A method of operating an apparatus for laser annealing, includes reducing temporal or spatial coherency of a plurality of laser beams by beam superimposing; and reducing an electric field inner product magnitude of beams having the reduced temporal or spatial coherency by a fly eye lens array to reduce coherency, and/or by modifying a polarization state between the beams by beam superimposing.

A beam shaper (1) for shaping a laser beam is provided, including a first beam shaping section (2) designed for shaping a central part of the laser beam, and a second beam shaping section (3) designed for shaping a peripheral part of the laser beam. Moreover, a device for laser beam treatment of a workpiece and a method for laser beam treatment of a workpiece are provided.

A beam shaper (1) for shaping a laser beam is provided, including a first beam shaping section (2) designed for shaping a central part of the laser beam, and a second beam shaping section (3) designed for shaping a peripheral part of the laser beam. Moreover, a device for laser beam treatment of a workpiece and a method for laser beam treatment of a workpiece are provided.

The technology disclosed relates to high utilization of donor material in a writing process using Laser-Induced Forward Transfer. Specifically, the technology relates to reusing, or recycling, unused donor material by recoating target substrates with donor material after a writing process is performed with the target substrate. Further, the technology relates to target substrates including a pattern of discrete separated dots to be individually ejected from the target substrate using LIFT.

The present invention provides a microstructure in which evenly distributed crystal grains line up in parallel lines extending along the surface of the film, and a no-lateral-growth region left at each of locations exposed to both ends of a grain interface, which serves as a partition between the neighboring two crystal grains. According to the present invention, there are also provided: a method for forming a polycrystalline film, such as a thin polycrystalline silicon film, a thin aluminum film, and a thin copper film, which is flat and even, in surface, electrically uniform and stable, and mechanically stable; a laser crystallization device for use in manufacture of polycrystalline films, and a semiconductor device using the polycrystalline film and having good electrical property and increased breakdown voltage.

A laser irradiation apparatus includes a stage on which a substrate is provided, a laser irradiation unit which irradiates a laser to the substrate on the stage, an image acquiring unit which acquires an image of a predetermined region of the substrate, and a control unit electrically connected to the laser irradiation unit and the image acquiring unit, where the control unit calculates a brightness value corresponding to an average value of grayscale values of the image provided from the image acquiring unit, compares a calculated brightness value with a reference brightness value, and outputs data on performance of the laser based on a result of comparing the calculated brightness value with the reference brightness value.

A laser irradiation apparatus includes a stage on which a substrate is provided, a laser irradiation unit which irradiates a laser to the substrate on the stage, an image acquiring unit which acquires an image of a predetermined region of the substrate, and a control unit electrically connected to the laser irradiation unit and the image acquiring unit, where the control unit calculates a brightness value corresponding to an average value of grayscale values of the image provided from the image acquiring unit, compares a calculated brightness value with a reference brightness value, and outputs data on performance of the laser based on a result of comparing the calculated brightness value with the reference brightness value.

A thermal processing system is provided. The thermal processing system can include a processing chamber and a workpiece disposed within the processing chamber. The thermal processing system can include a heat source configured to emit light towards the workpiece. The thermal processing system can further include a tunable reflective array disposed between the workpiece and the heat source. The tunable reflective array can include a plurality of pixels. Each pixel of the plurality of pixels can include an electrochromatic material configurable in a translucent state or an opaque state. When the electrochromatic material of a pixel is configured in the translucent state, the light at least partially passes through the pixel. Conversely, transmission of light through a pixel is reduced when the electrochromatic material of the pixel is configured in the opaque state.

A thermal processing system is provided. The thermal processing system can include a processing chamber and a workpiece disposed within the processing chamber. The thermal processing system can include a heat source configured to emit light towards the workpiece. The thermal processing system can further include a tunable reflective array disposed between the workpiece and the heat source. The tunable reflective array can include a plurality of pixels. Each pixel of the plurality of pixels can include an electrochromatic material configurable in a translucent state or an opaque state. When the electrochromatic material of a pixel is configured in the translucent state, the light at least partially passes through the pixel. Conversely, transmission of light through a pixel is reduced when the electrochromatic material of the pixel is configured in the opaque state.

An apparatus for cutting brittle material comprises an aspheric focusing lens, an aperture, and a laser-source generating a beam of pulsed laser-radiation. The aspheric lens and the aperture form the beam of pulsed laser-radiation into an elongated focus having a uniform intensity distribution along the optical axis of the aspheric focusing lens. The elongated focus extends through the full thickness of a workpiece made of a brittle material. The workpiece is cut by tracing the optical axis along a cutting line. Each pulse or burst of pulsed laser-radiation creates an extended defect through the full thickness of the workpiece.