A laser processing system includes: a first light irradiator including: a first light emitter to emit first laser light; and a first light scanner to scan a first region of a workpiece with the first laser light emitted from the first light emitter; a second light irradiator including: a second light emitter to emit second laser light; and a second light scanner to scan a second region different from the first region of the workpiece with the second laser light emitted from the second light emitter. The first light irradiator emits the first laser light to the first region of the workpiece in a first irradiation direction, the second light irradiator emits the second laser light to the second region of the workpiece in a second irradiation direction opposite to the first irradiation direction.

A foreign substance capturing apparatus according to an embodiment of the present invention may comprise: a capturing body unit having an inlet port for introducing the air including magnetic foreign substances and an outlet port for discharging the air from which the magnetic foreign substances have been removed; and a magnetic isolation unit connected to the capturing body unit, including a magnetic member for isolating, by an attractive force, the magnetic foreign substances from the air flowing in the capturing body unit, and provided with a non-magnetic member surrounding the magnetic member.

A glass sheet processing apparatus includes a first gantry assembly that extends across a glass sheet in a cross-machine direction. The first gantry assembly includes a processing head that moves along a length of the first gantry assembly and includes a laser comprising an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A second gantry assembly extends across the glass sheet in the cross-machine direction. The second gantry assembly includes a processing head that moves along a length of the second gantry assembly.

The invention relates to a method for producing blanks from paper, cardboard, paperboard, corrugated cardboard, or plastic. The method according to the invention does not process panels or sheets into blanks in a multistage process but rather produces the blanks directly from the material web i.e. the corrugated cardboard web or from the paper, paperboard, plastic or cardboard web. The machining process is scalable. Advantageously, the method according to the invention can be adjusted in terms of the required production or packaging quantity by the juxtaposition of additional processing centers in terms of production speed and quantity.

A roof laser brazing system comprises a side home position jig installed at each of opposite sides of the transferring path of the body in the brazing section, a roof-pressing jig detachably mounted on a handling robot, docked to the side home position jig, and that home-positions and presses the roof panel loaded on the opposite side panels, a brazing assembly mounted on at least one brazing robot in the side home position jig side and that brazes bonding portions between the opposite side panels and the roof panel using a laser as a heat source, and a grinding assembly mounted on the at least one grinding robot in the grinding section and that grinds brazing beads of the bonding portions between the opposite side panels and the roof panel.

A cutting device includes: a conveyance unit that conveys a continuous body of a plurality of electrode plates; a laser scanning unit that scans the continuous body with laser light; and a control unit that controls the laser scanning unit. The control unit controls a laser scanning unit so as to scan the continuous body while performing intermit irradiation with laser light, thereby forming a plurality of unit cutting sections that are continuous and dividing the continuous body into a first portion and a second portion. The unit cutting sections have a main line section extending along the boundary of the first portion and the second portion, and a bent section that bends and extends from an end of the main line section.

A glass sheet processing apparatus includes a first gantry assembly that extends across a glass sheet in a cross-machine direction. The first gantry assembly includes a processing head that moves along a length of the first gantry assembly and includes a laser comprising an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A second gantry assembly extends across the glass sheet in the cross-machine direction. The second gantry assembly includes a processing head that moves along a length of the second gantry assembly.

A laser processing apparatus includes: a light emitter to emit laser light; a light scanner configured to scan a workpiece in a scanning direction with the laser light emitted from the light emitter, to process the workpiece; and a conveyor to convey the workpiece to a scanning area scanned by the light scanner in a conveying direction orthogonal to the scanning direction, a longitudinal direction of the scanning area is in the scanning direction.

A manufacturing method and a manufacturing apparatus for a separator layer-coated electrode are provided capable of shortening the time required to cut out a separator layer-coated electrode with a laser beam. In a cutting process, a laser beam is irradiated to a laser irradiation target portion of a strip-shaped separator layer-coated electrode from a front-side separator layer side to cut a strip-shaped separator layer-coated electrode. Prior to the cutting process, a preheating process is conducted to preheat the front-side separator layer in the laser irradiation target portion.

A laser compression bonding device and method for a semiconductor chip are proposed. The device includes a conveyor unit that transports a semiconductor chip and a substrate, and a bonding head that includes a bonding tool for applying a pressure to the chip and substrate, a laser beam generator for emitting a laser beam, a thermal imaging camera for measuring temperatures of the surfaces of semiconductor chip and substrate, and a compression unit for controlling a pressure applied by the bonding tool and a position thereof, wherein the compression unit includes a mount on which the bonding tool is detachably mounted, and a servo motor and a load cell that apply a pressure to the mount or control a position thereof. The servo motor is controlled with two values for pressure application and positioning.