Provided that is a marking machine for applying markings to an ingot having separating layers formed at a depth corresponding to a thickness of a wafer to be produced. The marking machine includes a reading unit configured to read the ingot information formed on the ingot, a control unit having a storage section configured to store the ingot information read by the reading unit, and a marking unit configured to mark, based on the ingot information stored in the storage section, information that includes the ingot information, to the wafer to be produced.

A laser engraver comprises a generally rectangular housing with an open bottom adapted to rest on supports provided at the top plane of an open carriage. Thumb wheel screws operating in fixed nuts on the left and right sides of the laser housing and resting on supports at the top plane of the carriage allow the laser housing can be raised, lower and tilted. A plate can be removably and adjustably mountable within the housing directly under the laser for carrying smaller objects. A cart capable of carrying objects to be engraved can be moved into the space between the carriage side panels and is provided with height and level adjustments to support an object to be engraved by the laser when the removable plate is taken out of the laser housing.

A method for connecting two components with the aid of a laser weld seam. The two components are situated one above the other in a joining area. The first component is pressed in the direction of the second component with the aid of a clamping device. A laser beam impacts the first component on the side facing away from the second component and at least indirectly fusing material of the two components.

A laser processing apparatus includes two chuck tables for holding workpieces on their holding surfaces, an X-axis feed unit for moving the chuck tables which are being arrayed in an X-axis direction, a laser beam applying unit for applying a laser beam to the workpiece on one at a time of the chuck tables to process the workpiece, and a pair of delivery areas arrayed in the X-axis direction on both sides of the laser beam applying unit, for delivering workpieces to and from the chuck tables. The laser beam applying unit includes a laser oscillator, a beam condenser, and a laser beam scanning unit for displacing a position where the laser beam is applied to the holding surface of the one of the chuck tables.

A method for shaping a thin-film photovoltaic cell module from a photovoltaic cell sheet according to a predetermined contour of the module, where the cell sheet includes a flexible substrate based on a polymer or metal foil and a photovoltaic stack including one or more photo-active layers arranged on a front surface of the substrate. The method includes: providing the cell sheet, directing a laser beam towards a rear surface of the substrate; creating, by the laser beam, a trench in the rear surface, the trench shaped according to the contour such that the cell sheet is “divided” in a first portion within the contour and a second portion outside the contour; affixing a handling tool to one of the portions of the cell sheet on the rear surface of the substrate; selectively separating the portions by displacing the handling tool and one portion relative to the other portion.

Energy is locally supplied to a cutting surface that is formed in an outer circumferential region of a wafer in a trimming step, before a grinding step of grinding the wafer. This can remove or repair at least part of a damage layer formed in the outer circumferential region of the wafer due to the trimming step. As a result, breakage of the wafer that originates from the outer circumferential region in the grinding of the wafer which has been subjected to the edge trimming and generation of dust in a step after this grinding can be suppressed.

A machine for separative machining of a plate-shaped workpiece that has: a first movement unit for moving the workpiece in a first direction (X); a second movement unit for moving a machining head for the separative machining in a second direction (Y); and two workpiece bearing faces for bearing the workpiece. A gap that extends along the second direction (Y) is formed between the workpiece bearing faces. The machine has a push-out unit having a push-out element, wherein the push-out element is movable at least in the second direction (Y) within the gap so as to press, at a predefined push-out position (AP), against a workpiece part that was cut free from the workpiece during separative machining. The disclosure further relates to methods for pushing out a workpiece part which, in particular, was cut free on such a machine.

A processing apparatus includes a delivery unit for delivering a workpiece between a cassette placed on a cassette rest and a chuck table and a measuring unit for measuring a thickness of the workpiece. The delivery unit includes a base having a non-contact-type suction holder for ejecting air to develop a negative pressure to attract and hold the workpiece under suction out of contact therewith, and a moving unit for moving the base. The height of the non-contact-type suction holder is adjusted according to the thickness of the workpiece measured by the measuring unit to place the non-contact-type suction holder in a position that is spaced from a face side of the workpiece by a distance in a predetermined range while the workpiece is being delivered by the delivery unit.

A processing apparatus processes an object by irradiating the object with a processing light, and includes: a combining optical system that combines an optical path of the processing light from the processing light source and an optical path of a first measurement light from a measurement light source; an irradiation optical system that irradiates the object with processing light and the first measurement light through the combining optical system; a position change apparatus that changes a position of the irradiation optical system relative to the object; an imaging apparatus a position of which is changed together with the irradiation optical system and which captures an image of the object; and a detection apparatus that detects, through the irradiation optical system and the combining optical system, a second measurement light generated from the object due to the first measurement light with which the object is irradiated through the irradiation optical system.

An apparatus for manufacturing a display device and a method for manufacturing a display device are provided. The apparatus includes a stage; a laser module disposed above the stage and configured to output a laser beam; a scanner configured to receive the laser beam output from the laser module and irradiate the laser beam onto the stage; and a controller configured to control the laser module to irradiate the laser beam to a processing position while moving both the scanner and the stage in a first direction according to the processing position and a shape of a processing pattern.