A system includes a robotic arm, a rotisserie control linkage, and a computer system. The robotic arm includes a touch probe and laser head. The rotisserie control linkage is configured to couple to a transport cart. The computer system is communicatively coupled to the robotic arm and the rotisserie control linkage and is configured to control the system to probe, using the touch probe of the robotic arm, a transparent outer layer of an aircraft canopy located on the transport cart in order to determine surface measurements of the aircraft canopy. The computer system also controls the system to ablate, using a plurality of predetermined parameters and the laser head of the robotic arm, an interface layer located between the transparent outer layer and the aircraft canopy, wherein movements of the robotic arm during the ablation are based on the surface measurements.

A method and an apparatus for collecting powder samples in real-time in powder bed fusion additive manufacturing may involves an ingester system for in-process collection and characterizations of powder samples. The collection may be performed periodically and uses the results of characterizations for adjustments in the powder bed fusion process. The ingester system of the present disclosure is capable of packaging powder samples collected in real-time into storage containers serving a multitude purposes of audit, process adjustments or actions.

The cutting station (1) for profiled elements, particularly for window and door frames, comprises one basic structure (2), one line of movement (3, 4) of one profiled element (P) associated with the basic structure (2) and adapted to move the profiled element (P) along a direction of movement (D) in order to displace it with respect to the basic structure (2), and one cutting assembly (5) associated with the basic structure (2), arranged along the direction of movement (D) and adapted to cut the profiled element (P) according to at least one angle of width comprised between 10° and 170° with respect to the longitudinal direction to obtain at least two portions of profiled element (P1, P2), wherein the station (1) comprises one laser marking assembly (22) associated with said basic structure (2) and adapted to emit one laser beam (R) towards the profiled element (P) in order to engrave one identification mark on the profiled element itself.

A method for treating a coating on a scrolling substrate by a treatment unit generating a laser beam, the method including producing a pattern including several lines or portions extending in the scrolling direction and/or the direction orthogonal to the scrolling direction, the pattern being repeated to cover treat the surface of the substrate.

A device for heat treating a coating deposited on a substrate includes a treatment module opposite which the substrate runs, the treatment module including a laser source generating a laser beam of energy, a splitter module to split the beam into a multitude of secondary beams, having an energy En to treat the coating, that have the form of a point, a scanner allowing each secondary beam to be displaced in the running direction according to a first amplitude and first velocity and/or in a direction orthogonal to the running direction according to second amplitude and second velocity; and a displacement system to create, in operation, a relative displacement movement between the substrate and the or each treatment module.

A device for heat treating a coating deposited on a substrate includes a treatment module opposite which the substrate runs, the treatment module including a laser source generating a laser beam of energy, a splitter module to split the beam into a multitude of secondary beams, having an energy En to treat the coating, that have the form of a point, a scanner allowing each secondary beam to be displaced in the running direction according to a first amplitude and first velocity and/or in a direction orthogonal to the running direction according to second amplitude and second velocity; and a displacement system to create, in operation, a relative displacement movement between the substrate and the or each treatment module.

A joining method includes: an overlapping step of overlapping a front surface of a first metal member with a back surface of a second metal member; and a welding step of welding the first metal member with the second metal member by hybrid welding, with use of a hybrid welding machine including a leading laser welding unit and a trailing arc welding unit. In the welding step, laser welding, by irradiating a laser beam, and arc welding are performed, along a preset travel route set on an inner corner portion formed by the front surface of the first metal member and an end surface of the second metal member, to the inner corner portion and the laser beam is oscillated to cross the preset travel route.

The present invention discloses a solder paste laser induced forward transfer device and method. The device comprises a laser, a beam shaping module, an optical path adjustment module, a solder paste transfer module and a computer control system, wherein the laser is connected to the beam shaping module, followed by the optical path adjustment module, and the solder paste transfer module is located below the optical path adjustment module. The beam shaping module comprises a beam expanding lens, an aperture, a flat-top beam shaper and a spatial light modulator. The optical path adjustment module comprises a two-dimensional galvanometer and an f-θ lens. The solder paste transfer module consists of a transparent substrate, a solder paste film, a clamp, a Z-axis lifting table, a receiving substrate, and an XYZ precise moving platform. The computer control system consists of a computer and drivers of other devices. The device and method can achieve mask-free, non-contact and high-precision solder paste transfer, thereby greatly shortening the production cycle and reducing the production cost.

A semiconductor mold laser cleaning device of an embodiment includes a laser generator oscillating a pulsed laser beam, an optical fiber transmitting the laser beam, a laser scanning module processing and transmitting the laser beam received through the optical fiber for cleaning the semiconductor mold, the laser scanning module including a laser beam collimator converting the laser beam scattered at one end of the optical fiber into parallel light, a Galvano laser scanner scanning the laser beam, a focal lens focusing the laser beam scanned by the Galvano laser scanner, and a final irradiation mirror redirecting the laser beam passed through the focal lens to deliver the redirected laser beam to the surface of the semiconductor mold, and a conveyance unit conveying the laser scanner module in an X-axis direction and/or a Y-axis direction such that the entire surface of the semiconductor mold can be cleaned.

A semiconductor mold laser cleaning device of an embodiment includes a laser generator oscillating a pulsed laser beam, an optical fiber transmitting the laser beam, a laser scanning module processing and transmitting the laser beam received through the optical fiber for cleaning the semiconductor mold, the laser scanning module including a laser beam collimator converting the laser beam scattered at one end of the optical fiber into parallel light, a Galvano laser scanner scanning the laser beam, a focal lens focusing the laser beam scanned by the Galvano laser scanner, and a final irradiation mirror redirecting the laser beam passed through the focal lens to deliver the redirected laser beam to the surface of the semiconductor mold, and a conveyance unit conveying the laser scanner module in an X-axis direction and/or a Y-axis direction such that the entire surface of the semiconductor mold can be cleaned.