One aspect is a device for processing a filament in a process stream, including at least one processing beam source, designed and arranged for emitting at least one processing beam which is suitable for processing a segment of the filament by interaction of the at least one processing beam with the segment of the filament, thereby obtaining a processed filament. The device includes a guide, including a filament feed which is arranged upstream of the at least one processing beam source, and is designed to feed the filament from a feed reel. The guide is designed and arranged to guide the filament so that during the processing the segment of the filament inclines an angle with a vertical axis in the range from 0 to 45°.

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface includes forming a cooling hole inlet at the first wall surface, forming a cooling hole outlet at the second wall surface, forming a metering section downstream from the inlet and forming a multi-lobed diffusing section between the metering section and the outlet. The inlet, outlet, metering section and multi-lobed diffusing section are formed by laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof.

A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface includes forming a cooling hole inlet at the first wall surface, forming a cooling hole outlet at the second wall surface, forming a metering section downstream from the inlet and forming a multi-lobed diffusing section between the metering section and the outlet. The inlet, outlet, metering section and multi-lobed diffusing section are formed by laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof.

A laser patterning apparatus for a three-dimensional object includes a laser generator, a beam expander configured to adjust a size of a laser beam generated by the laser generator, a dynamic focusing module configured to adjust a z-axis focus position of the laser beam passing through the beam expander, a scan head configured to adjust x- and y-axis focus position of the laser beam passing through the beam expander, a shape recognizer configured to recognize a shape of a three-dimensional object, and a controller configured to extract x-, y-, and z-axis data of the three-dimensional object and to control the scan head and the dynamic focusing module, in order to pattern the three-dimensional object with the laser beam.

A method of laser welding a workpiece stack-up that includes at least two overlapping metal workpieces is disclosed. The method includes advancing a beam spot of a laser beam relative to a top surface of the workpiece stack-up and along a beam travel pattern to form a laser weld joint, which is comprised of resolodified composite metal workpiece material, that fusion welds the metal workpieces together. And, while the beam spot is being advanced along the beam travel pattern, between a first point and a second point, which may or may not encompass the entire beam travel pattern, at least one of the following laser beam parameters is repeatedly varied: (1) the power level of the laser beam; (2) the travel speed of the laser beam; or (3) the focal position of the laser beam relative to the top surface of the workpiece stack-up.

A semiconductor fabrication apparatus includes a source chamber being operable to generate charged particles; and a processing chamber integrated with the source chamber and configured to receive the charged particles from the source chamber. The processing chamber includes a wafer stage being operable to secure and move a wafer, and a laser-charged particles interaction module that further includes a laser source to generate a first laser beam; a beam splitter configured to split the first laser beam into a second laser beam and a third laser beam; and a mirror configured to reflect the third laser beam such that the third laser beam is redirected to intersect with the second laser beam to form a laser interference pattern at a path of the charged particles, and wherein the laser interference pattern modulates the charged particles by in a micron-zone mode for processing the wafer using the modulated charged particles.

A removable image-capture apparatus (200) comprises an opening (202) intended to receive a calibration plate (10) bearing a reference marking (30) and possibly a test marking (40). The apparatus (200) comprises a source (204) of backlighting visible light situated beneath the opening (202), a sensor (205) for acquiring an image, in the backlighting visible light, of the plate (10), a guiding and supporting device (206) for positioning the sensor (205) above the opening (202) relative to the surround (201), a calculation device (207) configured to analyze the image, recognize the marking (30) and possibly the marking (40) in the image, and calculate aiming-command corrections intended for a firing system firing a powerful incident-radiation beam, which system belongs to an additive manufacturing apparatus, distinct and separate from the apparatus (200).

A laser processing system includes: a first light irradiator including: a first light emitter to emit first laser light; and a first light scanner to scan a first region of a workpiece with the first laser light emitted from the first light emitter; a second light irradiator including: a second light emitter to emit second laser light; and a second light scanner to scan a second region different from the first region of the workpiece with the second laser light emitted from the second light emitter. The first light irradiator emits the first laser light to the first region of the workpiece in a first irradiation direction, the second light irradiator emits the second laser light to the second region of the workpiece in a second irradiation direction opposite to the first irradiation direction.

A manual laser cleaning device for removing foreign matter present on the surface of a workpiece according to an embodiment includes a laser generator oscillating a laser beam, a controller controlling the laser generator, and a laser cleaning head receiving the laser beam emitted from the laser generator through an optical fiber and irradiating a surface of a workpiece with the received laser beam. The laser cleaning head includes a head housing having a handle, a collimator placed in the head housing and collimating the laser beam scattered at one end of the optical fiber into parallel light, a high-speed Galvano scanner scanning the laser beam transmitted through the collimator at high speed using a mirror mounted on a scanning motor, and a focal lens focusing the laser beam scanned by the high-speed Galvano scanner at a focal distance and irradiating the surface of the workpiece with the laser beam.