B23K26/128

Laser cutter adapted to cut rotating workpieces
11559856 · 2023-01-24 · ·

A desktop laser cutter configured to cut a cylindrical workpiece includes a laser, a cutting head that receives an electromagnetic beam from the laser and emits a cutting beam, and a gantry that supports the cutting head relative to a base plate of the laser cutter housing. The gantry can be actuated to move the cutting head within a plane that is parallel to the baseplate. The cutting head emits the cutting beam in a direction parallel to the plane. In use, the cutting head is disposed side-by-side with the workpiece and the cutting beam is applied to a side of the workpiece that faces a sidewall of the laser cutter housing. The workpiece is supported by the gantry to rotate an amount that is a function of movement of the cutting head in a direction parallel to the plane.

MULTI-AXIS MACHINE TOOL, METHODS OF CONTROLLING THE SAME AND RELATED ARRANGEMENTS
20220410315 · 2022-12-29 ·

Varied embodiments of a laser-based machine tool, and techniques for controlling the same are provided. Some embodiments relate to techniques to facilitate uniform and reproducible processing of workpieces. Other embodiments relate to a zoom lens having a quickly-variable focal length. Still other embodiments relate to various features of a laser-based multi-axis machine tool that can facilitate efficient delivery of laser energy to a scan head, that can address thermomechanical issues that may arise during workpiece processing, etc. Another embodiment relates to techniques for minimizing or preventing undesired accumulation of particulate matter on workpiece surfaces during processing. A number of other embodiments and arrangements are also detailed.

Laser peening processing apparatus
11534866 · 2022-12-27 · ·

According to one implementation, a laser peening processing apparatus includes a laser oscillator and an irradiation system. The laser oscillator oscillates a laser light. The irradiation system condenses the laser light with a lens and irradiates a workpiece with the condensed laser light. The irradiation system irradiates the workpiece with the laser light in a state where the workpiece has been exposed in an atmosphere without interposed liquid. Furthermore, according to one implementation, a laser peening processing method includes producing a product or a semi-product by laser peening processing of the workpiece using the above-mentioned laser peening processing apparatus.

LASER PROCESSING APPARATUS
20220379403 · 2022-12-01 ·

A laser beam applying unit in a laser processing apparatus includes a laser oscillator for emitting a laser beam, a beam condenser for focusing the laser beam emitted from the laser oscillator and applying the focused laser beam to a workpiece held on a holding table, and a scanning unit that is disposed on an optical path of the laser beam between the laser oscillator and the beam condenser and that has scanning mirrors for scanning the laser beam and guiding the scanned laser beam toward the beam condenser. The scanning mirrors are housed in a chamber having a first window for allowing the laser beam emitted from the laser oscillator to pass therethrough to the scanning mirrors and a second window for allowing the laser beam scanned by the scanning mirrors to pass therethrough to the beam condenser.

ELECTROMAGNETIC RADIATION SYSTEM
20220371129 · 2022-11-24 ·

An electromagnetic radiation system (100) for directing an electromagnetic radiation beam at a target (130). The electromagnetic radiation system comprises an electromagnetic radiation source (110) for providing the electromagnetic radiation beam, a head (120) for projecting the electromagnetic radiation beam on to the target (130); and an umbilical assembly (140) connecting the electromagnetic radiation source (110) to the head (120) and configured to transmit the electromagnetic radiation beam to the head. The electromagnetic radiation system further comprises an optical isolator (150) positioned between the electromagnetic radiation source (110) and the umbilical assembly (140).

Method for providing a flow for an additive manufacturing device
11504772 · 2022-11-22 · ·

In a method of providing a flow for a process chamber of a device for producing a three-dimensional object by layer-wise application and selective solidification of a building material in a build area a process gas is supplied to the process chamber in a lower altitude region of the process chamber, wherein the process chamber includes a gas inlet for introducing the process gas into the process chamber and a gas outlet for discharging the process gas from the process chamber. The gas inlet and the gas outlet are provided in the lower altitude region of the process chamber and the process gas flows in a main flow from the gas inlet to the gas outlet, and wherein a secondary flow is located in a sub-region of the lower altitude region, which sub-region is located above a bottom surface of the process chamber surrounding the build area.

LASER GRAVITY HEATING
20220364446 · 2022-11-17 · ·

A method to produce in-situ steam comprising the steps of producing a laser beam in a steam generator segment positioned in a wellbore in a formation; introducing the laser beam to an activated carbon container, where the activated carbon container comprises activated carbon; increasing a temperature of the activated carbon with the laser beam to produce a hot activated carbon; introducing water to the activated carbon container through a water supply line; producing steam in the activated carbon container when the water contacts the hot activated carbon; increasing pressure in the activated carbon container as steam is produced until a pressure set point of an inter-container valve is reached; releasing steam through the inter-container valve to a steam container; increasing a pressure in the steam container until a release set point of one or more release valves is reached; and releasing steam through the release valve to the formation.

Welding method
11583954 · 2023-02-21 · ·

A welding method according to an embodiment includes a preparation process and a welding process. A first welding material and a second welding material are prepared in the preparation process. The first welding material and the second welding material are welded in the welding process by irradiating a laser beam on at least one of the first welding material or the second welding material. At least one of the first welding material or the second welding material includes a first portion and a second portion. A laser absorptance of the second portion is higher than a laser absorptance of the first portion. The first welding material and the second welding material are welded in the welding process by irradiating the laser beam on the second portion.

LASER PROCESSING HEAD HAVING CONTAMINATION RESISTANCE

A laser processing head for directing a laser beam includes two reflectors and a sole lens element. The first reflector disposed in a housing's interior reflects the laser beam from a source to the second reflector, which then reflects the laser beam toward a process zone for a workpiece. The single lens element is disposed in the housing's interior between the reflectors. The lens element can be moved to adjust a focal position of the laser beam beyond the housing's outlet. To reduce contamination, one or more nozzles are configured to direct purge gas across one or more of the first reflector, the second reflector, and the lens element, while one or more collection areas disposed in the interior are configured to collect contamination directed from the purge gas.

Laser processing head and laser processing system using same

Laser processing head (20) of the present disclosure includes housing (30), transparent protector (40), and temperature sensor (70). Housing (30) includes an optical path of processing laser light (LB). Transparent protector (40) is detachably fixed to housing (30), passes processing laser light (LB), and suppresses dust of work material (W) entering into housing (30). Here, the dust is generated from the work material (W) irradiated with processing laser light (LB). Temperature sensor (70) detects the temperature of transparent protector (40).