A system includes a robotic arm, a rotisserie control linkage, and a computer system. The robotic arm includes a touch probe and laser head. The rotisserie control linkage is configured to couple to a transport cart. The computer system is communicatively coupled to the robotic arm and the rotisserie control linkage and is configured to control the system to probe, using the touch probe of the robotic arm, a transparent outer layer of an aircraft canopy located on the transport cart in order to determine surface measurements of the aircraft canopy. The computer system also controls the system to ablate, using a plurality of predetermined parameters and the laser head of the robotic arm, an interface layer located between the transparent outer layer and the aircraft canopy, wherein movements of the robotic arm during the ablation are based on the surface measurements.

Analyte sensors and methods of manufacturing same are provided, including analyte sensors comprising multi-axis flexibility. For example, a multi-electrode sensor system 800 comprising two working electrodes and at least one reference/counter electrode is provided. The sensor system 800 comprises first and second elongated bodies E1, E2, each formed of a conductive core or of a core with a conductive layer deposited thereon, insulating layer 810 that separates the conductive layer 820 from the elongated body, a membrane layer deposited on top of the elongated bodies E1, E2, and working electrodes 802′, 802″ formed by removing portions of the conductive layer 820 and the insulating layer 810, thereby exposing electroactive surface of the elongated bodies E1, E2.

A laser processing apparatus and a stack processing apparatus are provided. The laser processing apparatus includes a laser oscillator and an optical system for forming a linear beam and an x-y-θ or x-θ stage. With use of the x-y-θ or x-θ stage, the object to be processed can be moved and rotated in the horizontal direction. With this operation, a desired region of the object to be processed can be efficiently irradiated with laser light, and the area occupied by a chamber provided with the x-y-θ or x-θ stage can be made small.

The invention relates to an apparatus for laser-deposition welding with multiple laser-deposition welding heads and to a method for operating such an apparatus comprising a laser-deposition welding unit with multiple laser-welding heads arranged thereon for the (quasi-) simultaneous depositing of material (M) onto a surface of a component and also comprising one or more conveying units for supplying the laser-deposition welding heads with the material (M) to be applied and further comprising one or more laser-radiation sources for supplying the laser-deposition welding heads with laser radiation (L) for carrying out the laser-deposition welding.

A laser lapping machine has a platform for supporting and rotating a product, and a laser device for transmitting a laser beam onto the surface of the product. The product may contain polycrystalline diamond, and the platform and the laser device may be configured to move a cutting point along a spiral path across the product surface. A process for removing material, such as polycrystalline diamond material, from a surface of a product is also described. The process includes transmitting a laser beam onto the product surface to remove the material at a cutting point, rotating the product surface relative to the laser beam, and causing the cutting point to move in a radial direction. According to one aspect of the present disclosure, rotation of the platform and radial movement of the laser beam cause the cutting point to move along a spiral path across the product surface.

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

A system includes an orientation determination system comprising a camera where the camera is configured to capture an image of an orientation feature of a physical dental model of a dental arch of a customer with material thermoformed thereon. The orientation determination system is configured to identify an offset of the physical dental model with respect to a fixture plate during positioning or before or after the physical dental model is positioned on the fixture plate by determining an actual orientation of the physical dental model based on the orientation feature. The system also includes a laser trimming system configured to cut the material along a trim line based on the identified offset while the fixture plate is moved about at least two axes to produce a dental aligner specific to the customer and being configured to reposition one or more teeth of the customer.

A method of forming a build in a powder bed includes providing a first diode laser fiber array and a second diode laser fiber array, emitting a plurality of laser beams from selected fibers of the second diode laser fiber array onto the powder bed, corresponding to a pattern of a layer of the build, simultaneously melting powder in the powder bed corresponding to the pattern of the layer of the build, scanning a first diode laser fiber array along an outer boundary of the powder bed and emitting a plurality of laser beams from selected fibers of the first diode laser fiber array and simultaneously melting powder in the powder bed corresponding to the outer boundary of the layer of the build to contour the layer of the build. An apparatus for forming a build in a powder bed including a first diode laser fiber array and a second diode laser fiber array is also disclosed. The first diode laser fiber array configured to contour the layer of the build.

A method of preparing an elongate web of sheet material for dividing into discrete stacks of web portions after reeling the web onto a drum is provided. The method includes forming transverse discontinuities in the web at spaced intervals corresponding to edges of the discrete stacks to be formed, the intervals progressively increasing along the web so that the discontinuities form angularly-aligned groups when reeled onto the drum.

A substrate processing method of transcribing, in a combined substrate in which a first substrate and a second substrate are bonded to each other, a device layer formed on a surface of the second substrate to the first substrate is provided. A laser beam is radiated in a pulse shape from a rear surface side of the second substrate to a laser absorption layer formed between the second substrate and the device layer.