a separation line by using laser pulses of a laser beam includes splitting the laser beam into a plurality of partial laser beams using a beam splitter optical unit, focusing the plurality of partial laser beams onto a surface of the workpiece and/or into a volume of the workpiece using a focusing optical unit, so that the plurality of partial laser beams are arranged next to one another and spaced apart from one another along the separation line, and ablating material of the workpiece along the separation line by introducing the laser pulses of the plurality of partial laser beams into the workpiece. The laser power per partial laser beam is adjusted depending on an ablation depth obtained in the workpiece.
Laser apparatus for cutting brittle material
An apparatus for cutting brittle material comprises an aspheric focusing lens, an aperture, and a laser-source generating a beam of pulsed laser-radiation. The aspheric lens and the aperture form the beam of pulsed laser-radiation into an elongated focus having a uniform intensity distribution along the optical axis of the aspheric focusing lens. The elongated focus extends through the full thickness of a workpiece made of a brittle material. The workpiece is cut by tracing the optical axis along a cutting line. Each pulse or burst of pulsed laser-radiation creates an extended defect through the full thickness of the workpiece.
Surface texturing using energy pulses
A system includes an energy source, a focusing system, and a controller. The energy source is configured to output energy pulses to the focusing system. A chamber surrounds at least a portion of a metallic substrate and contains a liquid in contact with a surface of the metallic substrate. The controller is configured to cause the energy source to output energy pulses and cause the focusing system to focus a focal volume of the energy pulses at or near the surface of the metallic substrate that is in contact with the liquid to create micro-scale or smaller surface texturing on the metallic substrate.