A laser soldering system includes a laser source module, a polarization adjusting assembly, a temperature sensor, and a controller. The laser source module is configured to emit a laser beam. The polarization adjusting assembly includes a plurality of polarization elements and at least one stepping motor. The polarization elements are configured to split the laser beam into a Gaussian beam and a ring-shaped beam. The Gaussian beam illuminates the first element, and the ring-shaped beam is illuminates the second element. The stepping motor is configured to adjust a size of the ring-shaped beam. The temperature sensor is configured to monitor temperatures of the first element and a temperature of the second element. The controller is electrically connected to the temperature sensor, the laser source module, and the polarization adjusting assembly.

The present invention discloses a laser scribing device that produces optimal scribing lines within a target substrate based on its thickness. This is accomplished by generating multiple or an optimum number of focal points, and dynamically adjusting the focal lengths of the focal points to create optimal distances between the scribing lines. The resulting scribing lines are efficient in breaking the target substrate. The position of the focal points and the distance between them are determined based on the thickness of the target substrate, and the distance between focal points or scribing lines can be dynamically adjusted by modifying the focal lengths of the focal points.

The present invention discloses a laser scribing device that produces optimal scribing lines within a target substrate based on its thickness. This is accomplished by generating multiple or an optimum number of focal points, and dynamically adjusting the focal lengths of the focal points to create optimal distances between the scribing lines. The resulting scribing lines are efficient in breaking the target substrate. The position of the focal points and the distance between them are determined based on the thickness of the target substrate, and the distance between focal points or scribing lines can be dynamically adjusted by modifying the focal lengths of the focal points.

A method for joining two components of a meltable material comprises the steps of providing a first component having a first border region and a second component having a second border region, placing the second component relative to the first component so as to form an overlap between the first border region and the second border region under a gap between the first border region and the second border region, continuously heating opposed sections of the first border region and the second border region at the same time through at least one energy source arranged in the gap at least partially, continuously providing a relative motion of the at least one energy source along the first border region and the second border region in the gap, and continuously pressing already heated sections of the first border region and the second border region onto each other.

A laser processing device includes: a light source configured to output laser light; a space light modulator for modulating the laser light output from the light source in accordance with a modulation pattern and outputting the modulated laser light; a converging lens for converging the laser light output from the space light modulator to an object, and forming a converging spot on the object; a movement unit for relatively moving the converging spot with respect to the object; and a control unit for relatively moving, while setting a position of the converging spot in a Z direction intersecting with an incident surface of the laser light on the object at a first Z position, the converging spot along a line extended in an X direction along the incident surface by controlling at least the space light modulator and the movement unit.

A 3-dimensional shaping apparatus manufactures a 3-dimensional shaped object. The 3-dimensional shaping apparatus includes a beam irradiation unit, a spatial light modulator, a splitting optical system, and a scanning unit. The beam irradiation unit emits a light beam. The spatial light modulator spatially modulates the light beam emitted by the beam irradiation unit at least on the first axis. The splitting optical system includes at least one lens array having a plurality of lenses arranged along the first axis and splits the light beam modulated by the spatial light modulator into a plurality of light beams by the lens array. The scanning unit scans the shaping material with the plurality of light beams from the splitting optical system.

A 3-dimensional shaping apparatus manufactures a 3-dimensional shaped object. The 3-dimensional shaping apparatus includes a beam irradiation unit, a spatial light modulator, a splitting optical system, and a scanning unit. The beam irradiation unit emits a light beam. The spatial light modulator spatially modulates the light beam emitted by the beam irradiation unit at least on the first axis. The splitting optical system includes at least one lens array having a plurality of lenses arranged along the first axis and splits the light beam modulated by the spatial light modulator into a plurality of light beams by the lens array. The scanning unit scans the shaping material with the plurality of light beams from the splitting optical system.

A method for machining a material using a pulsed laser includes introducing a sequence of laser pulses into the material for machining the material, and synchronizing a start of each sequence with a fundamental frequency of the laser. The sequence of laser pulses comprises at least two different sequence elements that are offset from one another in space and time. Each sequence element comprises an individual laser pulse, a specific succession of individual laser pulses, or a burst of laser pulses. Specific sequence element properties are impressed on each sequence element. The sequence element properties comprise a position of the laser focus of a respective sequence element. The position of the laser focus of each sequence element of the sequence is adapted for each sequence element.

A method for machining a material using a pulsed laser includes introducing a sequence of laser pulses into the material for machining the material, and synchronizing a start of each sequence with a fundamental frequency of the laser. The sequence of laser pulses comprises at least two different sequence elements that are offset from one another in space and time. Each sequence element comprises an individual laser pulse, a specific succession of individual laser pulses, or a burst of laser pulses. Specific sequence element properties are impressed on each sequence element. The sequence element properties comprise a position of the laser focus of a respective sequence element. The position of the laser focus of each sequence element of the sequence is adapted for each sequence element.

A method for separating a workpiece along a separation line by using laser pulses of a laser beam includes splitting the laser beam into a plurality of partial laser beams using a beam splitter optical unit, focusing the plurality of partial laser beams onto a surface of the workpiece and/or into a volume of the workpiece using a focusing optical unit, so that the plurality of partial laser beams are arranged next to one another and spaced apart from one another along the separation line, and ablating material of the workpiece along the separation line by introducing the laser pulses of the plurality of partial laser beams into the workpiece. The laser power per partial laser beam is adjusted depending on an ablation depth obtained in the workpiece.