In various embodiments, the beam parameter product and/or beam shape of a laser beam is adjusted by coupling the laser beam into an optical fiber of a fiber bundle and directing the laser beam onto one or more in-coupling locations on the input end of the optical fiber. The beam emitted at the output end of the optical fiber may be utilized to process a workpiece.

A beam positioner can be broadly characterized as including a first acousto-optic (AO) deflector (AOD) operative to diffract an incident beam of linearly polarized laser light, wherein the first AOD has a first diffraction axis and wherein the first AOD is oriented such that the first diffraction axis has a predetermined spatial relationship with the plane of polarization of the linearly polarized laser light. The beam positioner can include at least one phase-shifting reflector arranged within a beam path along which light is propagatable from the first AOD. The at least one phase-shifting reflector can be configured and oriented to rotate the plane of polarization of light diffracted by the first AOD.

A laser processing apparatus includes a laser light output section, a first scanner and a second scanner, a distance measurement light emitting section, a reference member which is arranged at a position which is the other end of a correction optical path formed with the distance measurement light emitting section as one end of the correction optical path and is arranged such that an optical path length of the correction optical path is a predetermined reference distance, a distance measurement light receiving section which receives distance measurement light reflected by the workpiece or the reference member, a distance measuring section which measures a distance to the workpiece or the reference member, and a distance correcting section which compares a measurement result of the distance to the reference member with the reference distance stored in advance to correct the measurement result obtained by the distance measuring section.

A method for joining two components of a meltable material comprises the steps of providing a first component having a first border region and a second component having a second border region, placing the second component relative to the first component so as to form an overlap between the first border region and the second border region under a gap between the first border region and the second border region, continuously heating opposed sections of the first border region and the second border region at the same time through at least one energy source arranged in the gap at least partially, continuously providing a relative motion of the at least one energy source along the first border region and the second border region in the gap, and continuously pressing already heated sections of the first border region and the second border region onto each other.

A waterjet-guided laser machine includes a laser source, an LED, a waterjet head, and a light sensor. The waterjet head includes a water inlet and a nozzle having an outlet for a discharging a waterjet. There is a laser optical path along which a pulsed laser beam travels to the nozzle outlet. There is also a light beam optical delivery path along which the light beam travels from the LED to the nozzle outlet. The light beam optical delivery path is coincident with the laser optical path in the nozzle. There is a light beam optical return path along which the light beam that is reflected off of a workpiece travels to the light sensor. The light beam optical return path is coincident with the laser optical path inside the nozzle and coincident with the light beam optical delivery path inside the nozzle.

A method of forming a cutting element for an earth-boring tool may include directing at least one energy beam at a surface of a volume of polycrystalline superabrasive material including interstitial material disposed in regions between inter-bonded grains of polycrystalline superabrasive material. The method includes ablating the interstitial material with the at least one energy beam such that at least a portion of the interstitial material is removed from a first region of the volume of polycrystalline superabrasive material without any substantial degradation of the inter-bonded grains of superabrasive material or of bonds thereof in the first region.

A manufacturing process of an element chip comprises a preparing step for preparing a substrate having first and second sides opposed to each other, the substrate containing a semiconductor layer, a wiring layer and a resin layer formed on the first side, and the substrate including a plurality of dicing regions and element regions defined by the dicing regions. Also, the manufacturing process comprises a laser grooving step for irradiating a laser beam onto the dicing regions to form grooves so as to expose the semiconductor layer along the dicing regions. Further, the manufacturing process comprises a dicing step for plasma-etching the semiconductor layer along the dicing regions through the second side to divide the substrate into a plurality of the element chips. The laser grooving step includes a melting step for melting a surface of the semiconductor layer exposed along the dicing regions.

A processing apparatus is equipped with: a first stage system that has a table on which a workpiece is placed and moves the workpiece held by the table; a beam irradiation system that includes a condensing optical system to emit beams; and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis of the condensing optical system is different from the first plane can be changed.

Laser processing head 10 includes housing 11 and a plurality of optical components. Housing 11 is provided with partition wall 11a, first and second light entrance ports 12a, 12b through which first and second laser beams A, B respectively enter, and light irradiation port 13. Laser processing head 10 includes first and second photodetectors 91b, 92a provided around first and second light entrance ports 12a, 12b, respectively. First photodetector 91b is disposed opposite to second photodetector 92a across partition wall 11a. First photodetector 91b receives light in the second wavelength band including the wavelength of second laser beam B, and second photodetector 92a receives light in the first wavelength band including the wavelength of first laser beam A.

This invention concerns a module for insertion into an additive manufacturing apparatus. The module comprising a frame mountable in a fixed position in the additive manufacturing apparatus, the frame defining a build chamber and a dosing chamber. A build platform is movable in the build chamber for supporting a powder bed during additive manufacturing of a part. A dosing piston is movable in the dosing chamber to push powder from the dosing chamber. A mechanism mechanically links the build platform to the dosing piston such that downward movement of the build platform in the build chamber results in upward movement of the dosing piston in the dosing chamber.