A laser-machining device comprising a laser-radiation source to generate a laser beam and emit it along an optical path; a beam-splitting unit downstream of the laser-radiation source designed to split the laser beam into a bundle of partial beams; an optical control unit downstream of the beam-splitting unit comprising a reflective optical functional unit formed by an array of reflective microscanners, wherein the optical control unit is designed to select any desired number of partial beams in any desired spatial combination from the bundle of partial beams and direct them onto a workpiece, and to position and/or move at least one of those partial beams within a specified partial-beam scanning region of the respective partial beam using the microscanner of the array of microscanners assigned to the respective partial beam, and methods for laser machining a workpiece.

A laser-machining device comprising a laser-radiation source to generate a laser beam and emit it along an optical path; a beam-splitting unit downstream of the laser-radiation source designed to split the laser beam into a bundle of partial beams; an optical control unit downstream of the beam-splitting unit comprising a reflective optical functional unit formed by an array of reflective microscanners, wherein the optical control unit is designed to select any desired number of partial beams in any desired spatial combination from the bundle of partial beams and direct them onto a workpiece, and to position and/or move at least one of those partial beams within a specified partial-beam scanning region of the respective partial beam using the microscanner of the array of microscanners assigned to the respective partial beam, and methods for laser machining a workpiece.

A method of operating an apparatus for laser annealing, includes reducing temporal or spatial coherency of a plurality of laser beams by beam superimposing; and reducing an electric field inner product magnitude of beams having the reduced temporal or spatial coherency by a fly eye lens array to reduce coherency, and/or by modifying a polarization state between the beams by beam superimposing.

A device for heat treating a coating deposited on a substrate includes a treatment module opposite which the substrate runs, the treatment module including a laser source generating a laser beam of energy, a splitter module to split the beam into a multitude of secondary beams, having an energy En to treat the coating, that have the form of a point, a scanner allowing each secondary beam to be displaced in the running direction according to a first amplitude and first velocity and/or in a direction orthogonal to the running direction according to second amplitude and second velocity; and a displacement system to create, in operation, a relative displacement movement between the substrate and the or each treatment module.

A cleaning method involves, in a first step, emitting a first laser light toward the surface of a steel material targeted for cleaning to clean the surface of the steel material. Next, in a second step, a second laser light is emitted toward the surface of the steel material to remove an oxide layer formed on the surface of the steel material due to irradiation with the first laser light. In this step, the oxide layer formed on the surface of the steel material is removed, by emitting the second laser light at a power in a range that does not cause a new oxide layer to form on the surface of the steel material.

A semiconductor fabrication apparatus includes a source chamber being operable to generate charged particles; and a processing chamber integrated with the source chamber and configured to receive the charged particles from the source chamber. The processing chamber includes a wafer stage being operable to secure and move a wafer, and a laser-charged particles interaction module that further includes a laser source to generate a first laser beam; a beam splitter configured to split the first laser beam into a second laser beam and a third laser beam; and a mirror configured to reflect the third laser beam such that the third laser beam is redirected to intersect with the second laser beam to form a laser interference pattern at a path of the charged particles, and wherein the laser interference pattern modulates the charged particles by in a micron-zone mode for processing the wafer using the modulated charged particles.

A welding method includes: irradiating a surface of a workpiece with a laser light that moves relatively to the workpiece in a sweep direction; and performing welding by melting a part of the workpiece irradiated with the laser light. The laser light includes a plurality of beams, the plurality of beams include at least one main beam and at least one sub beam smaller in power than the main beam, a main power region including the at least one main beam and a sub power region including the at least one sub beam are formed on the surface, and a minimum distance between centers of adjacent ones of the plurality of beams on the surface is 75 μm or less.

Laser processing device (1) includes: laser-beam switching apparatus (70) that switches between a first optical path and a second optical path as an optical path along which a laser beam is to travel, the first optical path including first fiber (11), the second optical path including second fiber (21) that has a core diameter that is larger than a core diameter of first fiber (11); and processing head (80) that illuminates a same processed point on workpiece (900) with a laser beam that has passed through the first optical path or the second optical path. When illumination with laser beam that has passed through the first optical path is performed for a predetermined period of time, laser-beam switching apparatus (70) switches from the first optical path to the second optical path.

A system for welding a first component to a second component. The system includes a first laser head configured to emit a first laser beam and be movably disposable on a first side of the first component. The system further includes a second laser head configured to emit a second laser beam and be movably disposable on an opposing second side of the first component. The system further includes a controller configured to independently control a first power of the first laser beam and a second power of the second laser beam. The controller is also configured to independently and simultaneously control movement of the first laser head and movement of the second laser head relative to the first component.

A welding method includes: emitting a laser beam to a workpiece including a metal; and welding a portion of the workpiece to which the laser beam is emitted by melting. The laser beam includes a main power region and at least one auxiliary power region, power in the main power region is equal to or higher than power in each of the at least one auxiliary power region, and a power ratio of the power in the main power region and a total of the power in the at least one auxiliary power region is within a range of 144:1 to 1:1.