Patent classifications
B23K26/0823
Laser cutter adapted to cut rotating workpieces
A desktop laser cutter configured to cut a cylindrical workpiece includes a laser, a cutting head that receives an electromagnetic beam from the laser and emits a cutting beam, and a gantry that supports the cutting head relative to a base plate of the laser cutter housing. The gantry can be actuated to move the cutting head within a plane that is parallel to the baseplate. The cutting head emits the cutting beam in a direction parallel to the plane. In use, the cutting head is disposed side-by-side with the workpiece and the cutting beam is applied to a side of the workpiece that faces a sidewall of the laser cutter housing. The workpiece is supported by the gantry to rotate an amount that is a function of movement of the cutting head in a direction parallel to the plane.
METHOD FOR CORING AND SLICING A CVD DIAMOND PRODUCT AND APPARATUS FOR CARRYING IT OUT
The present disclosure relates to the field of Chemical Vapor Deposition (CVD) diamonds and their processing after fabrication. In particular, the present disclosures provides a method for coring and slicing a CVD diamond product, wherein the CVD diamond product comprises a CVD diamond and graphitized material covering several side-faces of the diamond. The method is carried out by an apparatus that provides a laser beam coupled into a fluid jet. The method comprises, for the coring, cutting the product with the laser beam to remove the graphitized material from the side-faces of the diamond. Further, the method comprises, for the slicing, cutting off one or more slices from the diamond with the laser beam.
LASER PROCESSING APPARATUS
A laser beam irradiation unit of a laser processing apparatus includes a laser oscillator that oscillates a laser, a Y-axis scanner that executes a high-speed scan with a laser beam emitted from the laser oscillator in a Y-axis direction, an X-axis scanner that executes processing feed of the laser beam emitted from the laser oscillator in an X-axis direction, and a beam condenser. The Y-axis scanner is selected from any of an AOD, a resonant scanner, and a polygon scanner and the X-axis scanner is selected from a galvano scanner and a resonant scanner.
ADDITIVE MANUFACTURING METHOD AND DEVICE
The invention relates to an additive manufacturing method in which a component (10, 42, 43, 44, 45) is produced in layers using an energy beam (8, 41, 58) which solidifies a starting material (4) and is irradiated by energy beam irradiating means (9, 22, 31, 38, 39, 55, 59, 61) while the starting material (4) is held by a base surface (3, 15, 30, 36, 52) arranged on a base element (2, 16, 29, 35, 51). While the starting material (4) is being irradiated with the energy beam (8, 41, 58), the base element (2, 16, 29, 35, 51) is moved by a rotational component which has a base element rotational axis, wherein the starting material (4) is held on the base surface (3, 15, 30, 36, 52) by a centrifugal acceleration generated by the rotational component. The invention is characterized in that a rotational movement is produced for at least some of the energy beam irradiating means (9, 22, 31, 38, 39, 55, 59, 61). Analogously, at least one energy beam rotational axis (46) is proposed for rotating at least some of the energy beam irradiating means (9, 22, 31, 38, 39, 55, 59, 61) in an additive manufacturing device in which the starting material (4) is held on a base surface (3, 15, 30, 36, 52) by a centrifugal acceleration.
MARKING MACHINE AND WAFER PRODUCTION SYSTEM
Provided that is a marking machine for applying markings to an ingot having separating layers formed at a depth corresponding to a thickness of a wafer to be produced. The marking machine includes a reading unit configured to read the ingot information formed on the ingot, a control unit having a storage section configured to store the ingot information read by the reading unit, and a marking unit configured to mark, based on the ingot information stored in the storage section, information that includes the ingot information, to the wafer to be produced.
Composite member and method for manufacturing composite member
A composite member is manufactured by a manufacturing method including adding, on a surface of a base member composed of a first material, a second material different from the first material, using additive manufacturing employing directed energy deposition as an additive manufacturing process. The manufacturing method is performed by placing the base member in a machining area of a machine tool configured to perform subtractive machining. Accordingly, a composite member can be obtained that is manufactured through additive manufacturing and that is in a state in which the composite member can be promptly machined.
Laser processing apparatus
A laser processing apparatus includes two chuck tables for holding workpieces on their holding surfaces, an X-axis feed unit for moving the chuck tables which are being arrayed in an X-axis direction, a laser beam applying unit for applying a laser beam to the workpiece on one at a time of the chuck tables to process the workpiece, and a pair of delivery areas arrayed in the X-axis direction on both sides of the laser beam applying unit, for delivering workpieces to and from the chuck tables. The laser beam applying unit includes a laser oscillator, a beam condenser, and a laser beam scanning unit for displacing a position where the laser beam is applied to the holding surface of the one of the chuck tables.
METHOD FOR DECORATIVELY MARKING GLASS ARTICLES AT HIGH TEMPERATURE BY LASER
The invention relates to a method for manufacturing a hollow glass article including a step of marking the hollow glass article thus formed by laser, the surface of the hollow glass article being at a temperature between 400° C. and 600° C. The marking step consists in making filiform decorations by producing at least one continuous and shiny groove on the surface of the hollow glass article.
LASER WELDING SYSTEM
A shift in position of a laser beam used for welding objects is corrected without need for intervention by a welder. An irradiator performs welding along a welding part of objects to be welded by relatively moving objects to be welded and a nozzle for emitting a laser beam. An arm apparatus movably holds the nozzle while applying a biasing force to the nozzle in a direction toward the welding part such that the nozzle comes into contact with objects to be welded to irradiate the welding part with the laser beam.
SUPPORTING DEVICE FOR A LASER PROCESSING MACHINE AND LASER PROCESSING MACHINE
A supporting device for supporting a workpiece for processing in a laser processing machine includes a base carrier having a guide body for fastening the supporting device in the laser processing machine, and a guide device provided on the base carrier for guiding the workpiece. The guiding device includes at least two guide elements, which are adjustable in distance to one another and on which the workpiece rests. The guide device has two slides, which are movable relative to the base carrier. At least one of the at least two guide elements is provided on each slide. The two slides are movable in coupled fashion, along two guides that are arranged at an angle to each other and are provided on the base carrier.