A semiconductor mold laser cleaning device of an embodiment includes a laser generator oscillating a pulsed laser beam, an optical fiber transmitting the laser beam, a laser scanning module processing and transmitting the laser beam received through the optical fiber for cleaning the semiconductor mold, the laser scanning module including a laser beam collimator converting the laser beam scattered at one end of the optical fiber into parallel light, a Galvano laser scanner scanning the laser beam, a focal lens focusing the laser beam scanned by the Galvano laser scanner, and a final irradiation mirror redirecting the laser beam passed through the focal lens to deliver the redirected laser beam to the surface of the semiconductor mold, and a conveyance unit conveying the laser scanner module in an X-axis direction and/or a Y-axis direction such that the entire surface of the semiconductor mold can be cleaned.

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

The invention relates to machines and methods for the separative machining of a plate-shaped workpieces. The machine includes a first movement device for moving the workpiece in a first direction (X), a second movement device for moving a machining head, which directs the machining beam onto the workpiece, along a second direction (Y), Between workpiece bearing faces there is formed a gap for the passage of the machining beam. In the machine, mutually facing side edges of at least two of the workpiece bearing faces are oriented non-perpendicularly and non-parallel with respect to the first direction (X).

A laser processing apparatus includes a laser oscillator that emits a laser beam, a beam condenser that condenses the laser beam emitted by the laser oscillator and positions the condensed point to a wafer, a condensed point position adjuster that is disposed between the laser oscillator and the beam condenser and adjusts the position of the condensed point, and an upper surface position detector that detects the upper surface position of the wafer. The upper surface position detector includes a detection light source that emits detection light of a wide wavelength band and a selector that selects detection light with a specific wavelength from the detection light emitted by the detection light source.

A desktop laser cutter configured to cut a cylindrical workpiece includes a laser, a cutting head that receives an electromagnetic beam from the laser and emits a cutting beam, and a gantry that supports the cutting head relative to a base plate of the laser cutter housing. The gantry can be actuated to move the cutting head within a plane that is parallel to the baseplate. The cutting head emits the cutting beam in a direction parallel to the plane. In use, the cutting head is disposed side-by-side with the workpiece and the cutting beam is applied to a side of the workpiece that faces a sidewall of the laser cutter housing. The workpiece is supported by the gantry to rotate an amount that is a function of movement of the cutting head in a direction parallel to the plane.

Provided is a technique for fabricating a powder material bedded in advance using a DED nozzle. According to one embodiment, there is provided an AM apparatus for manufacturing a fabricated object. The AM apparatus includes a DED nozzle. The DED nozzle includes: a DED nozzle main body; a laser port disposed at a distal end of the DED nozzle main body and for emitting a laser beam, and a laser passage configured to communicate with the laser port and for allowing the laser beam to pass through the DED nozzle main body; and a powder port disposed at the distal end of the DED nozzle main body and for emitting a powder material, and a powder passage configured to communicate with the powder port and for allowing the powder material to pass through the DED nozzle main body. The AM apparatus further includes a cover configured to surround a peripheral area of the laser port and the powder port of the DED nozzle. The cover is configured to have an opened downstream side in an emission direction of the laser beam. The cover includes a gas supply passage for supplying a gas inside the cover. The gas supply passage is configured to be oriented so as to guide the gas toward the DED nozzle main body.

A beam vibrating mechanism vibrates a laser beam in a parallel direction with a cutting advancing direction of a sheet metal. An amplitude amount of the laser beam is Qx, a radius of a first circular region having an area occupying 86% beam energy at a center side of total beam energy in a sectional area of the laser beam on a top surface of the sheet metal is rtop, and a radius of a second circular region having an area occupying 86% beam energy at a center side of total beam energy in a sectional area of the laser beam in a bottom surface of the sheet metal is rbottom. A calculation value Va is expressed by the expression: Va=(Qx+rtop+√{square root over (2)}×rbottom). When a standard deviation of the calculation value Va at a time of cutting sheet metals of a plurality of plate thicknesses is Vasd, a nozzle having a diameter of an opening between a minimum value obtained by 2Va−Vasd, and a maximum value obtained by 2.5 Va+Vasd is used as a nozzle attached to a machining head.

The invention relates to an additive manufacturing method in which a component (10, 42, 43, 44, 45) is produced in layers using an energy beam (8, 41, 58) which solidifies a starting material (4) and is irradiated by energy beam irradiating means (9, 22, 31, 38, 39, 55, 59, 61) while the starting material (4) is held by a base surface (3, 15, 30, 36, 52) arranged on a base element (2, 16, 29, 35, 51). While the starting material (4) is being irradiated with the energy beam (8, 41, 58), the base element (2, 16, 29, 35, 51) is moved by a rotational component which has a base element rotational axis, wherein the starting material (4) is held on the base surface (3, 15, 30, 36, 52) by a centrifugal acceleration generated by the rotational component. The invention is characterized in that a rotational movement is produced for at least some of the energy beam irradiating means (9, 22, 31, 38, 39, 55, 59, 61). Analogously, at least one energy beam rotational axis (46) is proposed for rotating at least some of the energy beam irradiating means (9, 22, 31, 38, 39, 55, 59, 61) in an additive manufacturing device in which the starting material (4) is held on a base surface (3, 15, 30, 36, 52) by a centrifugal acceleration.

A tooling system, such as an additive manufacturing system, includes a tool displacement mechanism mounted on a fixed structure and carrying a system tool such as a printhead. The tool displacement mechanism displaces the system tool along a curvilinear closed path about a system axis and located within a working plane intersecting the system axis. A bed, connecting to the fixed structure, is substantially positioned within the working plane, locally adjacent the closed path and along at least a portion of the closed path.

A device for moving at least one cutting and welding arrangement able to cut, then weld a tail of a first metal strip to a head of a second metal strip, includes at least one first carriage holding at least one welding head. The first carriage is movable over a guide path following a first course across a transverse strip region. At least one second carriage is movable separately from the first carriage and holds a cutting head. The second carriage is movable on a guide path following a second course. The welding head is used exclusively for a welding mode, the second carriage is used exclusively for a cutting mode and the two carriages have parked positions on either side of the tail and head widths of the strips. A welding method which is associated with the device is also provided.